MEMS

Membranes

IMS CHIPS manufactures membranes in various forms and sizes made from various materials. Structuring is possible directly in the membrane ("Stencil mask") or in the case of Si3N4 membranes in a thin Cr absorber layer ("absorber mask").
For more information, please go to Fields of activity - MEMS - Membranes

Micromechanic components

Based on our silicon deep etching technologies we offer multi-functional micromechanic components. This way structures as small as 50 nm with an aspect ratio of 1:50 can be realized. An etching through the entire substrate is also possible. Furthermore, a structuring of the silicon on several levels with a clamping surface accuracy of ± 25 nm (3δ) is feasible.
For more information, please go to Fields of Activity - MEMS - Mikromechanische Komponenten

Micro electric mechanic systems

IMS CHIPS has developed technologies that post-process finished CMOS chips with add-on steps. These include: deep silicon etching, the selective thinning of components areas to membranes or layer thining and structuring. These steps can be carried out on foundry as well as IMS CHIPS CMOS wafers. In addition, CMOS circuits and micro-mechanic components can be arranged facing each other and equipped with electrical interfaces.
For more information, please go to Fields of Activity - MEMS - Micro electro mechanic systems

Contact

For further information, please contact: Florian Letzkus