Institut für Mikroelektronik Stuttgart

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SMC - Practical course for students

July 19, 2010 - July 30, 2010

This course comprises compact and well-structured basics in microelectronics as well the developmental steps to producing electronic circuits.

Lectures on electronics and chip design have been switched onto new CAD tools and a new trial for pc-based autodidactics will be initiated. The hardware plattform IC Lab now enables more flexible programming for challenging trials and projects. The cooperation with teachers and schools will intensify.

For more information, please refer to
Practical course for students

Location: Allmandring 30a, 70569 Stuttgart
Time: 9.00 am to 5.00 pm

Chipfilm™ project completed successfull

June 29, 2010

The Chipfilm™ project funded by Landesstiftung Baden-Württemberg and carried out on behalf of Wirtschaftsministerium Baden-Württemberg was completed successfully in November 2009. Scientists of the Institut für Physikalische Elektronik of Universität Stuttgart (ipe) and the IMS supported by specialists from four companies have explored the basic characteristics of ultra-thin silicon chips manufactured with the new Chipfilm™ technology. During the course of the project the electrical functions of these chips in bent condition as their mechanical stability up to the breaking point were determined. The results have been presented at various international conferences and published in scientific journals. The researched new technology offers possible applications in microelectronic products (ultra-thin chips in textiles, Si chips in flexible plastic foil, ultra-thin ASICs integrated in appliances and instruments), sensorics (ultra-thin sensorics, adhesive tapes with integrated diagnostics) and micromechanics (miniature silicon grippers).

For further information, please refer to

Projekt_Chipfilm_Kurzbericht_IMS.pdf

http://chipfilm.ims-chips.de

TanDEM-X - radar satellite liftoff from Baikkonur successful

June 21, 2010

On June 21st the Dnjepr satellite launching rocket was lifted into space from the Baikonur spaceport in Kazakhstan carrying the radar satellite TanDEM-X designed by the Friedrichshafen-based EADS subsidiary Astrium. Together with its “twin“ TerraSAR-X that has been in space since 2007 this radar satellite will be mapping earth´s entire land surface once again. The intention is to create a digital ground model surpassing all previous ones in quality. TanDEM-X and TerraSAR-X together will generate a radar interferometer: They will fly just a few hundred meters apart from each other in a tight formation and thus enable a simultaneous recording of the area from different angles. So far, this has been an unprecedented operation. On board the predecessor Terra-SAR-X there are numerous specialized microchips that were designed and manufactured at the Institut für Mikroelektronik Stuttgart.

For further information on the satellite launch, please go to www.infoterra-group.com

Science meets education: “Microchips”

June 21, 2010

This is the title of a joint two-day project between the Institut für Mikroelektronik Stuttgart and Hegel-Gymnasium in Stuttgart-Vaihingen on June 21th and June 28th.

What do microchips consist of? How do they work? How do you create structures that are one thousand times thinner than a piece of hair? These questions and many more regarding the “brain” of electronically controlled equipment, such as computer, mobile phones and robots will be investigated by the 9th grade students during the “Microchips” project class as part of the new profile NWT (Naturwissenschaft und Technik). This school subject was initiated in the last school year 2008/2009 and is taught to all student chosing the scientific profile on Gymnasium level starting in 9th grade in Baden-Württemberg.

For further question regarding students at the IMS, please contact Ehrenfried Futterer.

Location: IMS Stuttgart, Allmandring 30a, 70569 Stuttgart

MoDekt – Final presentation on June 7, 2010 in Tuebingen

June 07, 2010

The BMBF (German Federal Ministry of Education and Research) funded joint project MoDekt – Development of a new modular detection platform - enabling Point-of-Care Testing (POCT) was completed successfully in Dec 2009.
A test system for label-free optical bioanalysis methods with the reflectometric interference spectroscopy was set up and tested by the IMS and his joint partner institutes of the University of Stuttgart (ipe and ITO) and Tuebingen (IPTC und UKT).
One example of use is the correct detection of the thromboses indicator D-Dimer and the C-reactive protein (CRP), – essential in clinical practice – with probes from the University Hospital Tuebingen. With a size of only 4 cm x 8 cm the MoDekt system will replace a table size spectrometer.
The final presentation of this project - being among the first projects of the Interuniversity Centre of Medicinal Technologies Stuttgart-Tübingen (IZST) founded in 2007 - will take place at the University of Tuebingen on MON June 7, 2010, following the fms-Regionaltag „Entwicklungen und Perspektiven der Patientennahen Diagnostik“.

For more information, please go to:
MoDekt_Abschluss_7jun2010.pdf
fms_POCT_7jun2010.pdf

IEEE EDS Mini-Kolloquium on June 7th, 2010

June 07, 2010

A mini colloquium hosted by the "Electron Device Society" of the IEEE will take place at the Institut für Mikroelektronik Stuttgart on June 7th, 2010. Renowned scientists and engineers from Europe, Japan and the US will discuss the "More than Moore" topic within a frame of 14 invited lectures. The future development of CMOS technology, robust ICs, sensors and power electronics, high-frequency and microelectronic as well as future display technology will be on the agenda. The "Institute of Electrical and Electronics Engineers" (IEEE) is a professional association for engineers in the electronics and information technology sector and the worldwide largest spanning association of its kind.

For further information, please go to: German Chapter of IEEE Electron Device Society

Location: Institut für Mikroelektronik Stuttgart, Allmandring 30a
Time: 7.30 am to 5.30 pm

54th International Conference on Electron, Ion, and Photon Beam Technology & Nanofabrication

June 01, 2010 - June 04, 2010

We present our available portfolio of thin membranes and Nanoimprint templates. Please visit our booth (#10) at the industrial exhibition

For further information, please go to www.eipbn.org

Location: Egan Convention Center, Anchorage, Alaska; (Stand #10)

2. GMM Workshop — Technologien und Werkstoffe der Mikrosystem- und Nanotechnik

May 10, 2010 - May 11, 2010

Evangelos A. Angelopoulos will give a lecture at the GMM Workshop.

Session: 3D-Strukturierung von Mikrosystemen

"Structural and Mechanical Properties of Sintered Porous Silicon "

Monday, May 10, 2010

For further information, please go to
www.TuW2010.de

Location: Darmstadtium, Darmstadt

New Braille display equipped with IMS ASICs at the SightCity 2010 in Frankfurt

April 28, 2010 - April 30, 2010

IMS CHIPS has been developing and manufacturing specialized micro chips to activate piezo-electric Braille modules for the Metec AG for years.

Within the frame of the Hyperbraille project a two-dimensional interactive graphics supporting Braille display was developed. Using the touch-sensitive 18 x 11 inch peg plate the blind and vision impaired can illustrate graphical elements or tables. In addition, the illustration area of the display is touch sensitive, i. e. the user is able to trigger actions by tipping the display when usually using the mouse. This functionality is reached through an IMS Mixed Signal ASIC that recognizes the minimal capacity variation caused through the touch of a finger on the plate and forwards this signal on to the control.

The demo display of the project sponsored by the Bundesministerium für Wirtschaft (BMWi) can be seen at the Metec AG booth (booth D13).
A technical advisor of the Bundesministerium für Wirtschaft und Technologie will be presenting the "Hyperbraille" project at the SightCity exhibition on Wednesday, April 28th, 2010.

Further information:

Fachmesse SightCity: http://www.sightcity.net

Projekt Hyperbraille: www.hyperbraille.de

Location: Sheraton Airport Hotel, Frankfurt, Booth D13

Professor Dr.-Ing. Joachim Burghartz of the Institut für Mikroelektronik Stuttgart is awarded the Landesforschungspreis für Angewandte Forschung

April 23, 2010

Ultra-thin chips enable new applications in microelectronics, micro system technology and medical technology.

The 100,000 € Landesforschungspreis für Angewandte Forschung is awarded to Joachim Burghartz who heads the Nano- und Mikroelektronische Systeme at Universität Stuttgart and is the Director and CEO of the Institut für Mikroelektronik Stuttgart (IMS). As officially announced by the Federal Government of Baden-Württemberg during the press conference at Landtag today the prize is awarded to honor the development of the Chipfilm technology and its application in cooperation with the Robert Bosch GmbH. The Ministerium für Wissenschaft, Forschung und Kunst awards this research prize annually. The decision on who is awarded the research prize is made by an interdisciplinary jury consisting of renowned and experienced scientists. Prof. Burghartz views this prize as a recognition of the work carried out by the entire team involved at the IMS as well as its externally participating partners and Universität Stuttgart. The prize money will go to a new research project on flexible organic electronics where the institute will also involve its expertise on the manufacture of new stencil masks and the design of integrated circuits (ASIC). “With this prize money we will be able to explore new research areas. I am already looking forward to these new opportunities now”, says Joachim Burghartz.

For further information, please go to:

press release Landesforschungspreis

mwk.baden-wuerttemberg.de

Photomask and NGL Mask Technology XVII

April 13, 2010 - April 15, 2010

The IMS will be represented in a poster session at the Photomask and NGL Mask Technology XVII 2010 in the Japanese Yokohama.

W-CMOS Blanking Device for Projection Multi-Beam Lithography

Michael Jurisch, Mathias Irmscher, Florian Letzkus, Elmar Platzgummer*, Christof Klein*, Hans Löschner*

IMS CHIPS, Stuttgart, Germany, * IMS Nanofabrication AG, Vienna, Austria

For further information, please go to www.photomask-japan.org

Location: Annex Hall, Pacifico Yokohama, Yokohama, Japan

MEDEA+ Project FANTASTIC completed successfully!

April 11, 2010

UV-NIL stamp manufacturing at IMS CHIPS.
The Project FANTASTIC launched in August 2006 and funded by the BMBF has successfully been completed.
Within FANTASTIC the potential of UV nanoimprint lithography (UV-NIL) for the manufacturing of advanced CMOS devices has been investigated.
The Institut für Mikroelektronik Stuttgart was responsible for the work-package „template fabrication“ and developed manufacturing technologies for simple 2D up to complex 3D multi-layer structures with different etch depths.
IMS CHIPS now offers manufacturing of stamps with various form factors for different applications in microelectronics, micro- and nanoelectromechanical systems, nanooptics and nanophotonics.

For further information, please go to www.fantastic-project.org

Newsletter issue 1 2010

March 26, 2010

We present our IMS newsletter.

In this newsletter (issue 1, 2010) we would like to give you some highlights of our ongoing activities at the Institut fuer Mikroelektronik Stuttgart. The topics of the current issue are:

MicroTEC Südwest – IMS CHIPS - Partner in Excellence Cluster MicroTEC Südwest
The Cluster MicroTEC Südwest is one of the winners in the second round of the "Leading Edge Cluster Competition" of the Bundesministerium für Bildung und Forschung (BMBF). The institute is a major player within the cluster. IMS CHIPS will join forces with industries and other research institutes within the cluster to develop new process technologies and applications in the field of micro systems technology (MST).

The MEDEA+ project FANTASTIC – UV-NIL stamp manufacturing at IMS CHIPS
Within FANTASTIC, the potential of UV nano imprint lithography (UV-NIL) used for the manufacturing of advanced CMOS devices has been investigated. As partner to the European consortium led by CEA-LETI, IMS CHIPS was responsible for the template fabrication. IMS CHIPS now offers manufacturing of stamps with various form factors for different applications in microelectronics, micro- and nanoelectromechanical systems, nanooptics and nanophotonics.

Bent silicon chips – Characterization of thin transistors and simple circuits
Thin bendable silicon chips allow various applications since having all advantages of Si-based material (high integration density, high speed). A process patented by IMS CHIPS allows manufacturing of very thin und thus bendable chips. The electrical characteristics of bent chips have now been researched by testing transistors and simple circuits. Based on this work, the development of circuits operating on bent chips is now possible.

224V-ASICs – SME gain access to its own Smart-Power-Chips
Energy efficiency, innovative battery technology and e-mobility are presently main topics of the electronics industry. The project 24V-ASICs was launched to enable small and medium enterprises (SME) to develop its own smart-power-chips and gain access to series production at reasonable cost even with low production volumes, which are often typical for SME products.

Our current IMS Newsletter can be found under Publications - Current publications.

Joint project ValMon launched

February 09, 2010

Together with the Erligheim based company Staiger and the Steinbeis Transferzentrum Mechatronik in Ilmenau the IMS is going to develop a new safety electronic device to continuously monitor magnetic valves using integrated electronics. The valves are able to "monitor themselves" and recognize and signal possible malfunctions before they actually happen. This creates a significant improvement of valve systems in safety-critical areas, such as medical technology, power plants and automotive technology. Within the hightech strategy "KMU-innovativ IKT" sponsored by the Bundesregierung the joint project ValMon is funded over a course of 2 years by the Bundesministerium für Bildung und Forschung (BMBF).

For further information, please go to:

ValMon press release

http://www.valmon.de

XLIII. MPC Workshop 2010 in Göppingen

February 05, 2010

The IMS will be giving two presentations at the XLIII. MPC Workshop 2010 in Göppingen.

Debayan Paul, HS Darmstadt & Thomas Deuble, IMS Chips, Stuttgart, 11.30 Uhr, February 05, 2010
"Implementation of an IO-Link Interface Library Component for SoC Application"

Torsten Schmitz, HS Esslingen & Johannes Thielmann, IMS Chips, Stuttgart, 12.00 Uhr, February 05, 2010
"Charakterisierung von Hall-Platten für integrierte intelligente Microsysteme und Entwurf einer spannungs- und temperaturstabilen Stromquelle im IMS 0.5 μm Gate Forest Technologie"

For further information, please go to
www.mpc.belwue.de

Location: Hochschule Esslingen Standort Göppingen, Robert-Bosch-Straße 1, 73037 Göppingen
Time: 8.30 am to 6.00 pm

IMS CHIPS is awarded Spitzencluster MicroTEC Südwest

January 26, 2010

The MicroTEC Südwest network is one of five winners in the second round of the BMBF Spitzencluster competition. In order to sustainably support research and development in the microsystem technology field in southwest Germany the MicroTEC Südwest network headed by the cluster management Mikrosystemtechnik Baden-Württemberg e.V. (MST BW) was declared a winner in this national BMBF competition. MicroTEC Südwest and four other Spitzenclusters will now be awarded a total of 200 Mio. € in funding.
The Institut für Mikroelektronik Stuttgart has contributed significantly to the composition and presentation of the project draft and will now join numerous research institutes and innovative industrial companies in Baden-Württemberg on a variety of subjects within the Cluster.

For further information, please go to:

Pressemitteilung MST BW

http://microtec-suedwest.de

Season´s Greetings

December 17, 2009

IMS Season´s Greetings

Innovative learning media at IMS CHIPS

December 09, 2009

IMS also offers possibilities for advanced learning on its e-learning Plattform in the areas of electronics that can be utilized at the office and at home as well as on the weekend irrespective of time and place.

Topics in the learning module:

Digital technology and programmable logic
Self taught automating systems (Moeller EASY and Siemens LOGO)
Sensorlab (sensor basics)
Idea to product (an innovation guideline)

The provided experimental boards support users when putting theory into practice:

IC-Lab (laboratory for programmable logic)
µC-Lab (microcontroller laboratory)

For more information on learning module, please go to
e-learning Plattform

Press release BMBF-Verbundprojekt HiDRaLoN

December 08, 2009

In order to research alternative CMOS technology concepts for a new generation of high dynamic and high resolution image sensors with low noise interference a strong German project consortium has been assembled within the European CATRENE research project HiDRaLoN (High Dynamic Range Low Noise CMOS Imagers).

Press release BMBF-Verbundprojekt HiDRaLoN

Lecture "Anomalous Stress Effects in Ultra-Thin Silicon Chips on Foil"

December 07, 2009 - December 09, 2009

Mahadi-Ul Hassan will give a lecture at the IEDM

"Anomalous Stress Effects in Ultra-Thin Silicon Chips on Foil"

Session 22: Displays, Sensors and MEMS – Heterogeneous Integration for Energy Harvesting and Photonics

Tuesday, December 8, 2009

For further information, please go to
2009 IEDM PROGRAM

Location: Hilton Baltimore, Baltimore, MD, USA

Again Paper Award at the SPIE Photomask Conference 2009 in Monterey, USA

December 07, 2009

The Multi Beam Consortium consisting of IMS Nanofabrication AG, IMS CHIPS and FhG ISIT was awarded a paper award during this year´s SPIE Photomask Conference in Monterey, USA, September 14th through 17th.

Third Place Best Paper Award

"Charged Particle Multi-Beam Lithography Evaluations for sub-16nm hp Mask Node Fabrication and Wafer Direct Write"

Elmar Platzgummer^a, Christof Klein^a, Peter Joechl^a, Hans Loeschner^a, Martin Witt^b, Wolfgang Pilz^b, Joerg Butschke^c, Michael Jurisch^c, Florian Letzkus^c, Holger Sailer^c, Mathias Irmscher^c

a) IMS Nanofabrication AG, Schreygasse 3, A-1020 Vienna, Austria

b) Fraunhofer Institute for Silicon Technology (ISIT), Itzehoe, Germany

c) Institute for Microelectronics Stuttgart (IMS CHIPS), Stuttgart, Germany

Science meets education: “Microchips”

November 30, 2009

This is the title of a joint two-day project between the Institut für Mikroelektronik Stuttgart and Hegel-Gymnasium in Stuttgart-Vaihingen on November 30th and December 7th.

What do microchips consist of? How do they work? How do you create structures that are one thousand times thinner than a piece of hair? These questions and many more regarding the “brain” of electronically controlled equipment, such as computer, mobile phones and robots will be investigated by the 9th grade students during the “Microchips” project class as part of the new profile NWT (Naturwissenschaft und Technik). This school subject was initiated in the last school year 2008/2009 and is taught to all student chosing the scientific profile on Gymnasium level starting in 9th grade in Baden-Württemberg.

For further question regarding students at the IMS, please contact Ehrenfried Futterer.

Location: IMS Stuttgart, Allmandring 30a, 70569 Stuttgart

SAFE 2009 – Annual Workshop on Semiconductor Advances for Future Electronics and SENSORS

November 26, 2009 - November 28, 2009

The IMS will have 3 poster presentations on the SAFE 2009 in Veldhoven, Netherlands.

Poster 1
"Investigation of Mechanical Strength of Epitaxially Grown Ultra-Thin Silicon Chips"
A. Kiss, T. Hoang, MemberIEEE, C. Harendt and J.N. Burghartz, FellowIEEE

Poster 2
"Metal ― Porous Silicon Contact and Electrical Resistivity of Porous Silicon"
S. Ferwana, T. Zehender, E. Angelopoulos, C. Harendt, M. Zimmermann and J. Burghartz

Poster 3
"Compact Modeling of CMOS Transistors under Uniaxial Stress"
N. Wacker, M. Hassan, H. Richter, H. Rempp and J.N. Burghartz

For further information, please go to
www.stw.nl/Programmas/Safe

Location: NH Koningshof Hotel, Locht 117, Veldhoven, Niederlande

8th International Conference on Nanoimprint and Nanoprint Technology

November 11, 2009 - November 13, 2009

IMS is presenting technology and product solutions for photomasks, diffractive optical elements, replication masters, silicon membranes, MEMS and micromechanical components.

Nähere Informationen zum "8. NNT 2009" finden Sie unter
http://www.nntconf.org

Location: Convention Center, San Jose, CA, USA

First User Group Workshop within the scope of the HiDRaLoN project

November 06, 2009

Following this year´s 22nd International Trade Fair for Machine Vision and Identification Technologies on November 6th, 2009, the Institut für Mikroelektronik Stuttgart will hold the first Hidralon workshop with the industrial partners of the User Group accompanying the project.

With an expected runtime of about 3 years the HiDRaLoN - High Dynamic Range and Low Noise CMOS Image Sensors project submitted within the frame of the European sponsored program CATRENE was launched on March 1st, 2009. In Germany the project is supported by the Bundesministerium für Bildung und Forschung (BMBF).

The European consortium consists of 16 project partners (research facilities and companies) from Germany, France, the Netherlands, Israel and Hungary. Of the German partners in the consortium 4 are CMOS sensor developers: Institut für Mikroelektronik Stuttgart (IMS CHIPS), Deutsche Thomson oHG, Fraunhofer-Institut für Mikroelektronische Schaltungen und Systeme and Philips Technologie GmbH Forschungslaboratorien. Accompanying the project a user group currently stemming from 12 industrial companies made of potential project result end users will be set up.

www.hidralon.eu

Location: IMS Stuttgart, Allmandring 30a, 70569 Stuttgart

EDS Chapter Meeting on November 4th, 2009, in Reutlingen

November 04, 2009

As part of the activities of the German Chapter of IEEE EDS Prof. Yiannos Manoli of the IMTEK at the University of Freiburg will be holding a lecture titled "Energy Harvesting - from Devices to Systems" during the next EDS Chapter Meeting on Wednesday, November 4th, 2009, at 4 p.m.

For further information on the lecture, please refer to the following Abstract.

Location: Bosch, Tübingerstr. 123, 72762 Reutlingen, in the auditorium of building 501
Time: 4.00 pm

7th Workshop "Beams and More" 2009

October 22, 2009

Our 7th Workshop on Lithography which we call now "Beams & More" will be held on Thursday, October 22nd, 2009 in Stuttgart.

For more information and online registration, please refer to lithoworkshop.ims-chips.de

Location: IMS Stuttgart

Microelectronics technology workshop

October 14, 2009 - October 16, 2009

The popular course "Mikroelektronik-Technologie" is conducted once a year with participants coming from the surrounding industrial environment.
The "Mikroelektronik-Technologie" course provides a sound and practical introduction into the fabrication of microchips and the special aspects when testing microelectronic circuits as well as packaging chips into IC packages.
This course is targeted at developers in the electronic field and decision makers of the surrounding industrial environment.

For more information on the intensive courses, please go to Fields of activity - Microelectronic workshops

Registration: http://www.tae.de

Course will take place between 14 and 16 October 2009

Location: Allmandring 30a, 70569 Stuttgart

Bipolar/BiCMOS Circuits and Technology Meeting (BCTM)

October 13, 2009 - October 14, 2009

Prof. Dr. Joachim Burghartz will give an invited lecture on BCTM 2009 in Capri.

Ultra-Thin Chip Fabrication for Next-Generation Silicon Processes (Invited)
Wednesday, October 13th, 2009

For more information, please refer to
http://www.ieee-bctm.org/

Location: Capri Palace Hotel, Capri, Italy

IMS welcomes gifted youngsters

October 09, 2009

The IMS hosted a visit of the Elterngruppe Tübingen des Landesverband Hochbegabung Baden-Württemberg e.V. Accompanied by their parents more than 30 adolescence spent an exciting afternoon at the IMS. The young guests ranging in age between 10 and 15 were given short presentations in order to introduce them to the microelectronic and nano technology field followed by a tour through the IMS premises. The youngsters found out how microchips are manufactured, mounted and tested and were given an outline of the technical effort that is required. Following this, they were able to conduct some of their own experiments. Using the "IMS BOARDS" that were developed for the Ideenpark fair last year the Juniors were able to design and try out their own electronic circuits. However, the most exciting remained the chance to ask all sorts of questions. Our scientists and engineers were fired with questions until evening.

The IMS team is excited about the attraction the world of science and technology poses particularly to children and adolescence. For further information on events for “future scientists“, please refer to www.ims-chips.de.

Requests for tours and events at the IMS will be answered Ehrenfried Futterer.
For further information on the Landesverband Hochbegabung Baden-Württemberg e.V., please go to www.lvh-bw.de.

Micro Nano Engeneering – MNE 2009

September 28, 2009 - October 01, 2009

Lecture: H. Sailer

A fast evaluation method for high-resolution ebeam resist process optimization

A. Barcz, J. Butschke, M. Irmscher, S. Martens

IMS Chips, Allmandring 30a, D-70569 Stuttgart, Germany

For more information, please go to http://www.mne09.org

Location: ICC Ghent, Ghent, Belgium

Newsletter issue 2 2009

September 25, 2009

We present our IMS newsletter.

In this newsletter (issue 2, 2009) we would like to give you some highlights of our ongoing activities at the Institut fuer Mikroelektronik Stuttgart. The topics of the current issue are:

HyperBraille – Interactive Braille display for graphic user interfaces
For the first time ever specialized chips enable the realization of an interactive Braille display for graphic user interfaces. These ASICs are developed and produced at IMS CHIPS.

Si technology supports Avogadro project – Oxidation of high-purity silicon spheres at IMS
The IMS has supported the Physikalisch Technische Bundesanstalt (PTB) in cleaning and oxidizing such silicon spheres for quite some time. These spheres are supposed to replace the norm kilogram as measuring standard in the future

Membranes and membrane masks made by IMS CHIPS – Further development of direct patterning technologies
The Institut fuer Mikroelektronik Stuttgart has been manufacturing membranes and membrane masks for a broadly diversified clientele for over 10 years. Depending on the material and membrane thickness round and square membrane geometries with membrane areas of less than 1 mm² up to more than 100 cm² can be realized.

IMS Association of Sponsors – Knowledge center and contact network in one: the IMS Association of Sponsors
Besides an easy exchange of information the IMS Association of Sponsors now offers a new homepage format www.ims-foerderverein.de. This online platform enables the contact among other companies of the region and provides a detailed insight into the world of microelectronics, nano technology and micro system technology.

Our current IMS Newsletter can be found under Publications - Current publications.

ESSDERC/ESSCIRC 2009, Athens: Lecture "Ultra-thin Chips - a New Paradigm in Silicon Technology"

September 14, 2009 - September 18, 2009

Prof. Dr. Joachim Burghartz will give a presentation at the "JOINT PLENARY TALK" on ESSDERC-ESSIRC 2009 in Athens.

"Ultra-thin Chips - a New Paradigm in Silicon Technology"
Thursday Sep 17th, 2009

Poster presentation: Evangelos Angelopoulos

"Compliant Substrate based on Sintered Porous Silicon for the Local Integration of Heterodevices with Silicon Microelectronics"
Tuesday the 15th to Thursday the 17th September 2009

For more information, please refer to
www.esscirc2009.org

Location: Divani Caravel Hotel, Athens, Greece

SPIE Photomask Technology 29th Annual Symposium (BACUS 2009)

September 14, 2009 - September 17, 2009

Tuesday, September 15th, 2009; Session 6: Nano-Imprint and Patterned Media Technology II

Lecture: Marcus Pritschow ^a

High-Resolution E-Beam Repair for Nanoimprint Templates

Harald Dobberstein^b, Klaus Edinger^b, Mathias Irmscher^a, Douglas J. Resnick^c, Kosta Selinidis^c, Ecron Thompson ^c, Markus Waiblinger^b

a) IMS Chips, Allmandring 30a, D-70569 Stuttgart, Germany

b) Carl Zeiss SMS GmbH, Carl Zeiss Promenade 10, D-07740 Jena, Germany

c) Molecular Imprints, Inc. 1807-C W. Braker Lane, Austin, TX 78758, USA

Poster presentation: Florian Letzkus ^a

3D Si Aperture Plates combined with programmable Blanking Plates for Multi-Beam Mask Writing

Mathias Irmscher^a, Michael Jurisch^a, Elmar Platzgummer^b, Christof Klein^b, Hans Loeschner^b

a) IMS Chips, Allmandring 30a, D-70569 Stuttgart, Germany

b) IMS Nanofabrication AG, Schreygasse 3, A-1020 Vienna, Austria

For more information, please go to http://spie.org/photomask.xml

Location: Monterey Marriott and Monterey Conference Center, CA, USA

New technology development - medium-sized businesses gain access to Smart Power Chips

August 26, 2009

Mixed Signal ASICs with integrated power components

Titled “24V-ASICs“ a new combination of technologies is developed that integrate the Smart Power experience of the Heilbronn-based chip manufacturer Telefunken Semiconductors with the cost-efficient small series production at IMS CHIPS. This project is supported by the Arbeitsgemeinschaft industrieller Forschungsvereinigungen (AiF) of the Bundesministerium für Wirtschaft und Technologie (BMWI).

For more information, please refer to
IMS-CHIPS_24V-ASICs.pdf

EXEPT – 22 nm node EUV lithography

July 22, 2009

With a runtime of 3 years the EXEPT project (EXtreme uv lithography Entry Point Technology Development) was launched on May 1st, 2009 in the frame of the European program CATRENE (Label CT301). In Germany the project is funded by the Federal Ministry of Education and Research (Bundesministerium für Bildung und Forschung).

The goal of the EXEPT project is to develop technologies, tools & infrastructure components as required for high volume EUV lithography for the 22nm node in 2012. EXEPT is accomplished by a European consortium consisting of more than 10 companies and research facilities.

The Institut für Mikroelektronik Stuttgart (IMS CHIPS) will develop the fabrication process for a new generation of diffractive optical elements (DOE) required for testing and manufacturing of highly precise EUV scanner optics.

For more information, please refer to
www.catrene.org/web/projects/project_list.php

SMC - Practical course for students

July 20, 2009 - July 31, 2009

Location: Allmandring 30a, 70569 Stuttgart
Time: 9.00 am to 5.00 pm

Encore in federal cluster of excellence competition: MicroTEC Südwest in the final round again!

June 25, 2009

Under the auspices of the Freiburg based Vereins Mikrosystemtechnik Baden-Württemberg e.V. (mstbw) the Institut für Mikroelektronik Stuttgart along with industrial and research partners is running in the Spitzencluster competition called on by the Federal Minister of Research, Annette Schavan, for a second time.
Says Peter Jeuk of mstbw: “The interdisciplinary technology cluster MicroTEC Südwest has once more reached the final round and considers its chances to be excellent to be one of the 5 winners of this important national competition early 2010. The draft filed in April details the development of R & D projects for the cluster worth more than 100 million Euros.“

For further information, please go to: Pressemitteilung MST BW

TEMPERATUR 2009

June 24, 2009 - June 25, 2009

The IMS will be represented with a presentation during "TEMPERATUR 2009“ workshop.

Franz X. Hutter
Wednesday, 24. June 2009

"HDRC^® Quotienten-PyroCam – Thermografie mit neuen Eigenschaften"

For more information, please refer to TEMPERATUR 2009

Location: Physikalisch-Technische Bundesanstalt (PTB), Abbestraße 2-12, 10587 Berlin-Charlottenburg

53rd International Conference on Electron, Ion, and Photon Beam Technology & Nanofabrication

May 26, 2009 - May 29, 2009

The IMS will be giving an "Invited Talk" at the EIPBN 2009 in Florida, USA.

Mathias Irmscher
May 28, 10:50AM / Session 4A /Maskless Lithography

Programmable Aperture Plate System With Integrated CMOS Electronics for Projection Maskless Nanolithography and Nanopatterning
Christof Klein*, Elmar Platzgummer*, Hans Loeschner*, Florian Letzkus**, Michael Jurisch**, Mathias Irmscher**, Martin Witt***, Wolfgang Pilz***

* IMS Nanofabrication – Vienna, Austria
** IMS Chips – Stuttgart, Germany
*** FhG ISiT – Itzehoe, Germany

In addition, the IMS is represented at this year´s EIPBN with a booth (booth no. 2).

For further information, please go to www.eipbn.org

Location: Marco Island Marriott Beach Resort, Florida, USA; (booth no. 2)

Project HiDRaLoN launched

May 24, 2009

With an expected runtime of about 3 years the HiDRaLoN - High Dynamic Range and Low Noise CMOS Image Sensors project submitted within the frame of the European sponsored program CATRENE was launched on March 1st, 2009. In Germany the project is funded by the Federal Ministry of Education and Research (Bundesministerium für Bildung und Forschung).

The aim of the project is the research and development of highly-dynamic CMOS image sensors with a HTDV (2 MegaPixel) resolution and high image quality, optical 3D sensors based on the time of flight principal as well as CT and x-ray detectors. Multiple applications are feasible in the processing, medical and safety technology, in automobile applications and in TV cameras. In this connection IMS CHIPS utilizes highly-dynamic CMOS image sensors based on its HDRC technology.

The European consortium consists of 16 project partners (research facilties and companies) from Germany, France, the Netherlands, Israel and Hungary. Of the German partners in the consortium 4 are CMOS sensor developers: Institut für Mikroelektronik Stuttgart (IMS CHIPS), Deutsche Thomson oHG, Fraunhofer-Institut für Mikroelektronische Schaltungen und Systeme and Philips Technologie GmbH Forschungslaboratorien. Accompanying the project a user group currently stemming from 12 industrial companies made of potential project result end users will be set up.

www.hidralon.eu

Press release BMBF-Verbundprojekt HiDRaLoN

16th Symposium of the VDE/VDI “Mikrotechnik" workshop in Thüringen

May 19, 2009

The IMS will be represented with a presentation during the 16th symposium of the VDE/VDI “Mikrotechnik“ workshop.

Thomas Deuble
Tuesday, 19. May 2009

"ASICs für Mixed-Signal-Anwendungen - GATE FOREST^®"
Cor Scherjon, Christian Burwick, Thomas Deuble

For more information, please refer to Einlad16AK.pdf

Location: Institut für Mikroelektronik- und Mechatronik-Systeme gGmbH, Ehrenbergstr. 27, 98693 Ilmenau
Time: 4.00 pm to 6.00 pm

International Conference on IC Design & Technology

May 18, 2009 - May 20, 2009

The IMS will be giving an "Invited Talk" at the ICICDT 2009 in Austin.

Harald Richter
Wednesday, May 20, 2009 , 10:10 a.m. / Session G: System on a Chip

"Technology and Design Aspects of Ultra-Thin Silicon Chips for Bendable Electronics"
Harald Richter, Horst Rempp, Joachim Burghartz, Mahadi-Ul Hassan, Christine Harendt, Nicoleta Wacker, Martin Zimmermann

For further information, please go to www.icicdt.org

Location: Freescale Semiconductor, 7700 W Parmer Lane, Austin, Texas

New Braille display equipped with IMS ASICs at the SightCity 2009 in Frankfurt

May 13, 2009 - May 15, 2009

IMS CHIPS has been developing and manufacturing specialized micro chips to activate piezo-electric Braille modules for the metec AG for years. Within the frame of the Hyperbraille project a two-dimensional interactive graphics supporting Braille display was developed. This shall for the first time enable the vision impaired access to a computer program user interface with graphics as is standard today for "seeing" individuals.
The Hyperbraille display with an approximate diameter of 34 cm is not only limited to displaying Braille but can also display any outlines, such as program windows or buttons. In addition, all elements of the display are touch sensitive, i. e. the user is able to trigger actions by tipping the display when usually using the mouse. This functionality is reached through a IMS Mixed Signal ASIC that recognizes the minimal capacity variation caused through the touch of a finger on the plate and forwards this signal on to the control. The demo display of the project that was sponsored by the Bundesministerium für Wirtschaft (BMWi) with 5.8 Mio. Euro over the course of three years is displayed at the metec AG booth (booth D13).

Further information:

Fachmesse SightCity: http://www.sightcity.net

Projekt Hyperbraille: http://www.hyperbraille.de

Location: Sheraton Airport Hotel, Frankfurt, Booth D13

"Science and Technology" – classes at the IMS

April 21, 2009

With the newly introduced "Science and Technology" class at the German secondary school in mind the ninth graders of the Hegelgymnasium in Stuttgart will venture into the world of design and manufacture of microchips at the IMS.
Laboratory experiments with the IMS board and explorative interviews with researchers and scientists will enable the youngsters to venture out into our scientific world.

Hannover Fair, Hall 2 - Booth C21

April 20, 2009 - April 24, 2009

Visit us at the joint Baden-Württemberg International stand in Hall 2, Booth C21.

We will be presenting the latest developments in the Si technology.

www.hannovermesse.de

Location: HANNOVER MESSE, Hall 2, Booth C21

Photomask and NGL Mak Technology XVI

April 08, 2009 - April 10, 2009

The IMS will be represented in a poster session at the Photomask and NGL Mask Technology XVI 2009 in the Japanese Yokohama.

Go Proton: Investigation on Mask Patterning for the 22nm hp Node using a ML2 Multi Beam System
Joerg Butschke, Mathias Irmscher, Holger Sailer, Hans Loeschner*, Elmar Platzgummer*,

IMS CHIPS, Stuttgart, Germany, * IMS Nanofabrication AG, Vienna, Austria

For further information, please go to www.photomask-japan.org

Location: Annex Hall, Pacifico Yokohama, Yokohama, Japan

Newsletter issue 1 2009

March 27, 2009

We present our IMS newsletter.

In this newsletter (issue 1, 2009) we would like to give you some highlights of our ongoing activities at the Institut fuer Mikroelektronik Stuttgart. The topics of the current issue are:

ProMikron – Three-dimensional reduction of chips and sensor elements
To open up new areas of application, industry and research establishments are jointly developing new process technologies for the three-dimensional reduction of chips and sensor elements. The project is funded to the amount of 8 million Euro by the German Federal Ministry of Education and Research.

Pilz PSENvip - Camera-based safety and measuring system
Using HDRC^® technology by IMS CHIPS the Ostfildern-based Pilz GmbH & Co. KG has developed the new camera-based safety and measuring system PSENvip to monitor work processes on mechanical press brakes.

NIL Technology and IMS CHIPS cooperate
The nano imprint lithography realizes tiny nanometer structures using specially manufactured dies.
The leading European manufacturer for templates in nano imprint lithography, the Danish Copenhagen-based NIL Technology, and IMS CHIPS announced the start of their cooperation in the nano imprint template field during the NILCOM meeting in Schärding, Austria, on January 8th, 2009.

New clean room equipment for nano structuring
Accurate etching is an essential part of the production of microchips and nano structuring. PEGASUS and GIGASTEP offer enhanced possibilities to IMS CHIPS in terms of the precision of substrates as required for MEMS and nano technology applications.

Our current IMS Newsletter can be found under Publications - Current publications.

SPIE Advanced Lithography 2009

February 22, 2009 - February 27, 2009

IMS CHIPS participates in the this year's SPIE Advanced Ltihography Conference in San Jose, California, presenting the NIL technology at the joint booth (booth no 116).

Besides, IMS CHIPS will be giving a talk
"Evaluation of the CD-SEM Vistec LWM90xx for line width measurement of nanoimprint templates"

Wednesday, 25 February, 2009

Marcus Pritschow^a, Joerg Butschke^a, Mathias Irmscher^a, Lidia Parisoli^b, Toshihide Oba^c, Toshimichi Iwai^c, Takayuki Nakamura^c

a IMS Chips, Allmandring 30a, D-70569 Stuttgart, Germany
b Vistec Semiconductor Systems GmbH, Kubacher Weg 4, D-35781 Weilburg, Germany
c Advantest Corporation, Otone R&D Center, 1-5, Shin-tone, Otone-machi, Kitasaitama-gun, Saitama 349-1158, Japan

For further information, please go to spie.org/advanced-lithography.xml

Location: Booth 116, Convention Center, San Jose, California, USA

IMS CHIPS research group receives ISSCC Jack Raper Award

February 09, 2009

The Institut für Mikroelektronik Stuttgart (IMS CHIPS) was awarded the "Jack Raper Award for Outstanding Technology Directions Paper" by IEEE at the 2009 ISSCC conference in San Francisco for its "CMOS Imager Technologies for Biomedical Applications" presentation.

In addition, the IMS was represented with a presentation by Franz Xaver Hutter on Wednesday, February 11, 2009.

"A 0.25 µm Logarithmic CMOS Imager for Emissivity Compensated Thermography"

Further information:

Press Release "ISSCC Jack Raper Award"

„CMOS Imager Technologies for Biomedical Applications“

http://www.isscc.org

Location: Marriott Hotel, San Francisco, CA, USA

XLI. MPC Workshop 2009 in Künzelsau

February 06, 2009

The IMS will be giving a presentation at the
XLI. MPC Workshop 2009 in Künzelsau.

Cor Scherjon, Christian Burwick, 11.15 Uhr, 06 February 2009

"Structured ASICs für Mixed-Signal Anwendungen"

For further information, please go to
www.hs-heilbronn.de.

Location: Reinhold-Würth-Hochschule, Daimlerstraße 35, 74653 Künzelsau
Time: 8.30 am to 6.00 pm

New Collaboration in the Nanoimprint Lithography Industry

January 27, 2009

The leading provider of stamps for nanoimprint lithography, NIL Technology, and IMS Chips, announced at the NILCOM meeting, January 8th, in Schaerding, Austria that they have started a collaboration on the fabrication of stamps for nanoimprint lithography (NIL) by combining their electron beam lithography (EBL) expertises.

Press release collaboration
NIL Technology - IMS CHIPS

Season´s Greetings

December 17, 2008

IMS Season´s Greetings.jpg

Lecture "CMOS Imager Technologies for Biomedical Applications"

December 16, 2008

Prof. Dr. Joachim Burghartz will be given a lecture at the IEDM Special Evening Session on:

Highlights of ISSCC 2008
"CMOS Imager Technologies for Biomedical Applications"

Tuesday, December 16, 2008

For further information, please go to
2008 IEDM PROGRAM

Location: Hilton San Francisco 333 O'Farrell Street San Francisco, CA

Lecture "Ultra-thin Chips - a New Paradigm in Silicon Technology"

December 10, 2008 - December 11, 2008

IEEE Distinguished Lecture
by Prof. Dr. Joachim Burghartz:

"Ultra-thin Chips - a New Paradigm in Silicon Technology"

Wednesday, December 10, 2008:
SSC/EDS at MIT, Cambridge, MA, USA,

Thursday, December 11, 2008:
EDS Meeting at IBM, East Fishkill, NY, USA,

Location: MIT, Cambridge, MA, USA and IBM, East Fishkill, NY, USA

Forum "be-flexible" 2008 - Thin Semiconductor Devices, 9^th International Workshop

December 02, 2008

The IMS will be giving a presentation at the Forum "be-flexible" 2008 in Munich.

Keynote Presentation: J. Burghartz, December 2, 2008

"Ultra-thin chip fabrication using cost-effective pre-processed wafer substrates"

For further information, please go to
http://www.be-flexible.de.

Location: Venue hotel Le Meridien, Bayerstrasse 41, 80335 Munich

SAFE 2008 – Annual Workshop on Semiconductor Advances for Future Electronics and SENSORS

November 27, 2008 - November 28, 2008

The IMS will have 3 poster presentations on the SAFE 2008 in Veldhoven, Netherlands.

Poster 1
"Porous Silicon for Micro- and Opto-electronic applications: Fabrication technology and post-processing steps"
E. Angelopoulos, S. Ferwana, C. Harendt,
M. Zimmermann, W. Appel and J. Burghartz

Poster 2
"Ultra-Thin Chip Fabrication and Assembly Process"
Martin Zimmermann, Saleh Ferwana, Christine Harendt, Wolfgang Appel and Joachim N. Burghartz

Poster 3
"Accurate Measurement of Piezocoefficients in CMOS Transistors on Conventional and Ultra-Thin Silicon Chips"
N. Wacker, H. Rempp, S. Schmiel and J.N. Burghartz

For further information, please go to
www.stw.nl/Programmas/Safe

Location: NH Koningshof Hotel, Locht 117, Veldhoven, Niederlande

Microelectronics technology workshop

November 14, 2008 - November 29, 2008

Location: Allmandring 30a, 70569 Stuttgart

5. GMM-Workshop - Energieautarke Sensorik

November 12, 2008 - November 13, 2008

The IMS will be giving a presentation at the EAS 2008 in Düsseldorf.

Presentation J. Burghartz, November 11, 2008

"Ultra-dünne Chips - eine Basistechnologie für flexible Elektronik und RF ID"

For further information, please go to
www.eas2008.de.

Location: Renaissance Düsseldorf Hotel, Nördlicher Zubringer 6, Düsseldorf

The IMS exhibits at VISION 2008 fair in Stuttgart

November 04, 2008 - November 06, 2008

IMS is presenting the calibrated PyroCam , the HDRC^® Global Shutter and the camera-based protection and measuring system PSENvip developed by PILZ and provided with a certified HDRC^® camera at the 21st International Trade Fair for Industrial Image Processing and Identification.

VISION 2008 cms.messe-stuttgart.de

Location: Stuttgart, Neue Messe, Halle 6.0 Stand C14
Time: 9.00 am to 5.00 pm
Costs: 22 EUR

4th Global Plastic Electronics Conference and Showcase

October 27, 2008 - October 29, 2008

The IMS will be giving a presentation at the 4th Global Plastic Electronics in Berlin.

Vortrag J. Burghartz, 28.10.2008

"Chipfilm - enabling ultra-thin chip technology for hybrid systems in foil"

For further information, please go to
http://www.plastic-electronics.org.

Location: Maritim Hotel Berlin

IMS CHIPS and Robert Bosch signed contract

October 24, 2008

Robert Bosch GmbH Reutlingen and the Institute for Microelectronics Stuttgart (IMS CHIPS) have combined their background IP on Bosch’s porous silicon based APSM pressure sensors and thin chip fabrication based on so called Chipfilm and Pick, Crack&Place process modules from IMS Chips, respectively. The partners will join forces in process development to qualify the Chipfilm technology for industrial volume production.

For further information, please see the official joint press release by Bosch and IMS CHIPS.

6th Workshop "Masks and More" 2008

October 23, 2008

This year’s Lithography Workshop will be held on Thursday, October 23.

For more information and online registration, please refer to lithoworkshop.ims-chips.de

Location: IMS Stuttgart

HDRC^® -Imager Workshop 2008

October 16, 2008

The 1^st HDRC^® -Imager Workshop 2008 will be held on October 16. The program and registration is now available.
Programm HDRC^® -Imager Workshop 2008

Location: IMS Stuttgart

Poster Award at the SPIE Photomask Conference 2008 in Monterey, USA

October 10, 2008

At this year SPIE Photomask Conference Oct 6-10, 2008 in Monterey, CA, USA IMS Chips was granted two Poster Awards for best papers:

Highest award for the paper:

Deflection Unit for Multi-Beam Mask Making
author Florian Letzkus^a, Joerg Butschke^a, Mathias Irmscher^a, Michael Jurisch^a, Christof Klein^b, Wolfram Klingler^a, Hans Löschner^b, Elmar Platzgummer^b, Reinhard Springer^b
^aIMS Chips, Allmandring 30a, 70569 Stuttgart, Germany
^bIMS Nanofabrication AG, Schreygasse 3, A-1020 Vienna, Austria

Second award for the paper:

Mask patterning for the 22nm node using a proton multi-beam projection pattern generator
author Joerg Butschke^a, Mathias Irmscher^a, Holger Sailer^a, Lorenz Nedelmann^a, Marcus Pritschow^a, Hans Loeschner^b, and Elmar Platzgummer^b
^aIMS Chips, Allmandring 30a, 70569 Stuttgart, Germany
^bIMS Nanofabrication AG, Schreygasse 3, A-1020 Vienna, Austria

SPIE Photomask Technology 28th Annual Symposium (BACUS 2008)

October 06, 2008 - October 10, 2008

Lecture: Marcus Pritschow ^a

Evaluation of E-Beam Repair for Nanoimprint Templates

Volker Boegli ^b, Joerg Butschke^a, Mathias Irmscher ^a, Douglas Resnick ^c, Holger Sailer ^a, Kosta Selinidis ^c, Ecron Thompson ^c
a IMS Chips, Allmandring 30a, D-70569 Stuttgart, Germany
b NaWoTec GmbH – A Carl Zeiss SMT Company, Industriestr. 1, D-64380 Rossdorf, Germany
c Molecular Imprints, Inc. 1807-C W. Braker Lane, Austin, TX 78758, USA

Lecture: Jörg Butschke ^a

Mask patterning for the 22nm node using a proton multi-beam projection pattern generator

Mathias Irmscher ^a, Holger Sailer ^a, Hans Loeschner ^b, Lorenz Nedelmann ^a, and Elmar Platzgummer ^b
a IMS Chips, Allmandring 30a, D-70569 Stuttgart, Germany
b IMS Nanofabrication AG, Schreygasse 3, A-1020 Vienna, Austria

Lecture: Florian Letzkus ^a

Deflection Unit for Multi-Beam Mask Making

Joerg Butschke ^a, Mathias Irmscher ^a, Michael Jurisch ^a, Elmar Platzgummer^b
a IMS Chips, Allmandring 30a, D-70569 Stuttgart, Germany
b IMS Nanofabrication AG, Schreygasse 3, A-1020 Vienna, Austria

For more information, please go to http://spie.org/photomask.xml

Location: Monterey Marriott and Monterey Conference Center, CA, USA

Newsletter issue 2 2008

September 26, 2008

We present our IMS newsletter.

In this newsletter (issue 2, 2008) we would like to give you some highlights of our ongoing activities at the Institut fuer Mikroelektronik Stuttgart. The topics of the current issue are:

MoDekt – Direct Detection of Medical Data
The detection of relevant medical data in the medical practice, in the ambulance vehicle or at the home of patients with chronic diseases is an important subject in medical technology (Point-of-Care Testing POCT).
In a preliminary scientific study funded by the BMBF, Germany, scientists of the universities of Tübingen and Stuttgart (Institut für Physikalische Elektronik – IPE), physicians of the central laboratory of the university hospital of Tübingen and collaborators of the Institut für Mikroelektronik Stuttgart are jointly working on a modular detection platform (MoDekt) for direct optical bio-analysis methods without marking.

The Institut für Mikroelektronik Stuttgart celebrated its 25th anniversary
On July 18th, 2008, IMS celebrated its 25th anniversary in Stuttgart with many representatives and partners from trade and industry, politics and science.

MAGIC – Maskless Lithography for IC Manufacturing
The research project “MAGIC” MAskless LithoGraphy for IC Manufacturing) was started on January 1st, 2008 within the Seventh Framework Programme (FP7) of the European Union aiming at the development of pattern generators for the direct-writing of the 32-nm lithography node including the appropriate infrastructure in Europe.

IdeenPark 2008 – The motto of the IMS presentation: “Hands-on Microelectronics”
Visitors could explore the world of microelectronics in a playful and entertaining way. About 1,200 visitors per day came to try out the exhibits. A real highlight was the experimental laboratory provided with eight IMS boards.

Our current IMS Newsletter can be found under Publications - Current publications.

U.R.S.I. Kleinheubacher Tagung 2008

September 22, 2008 - September 25, 2008

The IMS will be giving two presentations at the "U.R.S.I. Kleinheubacher Tagung" in Miltenberg

Presentation J. Burghartz, September 22, 2008
"Ultra-thin Chips - a New Paradigm in Mikroelectronics"

Presentation A. Asif; H. Richter; J. Burghartz, September 23, 2008
"High-voltage thin-film LDMOS transistor for integrated driver circuits in flexible displays"

For further information, please go to http://meetings.copernicus.org.

Location: Altes Rathaus, Hauptstr. 137, 63897 Miltenberg

IMS CHIPS at Motek 2008

September 22, 2008 - September 25, 2008

The IMS at MOTEK 2008 – Global Trade Fair for Automation at the Heart of European Industry.

Motek 2008 www.motek-messe.de

Location: Stuttgart, Hall 8. Booth 8528
Time: 9.00 am to 5.00 pm
Costs: 25,00 €

IISB Lithography Simulation Workshop

September 18, 2008 - September 20, 2008

The IMS will be giving a presentation at the "6th Fraunhofer IISB Lithography Simulation Workshop" in Athens.

Presentation Holger Sailer, September 19, 2008
"Determination of proximity effect correction parameters for fabrication of nanoimprint templates using variable shaped beam lithography"

For further information, please go to http://www.litho-workshop.de/cms/website.php

Location: Hilton Hotel Athens, Greece
Time: 9.00 am

Sponsoring of the IMS hands-on course for students

August 04, 2008

IMS thanks the following companies for sponsoring the hands-on course for students in 2008.

SMC - Practical course for students

July 14, 2008 - July 25, 2008

Location: Allmandring 30a, 70569 Stuttgart
Time: 9.00 am to 5.00 pm

25 Years Institut für Mikroelektronik Stuttgart

July 09, 2008

On July 18th, 1983, the Institut für Mikroelektronik Stuttgart was established.
It is one of the first research institutes founded in the early 80s to support local industry competing for market shares on the global microelectronics market and to offer sustainable support in the competition with Japan.

Equipped with a financial base of 90 Million German marks coming from the federal government, the state of Baden-Württemberg and industrial partners a building on Allmandring 30a on the premises of Universität Stuttgart was made available and, between 1985 and 1986, a for its time high-tech "cleanroom" was set up. The cleanroom facilitating complete equipment for the production and testing of micro chips was considered the ultimate for a research institute back then. Specializing in the manufacture of micro chips without masks but rather through a "direct writing process" in small quantities is central to the IMS business. This makes the IMS an important partner to small and medium scale companies who, of course, require fewer quantities of micro chips and would otherwise fail to cost-efficiently acquire their "own" microchips unlike large scale coporations.

25 years later, on July 18th, 2008, the IMS would like to commemorate its 25 Year Anniversary together with leading representatives and partners for industry, politics and science.

ASIC workshop 2008

May 27, 2008

On May 27th this year´s ASIC workshop will be held once again displaying the latest developments in integrated circuits, micro controllers, FPGAs and ASICs as well as innovative chip packages and packaging techniques. Imaging of the latest feasibilities in the GATE FOREST^® technology. Cost-efficient chip development and serial production according to customer specifications suitable for small and medium scale companies. Following the half-day workshop the annual IMS sponsors association will meet. In addition, we will offer noncommittal initial consultation for chip development.   

For further information, please refer to: IMS_ASIC_Workshop_08.pdf

Registration: workshop@ims-chips.de

Location: IMS, Stuttgart
Time: 9.00 am to 6.00 pm

Hannover Fair, Hall 2 - Booth C21

April 21, 2008 - April 25, 2008

Visit us at the joint Baden-Württemberg International stand in Hall 2, Booth C21.

We will be presenting the latest developments in the GATE FOREST^® technology.

www.hannovermesse.de

Location: HANNOVER MESSE, Halle 2, Stand C21

SPIE Photonics Europe 2008

April 07, 2008

The IMS will be giving a presentation at the Photonics Europe in Straßburg.

Presentation Franz X. Hutter, April 08, 2008
"A new high speed thermal imaging concept based on a logarithmic CMOS imager technology"

For further information, please go to www.spieeurope.org/exhibit.

Location: Palais de la Musique et des Congrès, Strasbourg, France

EU project MAGIC launched

March 28, 2008

The continuous development in the field of maskless lithography during IC production is the center of the research project “MAsk less lithoGraphy for IC manufacturing” (MAGIC) sponsored by the EU with 11.7 Mio. Euros.  

Using a perforated plate this maskless lithography process divides a parallel electron beam into thousands of individual beams. Following this, each individual opening is accessed through a CMOS chip using a second aperture plate a distraction unit and switched to “on” and/or “off”. Employing 200 fold reduction projection optics the individual switched-on apertures are then mapped into the substrate level.

The following two main goals are to be realized within the 3-year project duration:

- Development and manufacture of an alpha tool for the 32 nm technology node maskless lithography

- Development and allocation of a complete European-wide infrastructure for maskless lithography

The Institut für Mikroelektronik Stuttgart is in charge of the development and production of the electron arrays mentioned above that control the individual electron beams.

Press report on MAGIC in Electronic Media -Semiconductor International

Newsletter issue 1 2008

March 27, 2008

We present our IMS newsletter.

In this newsletter (issue 1, 2008) we would like to give you some highlights of our ongoing activities at the Institut fuer Mikroelektronik Stuttgart. The topics of the current issue are:

Two presentations by IMS CHIPS on the ISSCC Conference in San Francisco In an invited talk Professor Joachim Burghartz reported on the amazing capacities of modern image sensors developed by IMS CHIPS in many years of research work. The second talk concerned flexible microchips. The durability of ultrathin microchips was shown, which were mounted on appropriate foils in order to integrate them, for example, in banknotes or textiles

NANOIMPRINT TEMPLATES The UV nanoimprint technology has increasingly developed into an attractive technology, enabling the economical reproduction of very small structures. IMS CHIPS is partner of the MEDEA project FANTASTIC, a European research association for the development of the UV nanoprint lithography.

GATE FOREST^® – technology expanson ASICs from IMS CHIPS have the reputation of being robust and reliable microchips for safety applications and extreme operating conditions in space. The new technology family provides two additional chip masters, having an increased number of digital gates besides numerous analog cells and specially developed RAM and ROM blocks.

HDRC^®-Q-PyroCam – Progress in ratio pyrometry Dielectric interference filters replace optical color filters in image sensors for imaging temperature radiation measuring techniques. The image sensors developed by IMS CHIPS are not only used for conventional image processing but also for the measurement and presentation of the local thermal distribution on surfaces.

Our current IMS Newsletter can be found under Publications - Current publications.

Image Sensors Europe, Conference

March 19, 2008 - March 20, 2008

The IMS will be giving a presentation at the Image Sensors Europe in London.

Presentation Markus Strobel, March 20, 2008
"High dynamic range (HDR) vision with logarithmic CMOS image sensor "

For further information, please refer to the Image Sensors WEB brochure.

Location: Copthorne Tara Hotel, Kensington, London, UK

MicroTEC Südwest in the finals

March 11, 2008

MicroTEC Südwest has achieved a stage win by being one of 12 competitors to reach the second round of the Bundesministerium für Bildung und Forschung Spitzencluster competition!   

The most important criteria during the cluster selection process were the already achieved development stage, particularily, the developmental potential and dynamics as well as the creativity and innovation of the strategic approach.   

In September 2008 the finalist of the second round will be announced. The BMBF will sponsor the strategy implementation of as many as 5 clusters in the next five years and provide funds of up to 200 Mio. Euros.

For further information on the Spitzencluster competition and the selected competitors for round two, please visit www.microtec-suedwest.de and www.bmbf.de.
Source:MicroTEC Südwest

The IMS is participating with MicroTEC Südwest in the development of production plattform for ultrathin microchips and their application in complex hybride micro systems.

A workshop will be held on Monday, April 7th, 2008 between 2 p.m and 6 p.m. in preparation of the proposal.

For further information and registration, please contact
Dr. Christine Harendt.

hema presenting the HDRC^® image sensor "seelector ICAM"

March 04, 2008

Live demonstration with seelector ICAM weld!

The combination between an intelligent camera and a digital high-capacity sensor is the key to success. Using the seelector ICAM weld and combining the highly-dynamic HDRC^® sensor developed by the IMS and the intelligent image processing enables the monitoring of several welding processes at the same time.

Find out more on the seelector ICAM weld for your welding requirements at the Stuttgart based LASYS 2008 trade show between March 4th and 6th.

For further informationen on the seelector ICAM weld, please visit http://www.hema.de
or refer to the hema newsletter 07-2008.

Location: Stuttgart, Neue Messe, Halle 4 / Stand C71

IMS CHIPS at SPIE Advanced Lithography 2008

February 24, 2008 - February 29, 2008

High resolution nanoimprint templates for dual damascene applications will be the focus of a presentation held by Dr. Mathias Irmscher at the semiconductor lithography industry's most important technical event in San Jose.

The Institut für Mikroelektronik Stuttgart (IMS CHIPS) is substantially supporting research and development activities in the field of advanced lithography for the manufacturing of microchips. Nanoimprit templates applications are a promising perspective for next generation lithography.

The Presentation
"High Resolution Nanoimprint Templates for Dual Damascene – Fabrication and Imprint Results "

The Authors
Mathias Irmscher, Joerg Butschke, Corinna Koepernik, Lorenz Nedelmann, Marcus Pritschow, Christian Reuter, Holger Sailer, IMS Chips, Stuttgart, Germany;
Jordan Owens, Ken Sotoodeh, Ron Carpio, Bruce Wilks, Jeff Wetzel, ATDF Inc. Austin, TX, USA;
Brook Chao, Frank Palmieri, Wei-Lun Jen, C. Grant Willson, University of Texas, Austin, TX, USA.

For further information, please go to spie.org/advanced-lithography.xml

Location: Convention Center, San Jose, California, USA

New GFQ master

February 05, 2008

Two more masters are available for the GATE FOREST^® ASIC family.

With the GFQ10 (10,000 gate equivalents) the production of significantly less expensive ASICs compared to chips previously based on the GFN012 master (also 10,000 gate equivalents) has become possible by shrinking the circuit structures. This allows a chip size reduction from 23 mm² to 11 mm² and thus maintaining a 3.3 V / 5 V compatibility.
The chip area of the GFQ060 with 60,000 gate equivalents compares to a GFN024 (20,000 gate equivalents) and adds comprehensive standard analog functions as well as optimized RAM structures.
After the qualification process both master types will be available for development and volume production of application-specific ICs at the IMS.

ISSCC International Solid-State Circuits Conference 2008

February 03, 2008 - February 07, 2008

The IMS will be giving two presentations at the ISSCC in San Francisco.

SESSION 7 – ELECTRONICS FOR LIFE SCIENCES

7.4 CMOS Imager Technologies for Biomedical Applications
J. Burghartz, T. Engelhardt, H-G. Graf, C. Harendt, H. Richter, C. Scherjon, K. Warkentin

Two CMOS imager chips are described. The first is a sub-retinal implant, being the only imager chip ever implanted into a human eye that partially restores vision to a blind patient. The second is a miniature imager chip, based on a thin-film-on-CMOS (TFC)pixel technology provides an optimum trade-off between sensitivity and pixel size.

Monday, February 4th, 3:15 PM

SESSIONS 18 – MOS MEDLEY

18.3 Ultra-Thin Chips on Foil for Flexible Electronics
H. Rempp, J. Burghartz, C. Harendt, N. Pricopi, M. Pritschow, C. Reuter, H. Richter, I. Schindler, M. Zimmermann

Complex digital and mixed-signal circuits on 20μm-thin CMOS chips attached to foil and exposed to mechanical strain are demonstrated. The piezoelectric effect in the CMOS transistors will reduce the parametric yield in circuit designs based on tight process variations. Suppression of the effect is achieved by layout optimization, cancellation techniques or widening of the process corners.

Tuesday, February 5th, 4:15 PM

For further information, please go to
www.miracd.com/isscc2008/WebAP2008

Press Release ISSCC 2008 Presentation "Retina Chip

Press Release ISSCC 2008 Presentation "Chipfilm"

Location: Marriott Hotel, San Francisco, CA, USA

Closing Event: "Idea to Product"

January 14, 2008

In close cooperation with EAZ Aalen and several small- and medium-scale companies , IMS has developed an innovation guideline to support enterprises with innovative product development processes.
The closing event takes place in Aalen on 15 January.

Press release VIP closing event

For further information, please go to http://vip.eaz-aalen.de

Season´s Greetings

December 16, 2007

IMS Season´s Greetings.jpg

Germany's Federal Criminal Police Office (BKA) publishes the final report "Authentizität digitaler Bilder II" ("Authenticity of Digital Images - Part II") by IMS

December 10, 2007

The Institut für Mikroelektronik Stuttgart was commissioned by the BKA to realize a demonstrator of a digital camera provided with an electronic signature component. Based on a feasibility study by the Fraunhofer Society, IMS has developed a camera demonstrator delivering fraud-resistant image data. An individual signature information is added to each image file thus making it possible to detect any manipulations immediately. This is important in case digital images are used as evidence.

For further information, please refer to http://www.bka.de

ABBILD - BMBF project wrapped up successfully!

November 30, 2007

The ABBILD project launched in 2003 and supported by the BMBF with 63.3 mio. € has successfully been wrapped up.
Cooperating with the Institut für Mikroelektronik Stuttgart the project yielded unique technological progress in chip, tool, mask and software developments.

ABBILD project press release as pdf: ABBILD_Abschluss_07_11_29.pdf

For further information, please go to
www.nano-abbild.de

The IMS exhibits at Innovation Fair & Congress 07

November 29, 2007

On the November 29th the "Innovation Fair & Congress 07" will be held once more, this time at Neue Messe in Stuttgart. The "Innovation Fair & Congress 07" is organized by the State of Baden Württemberg, Connected, the Kompetenznetz Mechatronik and Photonics BW.

Top field specialists as well as companies spanning across all sectors are expected to present their products, processes and services.

Under the patronage of the minister of research, Frankenberg, the experts will detail how companies maintain a sustainable market advantage by demonstrating best practise examples. Following the congress around 50 exhibitors will be presenting their ideas on products, processes and services at the bwcon: Innovation Fair. The fair shall offer an interdisciplinary plattform to exchange new ideas and possibilities and create a dialog across sectors. All exhibited innovations will be evaluated by the participants. The best ones will receive the "Best Innovation Award 2007" sponsored by Agilent Technologies.

For further information, please refer to the "Flyer Innovation Fair" flyer.

Location: ICS Internationales Congresscenter Stuttgart, Messepiazza, 70629 Stuttgart
Time: 9.00 am to 5.30 pm
Costs: 140,- Euro

Article in Photonik magazine on the application "Thin-Film-on-CMOS

November 15, 2007

The Fachzeitschrift für die Optischen Technologien, Photonik, has publized an article in its 5/2007 issue on the application "Thin-Film-on-CMOS - verbesserte Bildsensoren für spezielle Anwendungen" carried out at the IMS.

For more information, please go to
www.photonik.de

The IMS exhibits at VISION 2007 fair in Stuttgart

November 06, 2007 - November 08, 2007

We will be presenting the new HDRC^® Q-PYRO CAM und new HDRC^® camera applications at the 20th international trade fair for machine vision and identification technologies.
An additonal high light at this year´s fair booth will be the SafetyEye^® product equipped with HDRC^® sensors developed by the Ostfildern based Pilz GmbH & Co KG for a safe surveillance of a three-dimensional area.
For further informationen on SafetyEYE^®, please refer to Fields of activity - Industrieal applications

VISION 2007 cms.messe-stuttgart.de

Location: Stuttgart, Hall 2.0. Booth 2A02
Time: 9.00 am to 5.00 pm
Costs: 10 EUR inc. VAT

5th Workshop "Masks and More" 2007

October 26, 2007

This year’s Lithography Workshop will be held on October 26. The program and registration form are available now.

For more information and online registration, please refer to lithoworkshop.ims-chips.de

Location: IMS Stuttgart

SPIE Photomask Technology 27th Annual Symposium (BACUS 2007)

September 17, 2007 - September 21, 2007

Lecture: Marcus Pritschow

Fabrication of nano-imprint templates for Dual-Damascene applications using a high-resolution varable shape e-beam writer

Marcus Pritschow, Joerg Butschke, Mathias Irmscher, Holger Sailer, Institut für Mikroelektronik Stuttgart (Germany); Doug Resnick, Ecron Thompson, Molecular Imprints, Inc

Poster Session: Jörg Butschke

Resistless mask structuring using an ion multi-beam projection pattern generator

Joerg Butschke, Mathias Irmscher, Florian Letzkus, Institut für Mikroelektronik Stuttgart (Germany); Hans Loeschner, IMS Nanofabrication AG (Austria); Lorenz Nedelmann, Institut für Mikroelektronik Stuttgart (Germany); Elmar Platzgummer, IMS Nanofabrication AG (Austria)

For more information, please go to http://spie.org/photomask.xml

Location: Monterey, CA, USA

Chipfilm joint project launched

August 28, 2007

The Institut für Mikroelektronik Stuttgart (IMS CHIPS) in cooperation with the Institut für Physikalische Elektronik (ipe) has developed a new process for the manufacture of extremely thin silicon chips.

Within the chipfilm project these silicon components are tested for their electrical, optical, mechanical and thermal characteristics.

Together with our partners we are conducting tests whether this new process can be implemented into an industrial process line.

For further information, please refer to
http://chipfilm.ims-chips.de

SMC - Practical course for students

July 16, 2007 - March 27, 2007

For the 16th consecutive time this two-week practical course is held for students finishing the upper two levels of secondary school and this time presenting itself with a new and updated agenda:

Lectures on electronics and chip design have been switched onto new CAD tools and a new trial for pc-based autodidactics will be initiated. The hardware plattform IC Lab now enables more flexible programming for challenging trials and projects. The cooperation with teachers and schools will intensify.

For more information, please refer to
Practical course for students

Location: Allmandring 30a, 70569 Stuttgart
Time: 9.00 am to 5.00 pm

New HyperBraille user interface for the blind and the vision impaired

July 09, 2007

With the development of a new user interface for computers the blind and the vision impaired will be able to use graphic displays similar to the ones commonly used in computer software.
The HyperBraille project has developed a high resolution tactile display. Thousands of tiny followers are arranged on an area and lifted piezoelectical by drive and thus made palable.
HyperBraille takes it even a step further and offers the possibility to interact: the HyperBraille display recognizes whether the user touches the display and reports this to the computer. By doing so, „select“ of a bottom in a Windows application is carried out.
IMS CHIPS develops and delivers ASICs to control the shift key and to recognize the touch position to the Stuttgart based Braille module market leading project manager Metec AG.

The project is sponsored within the „Next Generation Media“ program by the Bundesministerium für Wirtschaft und Technologie.

Successful launch for TerraSAR-X – Microchips from Stuttgart on Board

June 15, 2007

Taking off from Cosmodrome Baikonur in Kazakhstan on 15 June the German radar satellite TerraSAR-X has been shot into space.
On board are several microchips that were developed and manufactured at the Institut für Mikroelektronik Stuttgart. Opposed to terrestrial requirements the surrounding conditions in space are extreme for electronics: heat, cold, radiation, vibration, speedy acceleration und vaccum space are putting the elaborate on-board electronics of satellites to the test. The Institut für Mikroelektronik Stuttgart in Stuttgart-Vaihingen has specialized in microchips and sensors under severe conditions for a long time. On behalf of the TerraSAR-X manufacturer, the Deutschen Zentrum für Luft- und Raumfahrt (DLR) and the former European manufacturer of satellite for space, EADS-Astrium GmbH, the IMS has developed and manufactured several complex microchips. The chips have successfully been qualified for the elaborate space requirements and are now implemented on board the TerraSAR-X.

For further information, please visit
www.terrasar.de

Nanoimprint Lithography - Project FANTASTIC

June 14, 2007

Nanoimprint Lithography is a prospective candidate as a Next Generation Lithography (NGL) tool in microelectronics. Due to its advantages in the resolution and cost efficiency it has been adapted into the Semiconductor Technology Roadmap (ITRS) tool at the 32 nm node and beyond.
The MEDEA⁺ FANTASTIC project addresses the development and assessment of UV Nanoimprint Lithography for high resolution and high throughput microelectronics applications. The project will investigate all aspects of the technology involved including imprint tools, template fabrication and CMOS integration.
IMS is responsible for the development of the nanoimprint template manufacturing process.

For further information, please visit www.fantastic-project.org

IMS CHIPS exhibits at MiNaT 2007

June 12, 2007 - June 14, 2007

The International Trade Fair for Precision Mechanics and Ultra Precision, Micro and NanoTechnologies in Stuttgart.

IMS will be presenting ultra-thin microchips, micromechanical silicon components and developments formicro handling technology.

MiNaT, Messe Stuttgart, June 12 - 14, 2007

http://www.messe-stuttgart.de/minat/

Conference programme 13th SENSOR Conference

May 22, 2007

Presentation by EAZ Aalen und IMS on "SensorLab: blended learning im Bereich der Sensorik"

K. Meißner, EAZ Aalen; E. Futterer, Institut für Mikroelektronik Stuttgart

The presentation will be held during the special S1 session: "Innovative Training Concepts"

For more information, please go to www.sensorfairs.de

Location: Nürnberg, CCN1, Raum Istanbul
Time: 11.15 am

6th Annual Mechatronics Day in Göppingen

May 09, 2007

On 9 May the Mechatronics Network of Competence will hold the 6th Annual Mechatronics Day in Göppingen. The event going under the title of "Technology Transfer - a Factor of Success" will be presenting best practice examples for successuful cooperations between research institutions and industry.
The event is geared towards R&D enterpreneurs, executives and managers. The Minister of Science, Research and the Arts of Baden-Württemberg, Dr. Peter Frankenberg, will open the event. In addition to other high-ranking speakers, Prof. Dr. Ing. Joachim Burghartz will hold the "Microelectronics as innovation driver for small and medium enterprises" presentation.
Information booths of the Institut für Mikroelektronik Stuttgart and other research institutions will offer the opportunity to get more detailed information about the cooperation between research and industry.

In German only PDF: mechatronik0307-02.pdf

Location: Göppingen
Time: 1.00 pm to 6.00 pm

Photomask Japan 2007

April 17, 2007 - April 20, 2007

Paper
3D Template fabrication process for the Dual Damascene NIL approach
Joerg Butschke a, Mathias Irmschera, Douglas Resnick b, Holger Sailer a, Ecron Thompson b
a IMS Chips, Allmandring 30a, D-70569 Stuttgart, Germany
b Molecular Imprints, Inc. 1807-C W. Braker Lane, Austin, TX 78758, USA

Poster Session
Dry Etch Behaviour of Different TaN Absorber Layers for EUVL Mask Making
Florian Letzkus*a, Günther Hess b, Mathias Irmscher a, Konrad Knapp b, Markus Renno b, Eugen Röhrle a, Holger Seitz b

For more information, please go to www.photomask-japan.org

Location: Yokohama

Hannover Fair, Hall 2 - Booth C19

April 16, 2007 - April 20, 2007

The institute will be presenting some most interesting developments for space applications as well as new sensors for contactless temperature measurements featuring an extremely wide temperature range on the joint participation booth of Baden-Württemberg in Hall 2 Booth C19.

www.hannovermesse.de

Advanced Night Vison Systems - NIRWARN

April 05, 2007

Night vision systems are driver assistance systems supporting car drivers at night. The first generation of night vision systems has already been introduced to the market.
The public-funded project NIRWARN supports research efforts on the second generation of night vision systems with an integrated warning function, i.e. these systems can detect objects on the road and determine whether an object is classified as safety-critical obstacle or not.
Cooperating in the NIRWARN project are the Institut für Mikroelektronik Stuttgart (IMS CHIPS), DaimlerChrysler AG, Docter Optics GmbH and Robert Bosch GmbH. The project consortium has just presented the first promising results during a conference at the Institut für Mikroelektronik Stuttgart.

In German only: www.bmbf.de/de/6107.php

We present our IMS newsletter

April 02, 2007

With this newsletter issue 1 2007 we would like to inform you about some highlights of our activities at the Institut fuer Mikroelektronik Stuttgart. The topics of the current issue are:

Safe Production of Ultra-thin Microchips
New process technology enables ultra-thin flexible microchips:
IMS CHIPS manufactures for the first time chips of a diameter of 20 micrometers.

Fast Microgripper
Handling Technique of Microcomponents Utilizes FastSolenoid Valves and a Compact Modular Concept

With SafetyEYE^®
the Pilz Company Presents a Genuine Innovation and Causes a Sensation among Experts

IVP
The Smallest Endoscope Camera Contains IMS HDRC^® Image Sensor

Our current IMS Newsletter can be found under Publications - Current publications.

Welcome back after our Relaunch!

March 14, 2007

We have redesigned and updated our IMS website.
Our new internet presence presents itself in a "brighter, faster and up-to-date" fashion with new and updated content for you!

33. Bildverarbeitungsforum in Mannheim

March 06, 2007

For more information, please go to www.bv-forum.de

Location: John Deere Werke Mannheim
Time: 1.00 pm to 6.00 pm

Website relaunch

March 04, 2007

On March 12 the Insitut für Mikroelektronik Stuttgart will relaunch its internet presence. The new design will improve readability and allow quicker and more flexible access to all the institute's information about products and services.

VIP Innovations-Workshop

March 01, 2007

Location: Fraunhofer-IAO/IAT,Nobelstr. 12, 70569 Stuttgart Gebäude G (Turm 1) Raum 101 ServLab
Time: 10.00 am to 3.00 pm

Article in Spiegel magazine on HDR photography

March 01, 2007

Der Spiegel magazine has published an article on HDR photography in its July 2007 issue. In it the Institute for Microelectronics Stuttgart is mentioned as frontrunner of the HDR topic for industrial application having patented HDRC technology as early as 1992 already.

Retina Implant

February 22, 2007

The chip developed by IMS CHIPS is an essential part of the subretinal implant engrafted in people who went blind because of degenerative retinitis.First results show in principle the feasibility of such a treatment.

More information: Lichtblick_fuer_Blinde.pdf

SafetyEYE^®- a safe look with HDRC^® image sensors

February 22, 2007

SafetyEYE^® represents the first safe video system, able to both monitor and control dangerous production processes, and protect assets against unauthorized access. SafetyEYE^® is a safe video system, developed by Pilz GmbH & Co. KG, located in Ostfildern in cooperation with DaimlerChrysler. For SafetyEYE^®, the Institut für Mik-roelektronik Stuttgart designed a new HDRC^®image sensor chip and extended its functionality by special safety features.

For more information, please go to www.pilz.de

Intensive Course Microelectronic Technology

February 19, 2007 - February 22, 2007

The well-established intensive course "Mikroelektronik-Technologie" is conducted once a year with participants coming from industry and university alike.
More information: Fields of activity - Microelectronics workshops

Location: Allmandring 30a, 70569 Stuttgart
Time: 9.00 am to 5.00 pm

New ultra-thin chip fabrication process

December 12, 2006

IMS CHIPS developed a new ultra-thin chip fabrication process in collaboration with the Institute for Physical Electronics (IPE) of the University of Stuttgart. The new process was presented at the International Electron Devices Meeting IEDM 2006 in San Francisco on December 12, 2006.

For more information, please go to
Competence - Thin-film silicon

International Electron Devices Meeting

December 11, 2006

IMS and IPE to present new ultra-thin chip fabrication process at IEDM 2006 in San Francisco.

Location: Hilton San Francisco and Towers San Francisco, CA, USA

Best Paper Award at Photomask Japan 2006

November 21, 2006

A new type of phase shifting masks (EAPSM) based on bi-layer material Ta/Sio2 has been developed and characterized in cooperation with Schott Lithotec, Germany, Zeiss SMS. Germany IMEC. Belgium and Institut für Mikroelektronik Stuttgart, Germany. Their paper “Comparative Study of Bi-Layer Attenuating Phase-Shift Mask for Hyper-NA Lithography“ received the Best Paper Award of the conference.

Brilliant recording with high-dynamic digital camera, optimized signal processing and rendering with a new type of display.

November 21, 2006

Compared with the human visual perception capability, existing cameras and displays are restricted as to their possibility of rendering the dynamics of brightness and the color range. Cameras provided with HDRC^® (High Dynamic Range CMOS) image sensors developed by IMS CHIPS enable live recording of scenes under extreme illumination conditions. Due to the combination of HDRC^® image sensors, image processing algorithms and a new type of display, the complete extent of brightness and colors can be recorded and rendered.

More information: vdi-Nachr_038_2006-S11_K.pdf

Workshop on ''Microhandling''

October 31, 2006

Presentation of the results of the BMBF-funded project.

Location: Institut für Mikroelektronik Stuttgart
Costs: 45 EUR

Lithography Workshop 2006

October 26, 2006

This year’s Lithography Workshop will be held on October 27. The program and registration form are available now.

Location: IMS Stuttgart

IMS at the fair VISION 2006 in Stuttgart

October 23, 2006 - November 09, 2006

IMS presents its latest HDRC cameras and applications at the international trade fair for machine vision and identification technologies.

Location: Stuttgart, Hall 1.0. Booth 1.0.111
Time: 9.00 am to 5.00 pm
Costs: 10 EUR inc. VAT

Intensive Course Microelectronic Technology

July 31, 2006 - August 04, 2006

Location: Allmadring 30a, Stuttgart
Costs: see link/application form

Microchips - a Hands-on Course for Students

July 24, 2006 - August 04, 2006

''Sensor technology - the way to the future''

May 22, 2006

SensorLab the innovative Web-based tuturial by IMS and EAZ concerning sensor technology is presented in the journal ''Sensorik aktuell'' edition 1/2006

Workshop ''New Applications in Silicon Technology''

May 17, 2006

The workshop will be held at IMS in Stuttgart. In the course of its reorientation, IMS is seeking dialog with its established and new customers.

Location: Institut für Mikroelektronik Stuttgart

MORE than Moore – New Applications in Silicon Technology

May 08, 2006

Lecture by Prof. Dr. J. Burghartz at the University of Stuttgart

Location: Seminar Room 4.282, Faculty of Computer Science, Electrical Engineering and Information Engineering

Exhibition at the Solar Information Center in Freiburg/Brsg., Germany, by members of the Baden-Wuerttemberg Association for Mircrosystem Technology (MST BW)

May 04, 2006

Hannover Fair, Hall 2 - Booth C19

April 24, 2006 - April 28, 2006

You will find us at the partner booth of Baden-Wuerttemberg International in hall 2, booth C19.

Lecture on Semiconductor Technology 2

April 05, 2006

by Prof. Dr. J. Burghartz at the University of Stuttgart as from the summer semester 2006.

European project IVP successfully completed

March 06, 2006

The joint project "Intracorporal Videoprobe IVP", a development project realised with four partners within the European IST programme, was successfully completed at the end of 2005. Miniaturised videoprobes for medical engineering with specially adapted CMOS image sensors, micromechanical components, and image processing and diagnosis software have been developed by a consortium managed by IMS. Thus very small-sized high-dynamic image sensors make it possible to produce small endoscopes.

Intensive Course Microelectronic Technology

February 20, 2006 - February 24, 2006

Location: Allmadring 30a, Stuttgart

Prof. Dr. J. Burghartz has been appointed new director at IMS

October 01, 2005

Since October 2005 Prof. Dr. J. Burghartz has been director of the Institut fuer Mikroelektronik Stuttgart and full professor at the University of Stuttgart, Germany, He succeeds Prof. Dr. B. Hoefflinger who has retired.

The first eight EUV fullfield masks have been manfactured for ASML

August 10, 2005

In the last six months of the year the first eight EUV fullfield masks for alpha scanner tool qualification have been manufactured and delivered. After absorber and buffer etching minimal structures within the 100 nm range could be achieved.