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IMS CHIPS Calendar - Microelectronic Arts

Edition 2018

This is the first edition of our “Microelectronic Arts” calendar.
It is made of a selection of images from our research facility containing exceptional micro and nano technological themes. The images were recorded using various processes and some were subsequently colored.

Resist process development of photonic structures. The colors are created using diffractive and interferential effects.
Microscopic image

Recording artifacts in overexposed resist, the color codes the height of the structure.
Confocal microscopic image

Top view of a ChipFilm™ chip´s back with a porous layer of a 1 µm Si pillar.
Scanning electron microscope (SEM) image, colored

Cross fracture of a ChipFilm™ membrane wafer with Si substrate, porous silicon layer (1 µm), pillar (1 µm) and a deposited silicon layer.
SEM image, manually colored

Aluminum wire with aluminum fluoride crystal
SEM image, manually colored

Single piece of RIE grass created during a deep-reactive-ion-etching (DRIE) process with a diameter of 350 nm.
SEM image, manually colored

Tempered highly porous thermally oxidized silicon layer. Layer thickness 500 nm.
SEM image, manually colored

Detail of lateral mounting structures on a ultra-thin silicon chip created through ChipFilm™ technology following the post-process step
Microscopic image, colored

Dense lines in resist during the resist evaluation.
SEM image, colored

Structured pyramid structures in resist created using e-beam lithography.
SEM image, colored

Photonic chip with spiral wave ducts on a SOI substrate with membrane etching. The colors are created using diffractive and interferential effects.
Microscopic image

Section of a test chip during the development of the gold electrode process. The light-colored AI connect pads are 90 x 90 µm.
Microscopic image

Curve shape of a silicon waveguide on silicon oxide (SOI substrate).
SEM image, manually colored