This is where FlexPacFAM offers an excellent alternative:
In the completed AiF-sponsored FlexPacFAM project (FV-Nr. 17602 N) saw the exemplary development, production and successful reliability study of closed conductor board-based QFN packaging (QFN-FlexPac / Inertialsensor-FlexPac) and QFN packaging with an opening (Image sensor-FlexPac) using the film-assisted molding process (FAM).
This proved the technologyĀ“s potential for readily available packaging solutions. Based on the project results, commonly used standard packages can be produced on a conductor board basis. Also, a transfer from expensive metal and ceramics packages to conductor board-based is easily realized.
In contrast to the common transfer molding the FAM technique has both halves of the tool covered with thin foil in order to avoid direct contact between the Duroplast and the form. The advantages of this process make a simplified and more cost-efficient mould possible.