Publications
 

Current publications

IMS Newsletter 2 / 2019

IMS Infofolder

Tamas Steinbach, Constantin Csato, Florian Krippendorf, Florian Letzkus, Michael Rüb, Joachim Burghartz
Large area Silicon-energy filters for ion implantation [Conference papers (reviewed)]
in Proc. of 45th International Conference on Micro & Nano Engineering (MNE) , Rhodes, Griechenland, (Poster), Microelectronic Engineering, February 1, 2020, vol. 222, no. 1 (2020)
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Mamta Pradhan, Saleh Ferwana, Christine Harendt, Harald Richter, Joachim N. Burghartz
Ultra-thin Capacitors in Silicon for 3D-Integration and Flexible Electronics [Conference papers (reviewed)]
in 2019 22nd European Microelectronics and Packaging Conference & Exhibition, Pisa, Italy, (Vortrag), January 9, 2020, pp. 1-6, ISBN: 978-0-9568086-6-0 (2020)
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Ute Zschieschang, James W. Borchert, Michele Giorgio, Mario Caironi, Florian Letzkus, Joachim N. Burghartz, Ulrike Waizmann, Jürgen Weis, Sabine Ludwigs, Hagen Klauk
Roadmap to Gigahertz Organic Transistors [Papers of journals (review)]
Advanced Functional Materials, WILEY-VCH Verlag GmbH & Co. KGaA, p. 9, November 25, 2019, DOI: 10.1002/adfm.201903812 (2019)
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Sefa Özbek, Markus Grözing, Golzar Alavi, Joachim N. Burghartz, Manfred Berroth
Three-Path SiGe BiCMOS LNA on Thinned Silicon Substrate for IoT Applications [Conference papers (reviewed)]
in Proc. of 48th European Microwave Conference (EuMC), Madrid , Spain, (Vortrag), IEEE, November 22, 2019 (2019)
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Lars Heuken, Alessandro Ottaviani, Dirk Fahle, Thorsten Zweipfennig, Gerrit Lükens, Holger Kalisch, Andrei Vescan, Michael Heuken, Joachim N. Burghartz
Limitations for Reliable Operation at Elevated Temperatures of Al2O3/AlGaN/GaN Metal–Insulator–Semiconductor High-Electron-Mobility Transistors Grown by Metal-Organic Chemical Vapor Deposition on Silicon Substrate [Papers of journals (review)]
2019 Physica Status Solidi (A) Applications and Materials Science, WILEY-VCH Verlag GmbH & Co. KGaA, vol. 216, no. 23, p. 8, November 8, 2019, DOI: 10.1002/pssa.201900697 (2019)
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Björn Albrecht, Mourad Elsobky, Thomas Deuble, Christine Harendt, Joachim N. Burghartz
HySiF – hybride Systeme in Folie [Konferenzbeitrag]
in Fachsymposium Hybrid Senor, Karlsruhe, Deutschland, (Vortrag), 7. November 2019 (2019)

Björn Albrecht, Mourad Elsobky, Thomas Deuble, Christine Harendt, Joachim N. Burghartz
The flexible package for ultra-thin sensors and readout chips [Article in magazines]
OPE Journal, Deutscher Fachverlag, vol. 9, no. 29, pp. 14-15, November 1, 2019 (2019)

Björn Albrecht, Mourad Elsobky, Matthias Moser, Saleh Ferwana, Christine Harendt, Joachim N. Burghartz
Chip-Film Patch – Packaging Technologie zum Einbetten ungehäuster, funktionaler Siliziumchips in extrem dünne Folien [Konferenzbeitrag]
in MikroSystemTechnik Kongress 2019, Berlin, Deutschland, (Vortrag), 28. Oktober 2019, Seite 255-258, ISBN: 978-3-8007-5090-0 (2019)
PDF orig.

Joachim Deh, Thomas Deuble
IMS Newsletter 2/19 deutsch [Newsletter]
Institut für Mikroelektronik Stuttgart, 16. Oktober 2019, 4 Seiten, no. 24 (2019)
PDF orig.

Joachim Deh, Thomas Deuble
IMS Newsletter 2/19 english [Newsletter]
Institut für Mikroelektronik Stuttgart, October 16, 2019, p. 4, no. 24 (2019)
PDF orig.