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2020 International Journal of Microwave and Wireless Technologies Best Paper Award

January 13, 2021

As part of the DFG`s (Deutsche Forschungsgemeinschaft) FFlexCom program (2016-18), scientists of the INES, IHF, and INT research facilities at the University of Stuttgart worked on a flexible film with integrated high-frequency chips and antennas. Using the Chip-film Patch technology developed at the IMS, foil systems with thinned BiCMOS chips and specially adapted antennas were fabricated, allowing signal transmission at the 5-6 GHz band.
The publication of the results in the "International Journal of Microwave and Wireless Technologies" has now been honored with the "Best Paper Award".

The Toward a flexible and adaptive wireless hub by embedding power amplifier thinned Silicon chip and antenna in a polymer foil paper was published by Golzar Alavi1, Sefa Özbek2, Mahsa Rasteh3, Markus Grözing2, Manfred Berroth2, Jan Hesselbarth3 and Joachim N. Burghartz1 of 1Institute for Nano-and Microelectronic System (INES), 2 Institute of Electrical and Optical Communications Engineering (INT) and 3Institute of Radio Frequency Technology (IHF) of the University of Stuttgart.

Award ceremony

Link to the paper