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Chipfilm joint project launched

August 28, 2007

The Institut für Mikroelektronik Stuttgart (IMS CHIPS) in cooperation with the Institut für Physikalische Elektronik (ipe) has developed a new process for the manufacture of extremely thin silicon chips.

Within the chipfilm project these silicon components are tested for their electrical, optical, mechanical and thermal characteristics.

Together with our partners we are conducting tests whether this new process can be implemented into an industrial process line.

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