The continuous development in the field of maskless lithography during IC production is the center of the research project “MAsk less lithoGraphy for IC manufacturing” (MAGIC) sponsored by the EU with 11.7 Mio. Euros.
Using a perforated plate this maskless lithography process divides a parallel electron beam into thousands of individual beams. Following this, each individual opening is accessed through a CMOS chip using a second aperture plate a distraction unit and switched to “on” and/or “off”. Employing 200 fold reduction projection optics the individual switched-on apertures are then mapped into the substrate level.
The following two main goals are to be realized within the 3-year project duration:
- Development and manufacture of an alpha tool for the 32 nm technology node maskless lithography
- Development and allocation of a complete European-wide infrastructure for maskless lithography
The Institut für Mikroelektronik Stuttgart is in charge of the development and production of the electron arrays mentioned above that control the individual electron beams.
Press report on MAGIC in Electronic Media -Semiconductor International