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IMS CHIPS and Robert Bosch signed contract

October 24, 2008

Robert Bosch GmbH Reutlingen and the Institute for Microelectronics Stuttgart (IMS CHIPS) have combined their background IP on Bosch’s porous silicon based APSM pressure sensors and thin chip fabrication based on so called Chipfilm and Pick, Crack&Place process modules from IMS Chips, respectively. The partners will join forces in process development to qualify the Chipfilm technology for industrial volume production.

For further information, please see the official joint press release by Bosch and IMS CHIPS.