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Forum "be-flexible" 2008 - Thin Semiconductor Devices, 9th International Workshop

December 02, 2008

The IMS will be giving a presentation at the Forum "be-flexible" 2008 in Munich.

Keynote Presentation: J. Burghartz, December 2, 2008

"Ultra-thin chip fabrication using cost-effective pre-processed wafer substrates"

For further information, please go to
https://www.be-flexible.de.

Location: Venue hotel Le Meridien, Bayerstrasse 41, 80335 Munich