The Chipfilm™ project funded by Landesstiftung Baden-Württemberg and carried out on behalf of Wirtschaftsministerium Baden-Württemberg was completed successfully in November 2009. Scientists of the Institut für Physikalische Elektronik of Universität Stuttgart (ipe) and the IMS supported by specialists from four companies have explored the basic characteristics of ultra-thin silicon chips manufactured with the new Chipfilm™ technology. During the course of the project the electrical functions of these chips in bent condition as their mechanical stability up to the breaking point were determined. The results have been presented at various international conferences and published in scientific journals. The researched new technology offers possible applications in microelectronic products (ultra-thin chips in textiles, Si chips in flexible plastic foil, ultra-thin ASICs integrated in appliances and instruments), sensorics (ultra-thin sensorics, adhesive tapes with integrated diagnostics) and micromechanics (miniature silicon grippers).
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