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ESTC 2010, Berlin: Lecture "Packaging Challenges Associated with Warpage of Ultra-Thin Chips"

September 13 - 16, 2010

Mahadi-Ul Hassan will give a presentation at the ESTC 2010 in Berlin.

Session: Assembly and Manufacturing Technology (AM-2) – Thin / Flexible System
"Packaging Challenges Associated with Warpage of Ultra-Thin Chips"
Tuesday, September 14, 2010






For more information, please refer to
www.estc-2010.de

Location: Maritim proArte Hotel, Berlin, Germany
Time: 4.00 pm