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TRANSDUCERS' 11 – The 16th International Conference on Solid-State Sensors, Actuators and Microsystems

June 05 - 09, 2011

A. Prümm will present the following poster at the TRANSDUCERS' 11 in Beijing.

Poster Session I: Mechanical/Physical Sensors and Microsystems

MONOCRYSTALLINE THIN-FILM WAFERLEVEL ENCAPSULATION OF MICROSYSTEMS USING POROUS SILICON

A. Prümm1, K.-H. Kraft1, P. Gottschling1, M. Ahles1, S. Armbruster1, M. Metz1, J. N. Burghartz2

1Robert Bosch GmbH – Engineering Sensor Technology Center, Reutlingen, Germany
2Institute for Microelectronics Stuttgart (IMS CHIPS), Stuttgart, Germany

Monday June 6th, 01.15 PM

For further information, please refer to
www.transducers11-beijing.org

Location: China National Convention Center, Beichen West Road, Chaoyang District, Beijing, China
Time: 1.15 pm to 4.15 pm