IMS CHIPS will be presenting a poster at the IEEE MEMS 2012 in Paris.
Daniel B. Etter (poster/oral session II) January 31st, 2012
"Low-Cost CMOS Compatible Sintered Porous Silicon Technique for Microbolometer Manufacturing"
Daniel B. Etter, Martin Zimmermann, Saleh Ferwana, Franz X. Hutter und Joachim N. Burghartz.
The presented work is part of the Spitzencluster MicroTec Südwest project RTFIR (Room-Temperatur-Far-InfraRed).
Being a project partner the Robert Bosch GmbH Schillerhöhe has significantly participated in the results of the presented technology process.
Additional partners to the RTFIR project are Fraunhofer-Institut für Werkstoffmechanik IWM, Binder Elektronik GmbH und TRUMPF GmbH + Co. KG.
For further information, please go to