3rd Workshop - Packaging of PackMEMS 2012 Microsystems
October 02, 2012
This yearÂ´s PackMEMS 2012 Workshop will be held at the Institut fÃ¼r Mikroelektronik Stuttgart.
The event shall highlight relevant trends in packaging technology including its potential and technical challenges resulting from future micro system applications.
This yearÂ´s workshop will emphasize the semiconductor-based system integration with a particular focus on embedding technology.
There are innovative developments being transformed from research into actual applications.
We are looking forward to raising your interest with the workshop agenda.