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3rd Workshop - Packaging of PackMEMS 2012 Microsystems

October 02, 2012

This year´s PackMEMS 2012 Workshop will be held at the Institut für Mikroelektronik Stuttgart.
The event shall highlight relevant trends in packaging technology including its potential and technical challenges resulting from future micro system applications.
This year´s workshop will emphasize the semiconductor-based system integration with a particular focus on embedding technology. There are innovative developments being transformed from research into actual applications.
We are looking forward to raising your interest with the workshop agenda.

Further information in the workshop can be obtained here: Workshop PackMEMS 2012.

Location: IMS CHIPS, Allmandring 30a, 70569 Stuttgart
Time: 9.00 am to 3.30 pm