The IMS will be giving a presentation at the 4th ESTC 2012 in Amsterdam.
Session 17: 3D Integration Technology "Self-Aligned Through Silicon Vias in Ultra-Thin Chips for 3D-Integration"
Saleh Ferwana, Christine Harendt, Florian Letzkus, und Joachim N. Burghartz
Wednesday September 19, 2012 (10:50 – 12:30)
For further information, please refer to: