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4th Electronics System ESTC 2012, Amsterdam

September 17 - 20, 2012

The IMS will be giving a presentation at the 4th ESTC 2012 in Amsterdam.

Session 17: 3D Integration Technology "Self-Aligned Through Silicon Vias in Ultra-Thin Chips for 3D-Integration"
Saleh Ferwana, Christine Harendt, Florian Letzkus, und Joachim N. Burghartz
Wednesday September 19, 2012 (10:50 – 12:30)

For further information, please refer to:

Location: RAI Conference and Exhibition Centre of Amsterdam, The Netherland