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BMBF-sponsored KoSiF project launched - industry and research teaming up on bendable and autonomous sensor systems

March 27, 2013

Sensory foils - intelligent skin for machines
The KoSiF joint project represents an initiative combining industry, research facilities and universities aiming to extend the functionality of large-area organic and inorganic electronic components by introducing a paradigm shift using complimentary base technology made of ultra-thin and highly-flexible chips and technologies.

Teaming up for the KoSiF project are researchers from Festo, Pilz and Würth Elektronik, the IGM, INES and INT Stuttgart University research facilities, the Hochschule der Medien, the IMAT research facility of the Hahn-Schickard-Gesellschaft, the Max Planck Research Group Organic Electronics and the Institut für Mikroelektronik Stuttgart.


KoSiF press release

For further informationen on KoSiF, please refer to https://kosif.ims-chips.de