Sensory foils - intelligent skin for machines
The KoSiF joint project represents an initiative combining industry, research facilities and universities aiming to extend the functionality of large-area organic and inorganic electronic components by introducing a paradigm shift using complimentary base technology made of ultra-thin and highly-flexible chips and technologies.
Teaming up for the KoSiF project are researchers from Festo, Pilz and WÃ¼rth Elektronik, the IGM, INES and INT Stuttgart University research facilities, the Hochschule der Medien, the IMAT research facility of the Hahn-Schickard-Gesellschaft, the Max Planck Research Group Organic Electronics and the Institut fÃ¼r Mikroelektronik Stuttgart.
KoSiF press release
For further informationen on KoSiF, please refer to https://kosif.ims-chips.de