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IMS Chipfilm™ Technology publication in IEEE Spectrum

March 01, 2013

The IEEE Spectrum has published a feature article titled "Make Way for Flexible Silicon Chips" in its March issue.

In this publication the director of the Institut für Mikroelektronik Stuttgart, Prof. Dr.-Ing. Joachim Burghartz, outlines the potential arising from the IMS Chipfilm™ Technology in the production of ultra-thin silicon chips. This technology can be applied in a broad variety of industrial flexible electronics applications. Flexible ultra-thin chips can be combined with areal thin-film components, such as organic semiconductor components, to establish an ideal overall system. This creates new electronic application possibilities and improvements for current electronic products as detailed in the IEEE Spectrum publication.

For further information in the publication "Make Way for Flexible Silicon Chips", please refer to: