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EMPC 2013 – European Microelectronics and Packaging Conference in Grenoble

September 09 - 12, 2013

The IMS will be represented with a presentation during EMPC 2013 in Grenoble.


Mahadi-Ul Hassan: WP4: Assembly and embedding structures
Wednesday, September 11th from 16h00 to 17h40

“Assembly and Embedding of Ultra-Thin Chips in Polymers”
Mahadi-Ul Hassan, Christiane Schomburg, Christine Harendt, Elisabeth Penteker and Joachim N. Burghartz

For more information, please refer to
https://www.empc2013.com

Location: EUROPOLE WTC Congress center, 5-7 Place Robert Schuman, BP1521, 38025 Grenoble, France