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Collaboration Yields Ever Smaller Chip Features

March 24, 2014

The ZEISS Semiconductor Manufacturing Technology business group and IMS CHIPS are working together on the development of nanopatterned optical components. These components make it possible to shrink feature sizes on chips in order to make them even smaller, less expensive, more powerful, and more energy-efficient. IMS CHIPS develops key elements of these nanometer optics. However, the challenge of continuously shrinking feature sizes requires ever bulkier and more expensive equipment, which is why IMS CHIPS decided to invest in a next-generation electron beam writer. The funding of this high-tech equipment was only made possible thanks to a collaborative research agreement between ZEISS and IMS CHIPS. Financial support was provided both by the federal state of Baden-Württemberg and ZEISS.
IMS CHIPS and ZEISS have been working together since 2002.

Further information is included in the press release: Pressemitteilung