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20th European Microelectronics and Packaging Conference (EMPC)

September 14 - 16, 2015

The IMS will be giving two presentations at the EMPC in Friedrichshafen.

Session 8.1: Challenges in 2.5D and 3D Packages
Wednesday, 16/Sep/2015: 8:45am - 10:50am
Low-Temperature Refill Process for Through-Silicon-Vias (TSVs) in Stacked Ultra-Thin Chip-on-Wafer by Aerosol Jet Printed Silver
Saleh Ferwana1, Jürgen Keck2, Mahadi-Ul Hassan1, Christine Harendt1, Joachim N. Burghartz1
1Institute für Mikroelektronik Stuttgart, Germany; 2Hahn-Schickard, Stuttgart, Germany

Session 3.1: PCB Technology
Monday, 14/Sep/2015: 4:50pm - 6:30pm
Combining Organic and Printed Electronics in Hybrid System in Foil (HySiF) Based Smart Skin for Robotic Applications
Mahadi-Ul Hassan1, Yigit Mahsereci 1, Jürgen Keck4, Hagen Klauk5, Jan Kostelnik3, Stefan Saller2, Alina Schreivogel3, Tarek Zaki1, Joachim N. Burghartz1
1Institute für Mikroelektronik Stuttgart, Germany; 2Festo AG & Co. KG, Esslingen, Germany; 3Würth Elektronik GmbH & Co. KG, Rot am See, Germany; 4Hahn-Schickard, Stuttgart, Germany; 5Max-Planck-Institut für Festkörperforschung, Stuttgart, Germany

For more information please go to:
www.empc2015.org/

Location: Graf-Zeppelin-Haus, Olgastraße 20, 88045 Friedrichshafen, Germany