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Final event for BMBF-sponsored project KoSiF

November 24, 2016

KoSiF - New technologies for flexible electronics

For over three years Teaming up for the KoSiF project are researchers from Festo, Pilz and Würth Elektronik, the IGM, INES and INT Stuttgart University research facilities, the Hochschule der Medien, the IMAT research facility of the Hahn-Schickard-Gesellschaft, the Max Planck Research Group Organic Electronics and the Institut für Mikroelektronik Stuttgart have been teaming up in this project.

The KoSiF project (complex systems-in-foil) saw the development of technologies for flexible and autonomous foil systems with integrated silicon chips, sensors, passive components and organic electronics. The end of the project saw the presentation of the second generation of application demonstrators and the evaluation of the technological process suitability.


Weitere Informationen zu KOSIF finden Sie unter: https://kosif.ims-chips.de