The IMS will be holding a keynote presentation during the FLEX Europe – Be Flexibl in Munich, Germany.
Session 2: Integration Processes on Flex
Wednesday, November 15, 2017, 13:15
Chip-Film Patch for Hybrid Systems in Foil – Technology and Applications
Christine Harendt, Head of Semiconductor Integration Business Unit, Institut für Mikroelektronik Stuttgart (IMS CHIPS).
For more information, please refer to: