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2017 FLEX Europe Conference – be flexible

November 15 - 16, 2017

The IMS will be holding a keynote presentation during the FLEX Europe – Be Flexibl in Munich, Germany.

Session 2: Integration Processes on Flex
Wednesday, November 15, 2017, 13:15

Chip-Film Patch for Hybrid Systems in Foil – Technology and Applications
Christine Harendt, Head of Semiconductor Integration Business Unit, Institut für Mikroelektronik Stuttgart (IMS CHIPS).

For more information, please refer to:

Location: ICM (Messe Munich), 14c, Munich, Germany