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Newsletter issue 2 2019

October 16, 2019

We present our IMS newsletter.

In this newsletter (issue 2, 2019) we would like to give you some highlights of our ongoing activities at the Institut fuer Mikroelektronik Stuttgart. The topics of the current issue are:

innBW implant – intelligent implants: Chip-in-foil systems for bioelectronic medicine
Three Innovationsallianz Baden-Württemberg research facilities, namely, NMI Natural and Medical Sciences Institute at the University of Tübingen, IMS CHIPS and Hahn-Schickard partnered in the research of new types of sensors and actuators for future treatment concepts of the widespread disease type 2 diabetes mellitus.

Intelligent foils for Industry?4.0
Microelectronic sensor systems in thin films provide a new approach to networking production facilities and transport logistics for Industry 4.0. Micro chips and sensor components are thinned to a minimum and embedded into plastic foils structured with conductor paths. Contactless communication, energy transmission and energy harvesting provide a flexible application.

Particle measurement ZIM-sponsored project
The project aims at the development of a miniaturized, fully-automated system for the real-time detection and analysis of airborne particles in the form of fine dust and allergy-relevant pollen species in ambient air. Project partners are: red GmbH, Reiser GmbH und InIT (Hochschule Ostwestfalen-Lippe). The IMS is responsible for the development of the sensor chip with silicon photonic components and the control and readout electronics.

MULTI-3D – focus modulating multimodal 3D sensor system
IMS CHIPS is working within the project "MULTI-3D" on the investigation of a CMOS image sensor, which can acquire a very high dynamic range with a linear characteristic and a high signal-to-noise ratio. The project consortium includes IMS CHIPS, two industrial partners, Fraunhofer IOF as well as Friedrich Schiller University Jena.

Our current IMS Newsletter can be found under Publications - Current publications.