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Newsletter issue 1 2020

May 15, 2020

We present our IMS newsletter.

In this newsletter (issue 1, 2020) we would like to give you some highlights of our ongoing activities at the Institut fuer Mikroelektronik Stuttgart. The topics of the current issue are:

FLEXMAX – flexible active sensor matrix for medical applications
Under guidance of the medical technology manufacturer Osypka, industrial and scientific researchers are working on film-based sensor systems for two specific applications in medical technology: Respiratory monitoring and controlled drug delivery for premature infants and sensor-based movement control of heart catheters.

BW-CPS project – Multi Sensor ASIC presented
IMS CHIPS has designed a multi-sensor chip as part of the project. For the practical implementation of CPS in industrial applications, a "BW-CPS" initiative supported by the state of Baden-Württemberg was launched and is coordinated by the Hahn-Schickard-Institute in Villingen-Schwenningen.

BMBF-sponored OPALID project – integrated optical chips for LiDAR systems
IMS CHIPS and the project partners are developing a compact LiDAR system without moving parts for the factory, logistics and automotive industry. The previously rotating unit is replaced by an optical array of phase shifters. The technological implementation is based on silicon photonic chips with integrated optical elements.

IMS CHIPS as alliance partner for the production of next generation integrated circuits
In the next few years, high-performance processors will be required for autonomous driving, AI or large data centers, for example. Within the Ecsel projects TakeMi5 and TapeS3, IMS CHIPS is supporting the development of highly innovative technologies, with which the performance of today's circuits are clearly exceeded.

Our current IMS Newsletter can be found under Publications - Current publications.