{"id":1322,"date":"2020-09-21T13:36:10","date_gmt":"2020-09-21T11:36:10","guid":{"rendered":"https:\/\/start.ims-chips.de\/?page_id=1322"},"modified":"2025-03-31T13:59:51","modified_gmt":"2025-03-31T11:59:51","slug":"historien","status":"publish","type":"page","link":"https:\/\/www.ims-chips.com\/?page_id=1322","title":{"rendered":"History"},"content":{"rendered":"\t\t<div data-elementor-type=\"wp-page\" data-elementor-id=\"1322\" class=\"elementor elementor-1322\">\n\t\t\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-351bb3d elementor-section-boxed elementor-section-height-default elementor-section-height-default exad-glass-effect-no exad-sticky-section-no\" data-id=\"351bb3d\" data-element_type=\"section\" data-e-type=\"section\" data-settings=\"{&quot;background_background&quot;:&quot;classic&quot;,&quot;shape_divider_bottom&quot;:&quot;curve&quot;,&quot;shape_divider_bottom_negative&quot;:&quot;yes&quot;}\">\n\t\t\t\t\t\t\t<div class=\"elementor-background-overlay\"><\/div>\n\t\t\t\t\t\t<div class=\"elementor-shape elementor-shape-bottom\" aria-hidden=\"true\" data-negative=\"true\">\n\t\t\t<svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" viewBox=\"0 0 1000 100\" preserveAspectRatio=\"none\">\n\t<path class=\"elementor-shape-fill\" d=\"M500,97C126.7,96.3,0.8,19.8,0,0v100l1000,0V1C1000,19.4,873.3,97.8,500,97z\"\/>\n<\/svg>\t\t<\/div>\n\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-531617f3 exad-glass-effect-no exad-sticky-section-no\" data-id=\"531617f3\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-2c7cbef exad-sticky-section-no exad-glass-effect-no elementor-widget elementor-widget-heading\" data-id=\"2c7cbef\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\">About us<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-6a90de2d elementor-section-boxed elementor-section-height-default elementor-section-height-default exad-glass-effect-no exad-sticky-section-no\" data-id=\"6a90de2d\" data-element_type=\"section\" data-e-type=\"section\" data-settings=\"{&quot;animation&quot;:&quot;none&quot;}\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-wide\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-50 elementor-top-column elementor-element elementor-element-194af3b8 exad-glass-effect-no exad-sticky-section-no\" data-id=\"194af3b8\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-745228d exad-sticky-section-no exad-glass-effect-no elementor-widget elementor-widget-image\" data-id=\"745228d\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"image.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<img fetchpriority=\"high\" decoding=\"async\" width=\"750\" height=\"500\" src=\"https:\/\/www.ims-chips.com\/wp-content\/uploads\/2020\/09\/20131030_IMS-Neubau-Aussen_IMG_0676-0678_HDR_V2-1024x683.jpg\" class=\"attachment-large size-large wp-image-210\" alt=\"IMS CHIPS building\" srcset=\"https:\/\/www.ims-chips.com\/wp-content\/uploads\/2020\/09\/20131030_IMS-Neubau-Aussen_IMG_0676-0678_HDR_V2-1024x683.jpg 1024w, https:\/\/www.ims-chips.com\/wp-content\/uploads\/2020\/09\/20131030_IMS-Neubau-Aussen_IMG_0676-0678_HDR_V2-300x200.jpg 300w, https:\/\/www.ims-chips.com\/wp-content\/uploads\/2020\/09\/20131030_IMS-Neubau-Aussen_IMG_0676-0678_HDR_V2-768x512.jpg 768w, https:\/\/www.ims-chips.com\/wp-content\/uploads\/2020\/09\/20131030_IMS-Neubau-Aussen_IMG_0676-0678_HDR_V2-360x240.jpg 360w, https:\/\/www.ims-chips.com\/wp-content\/uploads\/2020\/09\/20131030_IMS-Neubau-Aussen_IMG_0676-0678_HDR_V2.jpg 1200w\" sizes=\"(max-width: 750px) 100vw, 750px\" \/>\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t<div class=\"elementor-column elementor-col-50 elementor-top-column elementor-element elementor-element-207c4181 exad-glass-effect-no exad-sticky-section-no\" data-id=\"207c4181\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-465e0f06 elementor-view-default elementor-position-block-start elementor-mobile-position-block-start exad-sticky-section-no exad-glass-effect-no elementor-widget elementor-widget-icon-box\" data-id=\"465e0f06\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"icon-box.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<div class=\"elementor-icon-box-wrapper\">\n\n\t\t\t\t\t\t<div class=\"elementor-icon-box-icon\">\n\t\t\t\t<span  class=\"elementor-icon\">\n\t\t\t\t<i aria-hidden=\"true\" class=\"fab fa-gitter\"><\/i>\t\t\t\t<\/span>\n\t\t\t<\/div>\n\t\t\t\n\t\t\t\t\t\t<div class=\"elementor-icon-box-content\">\n\n\t\t\t\t\t\t\t\t\t<h3 class=\"elementor-icon-box-title\">\n\t\t\t\t\t\t<span  >\n\t\t\t\t\t\t\tInstitut f\u00fcr Mikroelektronik Stuttgart\t\t\t\t\t\t<\/span>\n\t\t\t\t\t<\/h3>\n\t\t\t\t\n\t\t\t\t\t\t\t\t\t<p class=\"elementor-icon-box-description\">\n\t\t\t\t\t\tCivil law foundation<br>\nMember of the Innovationsallianz Baden-W\u00fcrttemberg<br>\nExecutive Director of the Institute: Prof. Dr. Niels Quack<br>\nFoundation: 1983 by the state of Baden-W\u00fcrttemberg<br>\nNumber of employees: +100 <br>\nOperating budget:  18,3 million euros \n\t\t\t\t\t<\/p>\n\t\t\t\t\n\t\t\t<\/div>\n\t\t\t\n\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-f9a44a7 elementor-section-boxed elementor-section-height-default elementor-section-height-default exad-glass-effect-no exad-sticky-section-no\" data-id=\"f9a44a7\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-50 elementor-top-column elementor-element elementor-element-c3a5125 exad-glass-effect-no exad-sticky-section-no\" data-id=\"c3a5125\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-491ebd0 elementor-icon-list--layout-inline elementor-list-item-link-full_width exad-sticky-section-no exad-glass-effect-no elementor-widget elementor-widget-icon-list\" data-id=\"491ebd0\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"icon-list.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<ul class=\"elementor-icon-list-items elementor-inline-items\">\n\t\t\t\t\t\t\t<li class=\"elementor-icon-list-item elementor-inline-item\">\n\t\t\t\t\t\t\t\t\t\t\t<a href=\"https:\/\/www.ims-chips.com\/?page_id=346\">\n\n\t\t\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-icon-list-icon\">\n\t\t\t\t\t\t\t<i aria-hidden=\"true\" class=\"fas fa-dot-circle\"><\/i>\t\t\t\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-icon-list-text\">Institute profile<\/span>\n\t\t\t\t\t\t\t\t\t\t\t<\/a>\n\t\t\t\t\t\t\t\t\t<\/li>\n\t\t\t\t\t\t\t\t<li class=\"elementor-icon-list-item elementor-inline-item\">\n\t\t\t\t\t\t\t\t\t\t\t<a href=\"https:\/\/www.ims-chips.com\/?page_id=1355\">\n\n\t\t\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-icon-list-icon\">\n\t\t\t\t\t\t\t<i aria-hidden=\"true\" class=\"fas fa-dot-circle\"><\/i>\t\t\t\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-icon-list-text\">Management<\/span>\n\t\t\t\t\t\t\t\t\t\t\t<\/a>\n\t\t\t\t\t\t\t\t\t<\/li>\n\t\t\t\t\t\t\t\t<li class=\"elementor-icon-list-item elementor-inline-item\">\n\t\t\t\t\t\t\t\t\t\t\t<a href=\"https:\/\/www.ims-forschungsverein.de\" target=\"_blank\">\n\n\t\t\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-icon-list-icon\">\n\t\t\t\t\t\t\t<i aria-hidden=\"true\" class=\"fas fa-dot-circle\"><\/i>\t\t\t\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-icon-list-text\">Research Association<\/span>\n\t\t\t\t\t\t\t\t\t\t\t<\/a>\n\t\t\t\t\t\t\t\t\t<\/li>\n\t\t\t\t\t\t<\/ul>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t<div class=\"elementor-column elementor-col-50 elementor-top-column elementor-element elementor-element-4f406c3 exad-glass-effect-no exad-sticky-section-no\" data-id=\"4f406c3\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap\">\n\t\t\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-a010d77 elementor-section-boxed elementor-section-height-default elementor-section-height-default exad-glass-effect-no exad-sticky-section-no elementor-invisible\" data-id=\"a010d77\" data-element_type=\"section\" data-e-type=\"section\" data-settings=\"{&quot;animation&quot;:&quot;fadeInUp&quot;}\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-3073a2e exad-glass-effect-no exad-sticky-section-no\" data-id=\"3073a2e\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-bd953e5 exad-sticky-section-no exad-glass-effect-no elementor-widget elementor-widget-heading\" data-id=\"bd953e5\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-xl\">History<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-9000f71 elementor-section-boxed elementor-section-height-default elementor-section-height-default exad-glass-effect-no exad-sticky-section-no elementor-invisible\" data-id=\"9000f71\" data-element_type=\"section\" data-e-type=\"section\" data-settings=\"{&quot;animation&quot;:&quot;fadeInUp&quot;,&quot;background_background&quot;:&quot;classic&quot;,&quot;shape_divider_top&quot;:&quot;mountains&quot;,&quot;shape_divider_bottom&quot;:&quot;mountains&quot;}\">\n\t\t\t\t\t\t\t<div class=\"elementor-background-overlay\"><\/div>\n\t\t\t\t\t\t<div class=\"elementor-shape elementor-shape-top\" aria-hidden=\"true\" data-negative=\"false\">\n\t\t\t<svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" viewBox=\"0 0 1000 100\" preserveAspectRatio=\"none\">\n\t<path class=\"elementor-shape-fill\" opacity=\"0.33\" d=\"M473,67.3c-203.9,88.3-263.1-34-320.3,0C66,119.1,0,59.7,0,59.7V0h1000v59.7 c0,0-62.1,26.1-94.9,29.3c-32.8,3.3-62.8-12.3-75.8-22.1C806,49.6,745.3,8.7,694.9,4.7S492.4,59,473,67.3z\"\/>\n\t<path class=\"elementor-shape-fill\" opacity=\"0.66\" d=\"M734,67.3c-45.5,0-77.2-23.2-129.1-39.1c-28.6-8.7-150.3-10.1-254,39.1 s-91.7-34.4-149.2,0C115.7,118.3,0,39.8,0,39.8V0h1000v36.5c0,0-28.2-18.5-92.1-18.5C810.2,18.1,775.7,67.3,734,67.3z\"\/>\n\t<path class=\"elementor-shape-fill\" d=\"M766.1,28.9c-200-57.5-266,65.5-395.1,19.5C242,1.8,242,5.4,184.8,20.6C128,35.8,132.3,44.9,89.9,52.5C28.6,63.7,0,0,0,0 h1000c0,0-9.9,40.9-83.6,48.1S829.6,47,766.1,28.9z\"\/>\n<\/svg>\t\t<\/div>\n\t\t\t\t<div class=\"elementor-shape elementor-shape-bottom\" aria-hidden=\"true\" data-negative=\"false\">\n\t\t\t<svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" viewBox=\"0 0 1000 100\" preserveAspectRatio=\"none\">\n\t<path class=\"elementor-shape-fill\" opacity=\"0.33\" d=\"M473,67.3c-203.9,88.3-263.1-34-320.3,0C66,119.1,0,59.7,0,59.7V0h1000v59.7 c0,0-62.1,26.1-94.9,29.3c-32.8,3.3-62.8-12.3-75.8-22.1C806,49.6,745.3,8.7,694.9,4.7S492.4,59,473,67.3z\"\/>\n\t<path class=\"elementor-shape-fill\" opacity=\"0.66\" d=\"M734,67.3c-45.5,0-77.2-23.2-129.1-39.1c-28.6-8.7-150.3-10.1-254,39.1 s-91.7-34.4-149.2,0C115.7,118.3,0,39.8,0,39.8V0h1000v36.5c0,0-28.2-18.5-92.1-18.5C810.2,18.1,775.7,67.3,734,67.3z\"\/>\n\t<path class=\"elementor-shape-fill\" d=\"M766.1,28.9c-200-57.5-266,65.5-395.1,19.5C242,1.8,242,5.4,184.8,20.6C128,35.8,132.3,44.9,89.9,52.5C28.6,63.7,0,0,0,0 h1000c0,0-9.9,40.9-83.6,48.1S829.6,47,766.1,28.9z\"\/>\n<\/svg>\t\t<\/div>\n\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-414aab5 exad-glass-effect-no exad-sticky-section-no\" data-id=\"414aab5\" data-element_type=\"column\" data-e-type=\"column\" data-settings=\"{&quot;background_background&quot;:&quot;classic&quot;}\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-010c9ba exad-sticky-section-no exad-glass-effect-no elementor-widget elementor-widget-accordion\" data-id=\"010c9ba\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"accordion.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<div class=\"elementor-accordion\">\n\t\t\t\t\t\t\t<div class=\"elementor-accordion-item\">\n\t\t\t\t\t<div id=\"elementor-tab-title-1101\" class=\"elementor-tab-title\" data-tab=\"1\" role=\"button\" aria-controls=\"elementor-tab-content-1101\" aria-expanded=\"false\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-accordion-icon elementor-accordion-icon-left\" aria-hidden=\"true\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-accordion-icon-closed\"><i class=\"far fa-caret-square-down\"><\/i><\/span>\n\t\t\t\t\t\t\t\t<span class=\"elementor-accordion-icon-opened\"><i class=\"fas fa-caret-up\"><\/i><\/span>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t\t\t\t<a class=\"elementor-accordion-title\" tabindex=\"0\">2022-2023<\/a>\n\t\t\t\t\t<\/div>\n\t\t\t\t\t<div id=\"elementor-tab-content-1101\" class=\"elementor-tab-content elementor-clearfix\" data-tab=\"1\" role=\"region\" aria-labelledby=\"elementor-tab-title-1101\"><h3>2022<\/h3>\n<table width=\"100%\" border=\"0\">\n<tbody>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2022\/12\/Titel-Newsletter.jpg\" \/><em>Nano-HySiF project<\/em><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>IMS CHIPS has initiated, within the Nano-HySiF project, a cooperation with the NanoWired GmbH, which is funded in the ZIM program of the BMWI.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2022\/12\/DoRie-Wafer_Gesamtaufnahme.jpg\" \/><em>Wafer with AI chips<\/em><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>Edge-AI: Joining forces with Hahn-Schickard and FZI, the IMS has developed its own AI chip. The chip contains a RISC-V processor and special AI accelerators and is intended for use directly on sensors.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2022\/12\/Springer-Theses-Prize.jpg\" \/><em>Springer Theses Prize<\/em><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>Dr. Mourad Elsobky has been awarded the Springer Theses Prize for the dissertation done at the IMS.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2022\/12\/HyPerStripes_Logo_final_4c.png\" \/><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>In the HyPerStripes project supported by the Penta program, solutions for flexible interconnects and planar hybrid film systems are being developed.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2022\/12\/2021_040_Gedruckte-Schaltungen-schuetzen-Sensoren-_72dpi.jpg\" \/><em>SensIC project<\/em><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>In the SensIC &#8211; Flexible Foil Systems for Reliable Electronics project, IMS CHIPS is supporting KIT in a development contract with hybrid foil systems and integration technologies.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2022\/12\/PhotonQ_transparent.png\" \/><em>PhotonQ project<\/em><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>In the BMBF funded PhotonQ project, IMS CHIPS is researching and developing integrated photonic chips with novel components such as extremely low-attenuation phase shifters.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n\n<hr style=\"height: 12px; border: 0; box-shadow: inset 0 12px 12px -12px rgba(0,0,0,0.5);\" \/>\n\n<h3>2023<\/h3>\n<table width=\"100%\" border=\"0\">\n  <tbody>\n    <tr>\n      <td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2024\/01\/E-Beam_Vistec_SB255.jpg\"><br><em>Vistec E-Beam SB255 <\/em><\/td>\n      <td width=\"70%\" align=\"left\"><ul>\n        <li>The equipment acquired with REACT-EU funding was put into operation. The investments were used to expand the existing infrastructure at the institute for the large-scale and flexible production and characterization of various nanostructures.<\/li>\n      <\/ul><\/td>\n    <\/tr>\n    <tr>\n      <td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2024\/01\/IMS_News_Grafik.jpg\"><br><em><\/em><\/td>\n      <td width=\"70%\" align=\"left\"><ul>\n        <li>The Institut f\u00fcr Mikroelektronik Stuttgart has made significant progress in saving energy. Through a variety of measures, electricity consumption has been reduced by 554,600 kWh, while district heating consumption has been reduced by 467,000 kWh. <\/li>\n      <\/ul><\/td>\n    <\/tr>\n    <tr>\n      <td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2024\/01\/kooperationsvertrag_burghartz_oertsch.jpg\"><br><em>Prof. Dr. Joachim Burghartz and Michael F\u00f6rtsch, Managing Director of Q.ANT<\/em><\/td>\n      <td width=\"70%\" align=\"left\"><ul>\n        <li>The Stuttgart-based start-up Q.ANT and the IMS have signed an agreement for the joint production of quantum chips. Chips for quantum processors are to be produced in small batches in just two years.<\/li>\n      <\/ul><\/td>\n    <\/tr>\n    <tr>\n      <td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2024\/01\/All2GaN_logo.jpg\"><\/td>\n      <td width=\"70%\" align=\"left\"><ul>\n        <li>The &#8220;ALL2GaN&#8221; project is about easily integrated energy-saving chips based on gallium nitride (GaN). In the project, IMS CHIPS is working on the further development of existing approaches for the advantageous processing of GaN substrates.<\/li>\n      <\/ul><\/td>\n    <\/tr>\n    <tr>\n      <td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2024\/01\/AdobeStock.jpg\"><br><em>\u00a9 Kuzmick &#8211; stock.adobe<\/em><\/td>\n      <td width=\"70%\" align=\"left\"><ul>\n        <li>SpektroChip &#8211; Novel micro-spectrometer system for the near-infrared (NIR) range. The aim of the SpektroChip project is the development, construction and demonstration of a novel micro-spectrometer system for the near-infrared (NIR) range for lab-on-a-chip applications in biomedicine.<\/li>\n      <\/ul><\/td>\n    <\/tr>\n    \n  <\/tbody>\n<\/table>\n\n<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t<div class=\"elementor-accordion-item\">\n\t\t\t\t\t<div id=\"elementor-tab-title-1102\" class=\"elementor-tab-title\" data-tab=\"2\" role=\"button\" aria-controls=\"elementor-tab-content-1102\" aria-expanded=\"false\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-accordion-icon elementor-accordion-icon-left\" aria-hidden=\"true\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-accordion-icon-closed\"><i class=\"far fa-caret-square-down\"><\/i><\/span>\n\t\t\t\t\t\t\t\t<span class=\"elementor-accordion-icon-opened\"><i class=\"fas fa-caret-up\"><\/i><\/span>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t\t\t\t<a class=\"elementor-accordion-title\" tabindex=\"0\">2020-2021<\/a>\n\t\t\t\t\t<\/div>\n\t\t\t\t\t<div id=\"elementor-tab-content-1102\" class=\"elementor-tab-content elementor-clearfix\" data-tab=\"2\" role=\"region\" aria-labelledby=\"elementor-tab-title-1102\"><h3>2020<\/h3>\n<center><\/center>\n<table width=\"100%\" border=\"0\">\n<tbody>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/12\/Deutscher-Zukunftspreis.jpg\" \/><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>Deutscher Zukunftspreis 2020 has been awarded to Trumpf and Zeiss as well as to the Fraunhofer Institute for Applied Optics for their project &#8220;EUV Lithography &#8211; New Light for the Digital Age&#8221;. IMS CHIPS supplied high-precision and individually manufactured computer-generated holograms for this purpose, which are used to test and measure the EUV optics.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/12\/BW-CPS-Gruppenbild-IMG_0141-@-Hahn-Schickard.jpg\" \/>\n<em>The Minister of Commerce, Dr. Nicole Hoffmeister-Kraut, delivers the authorization for the &#8220;BW CPS&#8221; project<\/em><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>In the &#8220;BW-CPS&#8221; project (CPS = cyber-physical systems), an initiative by Hahn-Schickard, FZI and IMS CHIPS funded by the state of Baden-W\u00fcrttemberg, a modular system kit for intelligent and energy-efficient sensor technology for Industry 4.0 was developed successfully.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2021\/01\/Projekte_Bild_PanaMEA_20.jpg\" \/>\n<em>Multi-Elektrode Chip<\/em><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>IMS CHIPS is part of the PanaMEA project funded by the BMBF. The aim is to develop an intelligent implant to measure blood glucose levels. IMS CHIPS is responsible for the development and sample production of the implant\u00b4s ASIC.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/12\/20160712_Pepdio1B_IMG_1606.jpg\" \/><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>The renowned &#8220;Nature&#8221; magazine reports on an ultrasonic projector for moving holograms developed at the Max Planck Institute for Intelligent Systems in Stuttgart. This ultrasonic projector is based on a multi-electrode array chip developed and manufactured by IMS CHIPS.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2021\/01\/Projekte_Bild_INOSENS_20.jpg\" \/><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>IMS CHIPS and Hahn-Schickard are working on a rotary encoder with non-contact scanning in the AiF project INOSENS. The Opto-ASIC required for this is being developed by IMS CHIPS and consists of a large number of integrated photodiodes and mixed-signal circuit elements to determine the angle of rotation position.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/12\/Partikel1.png\" \/><em>Concept for optical particle measurement<\/em><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>The ZIM project \u201cParticle Sensor\u201d aims at the development of a miniaturized, fully automated system for the real-time detection and analysis of airborne particles in the form of fine dust and allergy-relevant pollen species in ambient air. IMS CHIPS is developing a silicon photonic chip for this purpose.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n\n<hr style=\"height: 12px; border: 0; box-shadow: inset 0 12px 12px -12px rgba(0,0,0,0.5);\" \/>\n\n<h3>2021<\/h3>\n<table width=\"100%\" border=\"0\">\n<tbody>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2022\/01\/MST_2021_Titelbild.jpg\" \/>\n<em>MikroSystemTechnik Kongress 2021<\/em><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>This year\u00b4s MikroSystemTechnik Congress was held in Ludwigsburg. Prof. Dr. Joachim Burghartz acted as chairman of this largest German symposium for microsystems technology.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2022\/01\/Figure_1.jpg\" \/><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>The future cluster QSens from the Stuttgart\/Ulm region, in which IMS CHIPS is significantly involved, is one of the winners of the &#8220;Clusters4Future&#8221; competition. QSens researches innovative quantum sensors that can realize unprecedented sensitivity and spatial resolution.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2022\/01\/Best-Paper-1st-Place_IEEE_SENSORS_2021.jpg\" \/>\n<em>First Place Best Paper Award<\/em><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>For the paper: &#8220;Front-End Electronics for Beta-Cell Function Monitoring with an Integrated FOPP Detector&#8221;, Dr. Zili Yu and co-authors received the First Place Best Paper Award at IEEE SENSORS.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2022\/01\/Universitaetspreis.jpg\" \/><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>IMS CHIPS was awarded the publication prize of the University of Stuttgart for the publication &#8220;Ultra-Efficient Silicon-on-Insulator Grating Couplers With Backside Metal Mirrors&#8221;.\nIMS CHIPS scientists were also involved in the technological development and manufacture for the award-winning publication on integrated optical circuits.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2022\/01\/AdobeStock__161661888.jpg\" \/><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>The ID2PPAC (Integration of Processes and Modules for the 2-nm Node) project consolidates and integrates the technology solutions for the 2-nm node identified in the previous IT2 project. IMS CHIPS is collaborating in the lithography equipment work package.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2022\/01\/Mikroelektronik_2OG_62_Sergei-Magel\uf022HNF.jpg\" \/><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>Im neuen Ausstellungsbereich Mikroelektronik des Heinz Nixdorf MuseumsForums wurden\nExponate zur Chip-Herstellung von IMS CHIPS ausgestellt.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<\/tbody>\n<\/table><\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t<div class=\"elementor-accordion-item\">\n\t\t\t\t\t<div id=\"elementor-tab-title-1103\" class=\"elementor-tab-title\" data-tab=\"3\" role=\"button\" aria-controls=\"elementor-tab-content-1103\" aria-expanded=\"false\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-accordion-icon elementor-accordion-icon-left\" aria-hidden=\"true\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-accordion-icon-closed\"><i class=\"far fa-caret-square-down\"><\/i><\/span>\n\t\t\t\t\t\t\t\t<span class=\"elementor-accordion-icon-opened\"><i class=\"fas fa-caret-up\"><\/i><\/span>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t\t\t\t<a class=\"elementor-accordion-title\" tabindex=\"0\">2018-2019<\/a>\n\t\t\t\t\t<\/div>\n\t\t\t\t\t<div id=\"elementor-tab-content-1103\" class=\"elementor-tab-content elementor-clearfix\" data-tab=\"3\" role=\"region\" aria-labelledby=\"elementor-tab-title-1103\"><h3>2018<\/h3>\n<table width=\"100%\" border=\"0\">\n<tbody>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/20170428_ParSiFal-Wafer_IMG_4450-2-Ausschnitt.jpg\" \/>\n<em>Coverstory in IEEE Journal<\/em><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>The IMS CHIPS-developed adaptive layout process silicon chips-in-foil systems is the frontpage story of the renowned IEEE journal in its latest May\/June 2018 edition..<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/Projekte_Bild_FLEXMAX_20-1.jpg\" \/><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>IMS CHIPS is developing customized evaluation ICs to control and analyze the sensor signals as well as integrating its expertise in technologies to embed ultra-thin chips into the foil system in the FLEXMAX project.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/Logo_gross.png\" \/>\n<em>ParsiFAl 4.0 project<\/em><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>MS CHIPS has joined partners in the BMBF-sponsored research project ParsiFAl 4.0 on the development of new sensors and electronics on thin foil for Industrie 4.0<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<tr>\n<td width=\"30%\" align=\"left\"><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>IMS CHIPS has developed ultra-precise diffractive optical elements (DOEs) for surface monitoring of EUV mirrors and researched concepts for mask architecture as part of the ECSEL\/BMBF project SeNaTe. This continues in the follow-up projects TAKEMI5 and TAPES3.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/Projekte_Bild_POSITION_II_20-1.jpg\" \/><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>The POSITION-II project\u00b4s objective are innovative ideas for intelligent catheters and implants by introducing open technology platforms. The IMS is responsible for the development and operation of ASICs in the sub-project \u201cdigitaler MRT-sicherer EP Katheter\u201d.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/Projekte_Bild_OPALID_20-1.jpg\" \/><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>The aim of the BMBF-project \u201cOPALID\u201d is the research and development of a small, reliable and cost-efficient LiDAR system. The IMS is responsible for the system\u00b4s sending unit on a silicon photonic chip.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n\n<hr style=\"height: 12px; border: 0; box-shadow: inset 0 12px 12px -12px rgba(0,0,0,0.5);\" \/>\n\n<h3>2019<\/h3>\n<table width=\"100%\" border=\"0\">\n<tbody>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/11\/2019_TAKEMI5_ASML_NXE_EUV_lithography_machine.jpg\" \/><em>EUV stepper system with sketched beam path of the EUV light<\/em><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>Within the ECSEL\/BMBF project TAKEMI5, IMS CHIPS researched mask infrastructure and new concepts for mask architecture.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/20190129_mi2-Energiefilter_IMG_6778.jpg\" \/>\n<em>Wafer with Si energy filter membranes<\/em><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>The ZIM-funded joint project with the start-up company mi2-factory for the development of a large-area energy filter membrane for single-wafer ion implantation in silicon carbide was successfully completed.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/12\/20150603_ChipFilmTM-Patch_V4_Mode1_chip_IMG_3209_2.jpg\" \/><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>The innBW Implant project &#8211; Chip-in-foil systems for bio-electronic medicine &#8211; has successfully been completed.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/20170405_GaN-Wafer-CS-international_IMG_4012.jpg\" \/>\n<em>Fully automated standard measurements of high-performance electronics<\/em><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>The MOCVD 4.2 project is to develop an increase the production capability of the MOCVD (Metal Organic Chemical Vapour Deposition) technology for applications in power electronics, in photo voltaic as well as in nano photonics and sensor technology.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/Projekte_Bild_NeMoH_300.jpg\" \/><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>In the joint project NeMoH &#8211; Neuromorphic Hardware &#8211; coordinated by IMS CHIPS, together with the Research Center for Information Technology (FZI) and the Hahn-Schickhard-Gesellschaft f\u00fcr angewandte Forschung e. V. (HSG) to develop microelectronics for artificial intelligence.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/20190513_Duerr-Award_IMG_3505_1.jpg\" \/>\nD\u00fcrr Supplier Award ceremony<\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>IMS CHIPS receives the D\u00fcrr Supplier Award 2019 in the Innovation &amp; Technology category for innovative product solutions. D\u00fcrr and IMS CHIPS are continuously researching future technologies.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<\/tbody>\n<\/table><\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t<div class=\"elementor-accordion-item\">\n\t\t\t\t\t<div id=\"elementor-tab-title-1104\" class=\"elementor-tab-title\" data-tab=\"4\" role=\"button\" aria-controls=\"elementor-tab-content-1104\" aria-expanded=\"false\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-accordion-icon elementor-accordion-icon-left\" aria-hidden=\"true\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-accordion-icon-closed\"><i class=\"far fa-caret-square-down\"><\/i><\/span>\n\t\t\t\t\t\t\t\t<span class=\"elementor-accordion-icon-opened\"><i class=\"fas fa-caret-up\"><\/i><\/span>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t\t\t\t<a class=\"elementor-accordion-title\" tabindex=\"0\">2016-2017<\/a>\n\t\t\t\t\t<\/div>\n\t\t\t\t\t<div id=\"elementor-tab-content-1104\" class=\"elementor-tab-content elementor-clearfix\" data-tab=\"4\" role=\"region\" aria-labelledby=\"elementor-tab-title-1104\"><h3>2016<\/h3>\n<table width=\"100%\" border=\"0\">\n<tbody>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/Smart-LiB_Batterie.jpg\" \/>\n<em>Lithium-ion cells with embedded system to monitor functions<\/em><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>The Smart-LiB project is designed to research solutions to encompass the Li ion battery staple\u00b4s condition without the currently required wiring.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/20150924_KIT_E5993_Echelle_IMG_3.jpg\" \/>\n<em>Photonic chip with echelle grating for fast optical data communication<\/em><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>On June 23rd, IMS CHIPS successfully held its first photonics workshop. It offered an outlook on various subjects and applications in photonics..<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/NEMEZU_E5690_01_01.jpg\" \/><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>As part of the BMBF project NEMEZU, new, precious metal-free membrane electrode units for alkaline fuel cells of the future are being researched and developed.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/Logo_100-Orte.png\" \/><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li><em>IMS CHIPS was awarded as one of \u201c100 Orte f\u00fcr Industrie 4.0 in Baden-W\u00fcrttemberg\u201d.<\/em><\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/20161017_30_Jahre_IMS_IMG_2156-2.jpg\" \/>\n<em>Minister of Economic Affairs Dr. Nicole Hoffmeister-Kraut handed over a funding notification<\/em><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>IMS CHIPS has been supporting industrial companies in Baden-W\u00fcrttemberg and beyond for over 30 years. This was commemorated by a celebration organized by the IMS Scientific Association with Minister of Commerce, Dr. Nicole Hoffmeister-Kraut, as special guest.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n\n<hr style=\"height: 12px; border: 0; box-shadow: inset 0 12px 12px -12px rgba(0,0,0,0.5);\" \/>\n\n<h3>2017<\/h3>\n<table width=\"100%\" border=\"0\">\n<tbody>\n<tr>\n<td width=\"30%\" align=\"left\"><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>The IMS has received a 3 million Euros sponsoring by the Ministry for Economics to aid the switch of its research infrastructure to the 22\u00a0mm wafer technology.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/20160705_Tenecor_IMG_1530.jpg\" \/>\n<em>TENECOR EEG chip<\/em><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>The BMBF project TENECOR (telemetric multi-module neonatal cortex monitoring) to determine tiny biomedical signals has been completed successfully.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<tr>\n<td width=\"30%\" align=\"left\"><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>Muhammad Alshahed has been awarded this year\u00b4s best \u201cYoung Scientist\u201d Paper Award at ESSDERC.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/Projekte_Bild_MULTI-3D_20-1.jpg\" \/><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>As part of the sponsoring program \u201cPhotonik Forschung Deutschland\u201d the BMBF project MULTI-3D will be developing a micro-optical 3D sensor system to determine and\/or measure 3D objects.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/20170406_GaN-Wafer-CS-international_IMG_4043_2.jpg\" \/>\n6\u201d GaN on silicon and 2\u201d bulk GaN wafer<\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>Two GaN technology projects have been launched at the IMS.\nThe DFG project C-GaN &#8211; Complementary GaN for High Temperature Electronics and the KMU-innovativ project GaNScan &#8211; Mapping and Modeling of GaN\/Si-Wafers for Power Electronics Applications.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/Logo_innBW_rgb_72dpi.jpg\" \/>\n<em>innBW institute<\/em>\n<br clear=\"all\" \/><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>Review: innBW research facilities\u00b4 performance excellent This conclusion was drawn by the high-ranking reviewer panel which had been scrutinizing the non-university research facilities on account of the Baden-W\u00fcrttemberg government in recent months.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<\/tbody>\n<\/table><\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t<div class=\"elementor-accordion-item\">\n\t\t\t\t\t<div id=\"elementor-tab-title-1105\" class=\"elementor-tab-title\" data-tab=\"5\" role=\"button\" aria-controls=\"elementor-tab-content-1105\" aria-expanded=\"false\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-accordion-icon elementor-accordion-icon-left\" aria-hidden=\"true\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-accordion-icon-closed\"><i class=\"far fa-caret-square-down\"><\/i><\/span>\n\t\t\t\t\t\t\t\t<span class=\"elementor-accordion-icon-opened\"><i class=\"fas fa-caret-up\"><\/i><\/span>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t\t\t\t<a class=\"elementor-accordion-title\" tabindex=\"0\">2014-2015<\/a>\n\t\t\t\t\t<\/div>\n\t\t\t\t\t<div id=\"elementor-tab-content-1105\" class=\"elementor-tab-content elementor-clearfix\" data-tab=\"5\" role=\"region\" aria-labelledby=\"elementor-tab-title-1105\"><h3>2014<\/h3>\n<table width=\"100%\" border=\"0\">\n<tbody>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/20140917_FlexPac_Bildsensor_IMG_2264.jpg\" \/>\n<em>FlexPacFAM \u2013 flexible packaging<\/em><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>The FlexPacFAM project &#8211; flexible packaging of micro system components based on circuit board carriers using Film Assisted Molding has been successfully wrapped up.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/20150828_X-MIND_IMG_3712.jpg\" \/><em>Photo diode ASIC placed on laser diode<\/em><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>The X-MIND project researching extremely miniaturized optical speed sensors has been launched.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/ruessel_.jpg\" \/>\n<em> Intelligent Service Robotic through 3D imaging and processing<\/em><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>INSERO3D \u201eIntelligent Service Robotic through 3D imaging and processing&#8221; is an integration platform SSI (Smart System Integration) project. Technological solutions for the intelligent optical positioning of service robots in a selected area and\/or for an interactive object have been realized.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/Sitara-Demonstrator_breiter.jpg\" \/>\n<em>Self-adapting intelligent multi-aperture camera module<\/em><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>IMS CHIPS is participating in SITARA.\nThe project\u00b4s focus is the development of more cost-effective, intelligent and high-light cameras with a high-dynamic range and very short face-to-face dimensions of less than 3mm.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/J_J_Ebers_Award_Presisverleihung_1.jpg\" \/>\n<em>Granting of the J. J. Ebers Award<\/em><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>Prof. Joachim N. Burghartz receives IEEE Electron Devices Society\u00b4s J. J. Ebers Award 2014\nJoachim Burghartz received this internationally renowned top honor during the microelectronic expert conference IEDM on December 15th.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n\n<hr style=\"height: 12px; border: 0; box-shadow: inset 0 12px 12px -12px rgba(0,0,0,0.5);\" \/>\n\n<h3>2015<\/h3>\n<table width=\"100%\" border=\"0\">\n<tbody>\n<tr><\/tr>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/20141217_Laserschreiber_Heidelberg_VPG400_IMG_2547.jpg\" \/>\n<em>VPG400 laser direct writer from Heidelberg Instruments<\/em><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>A one-day colloquium was held after the laser direct writer, which was procured with ERDF funding, was put into operation. The laser direct writer can be used to create maskless micro structures on various substrates<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/20160802_folienbasierte-Siliziumnadeln-innBW-Implant-_IMG_1816.jpg\" \/><em>Foil-based silicon needles<\/em><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>The &#8220;Intelligent Implants&#8221; research project includes foil implants that are as small and flexible as possible. This platform development opens up entirely new paths for the treatment of diabetes and for the diagnosis, therapy and rehabilitation of brain diseases.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/Si3N4-Membranen.jpg\" \/>\n<em>MEMS \u2013 DMFC fuel cell<\/em><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>MEMS &#8211; DMFC (direct methanol fuel cell based on micro electric mechanical systems) project launch The aim of the project is to develop MEMS cells based on silicon semiconductor technology.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/News_SeNaTe_16.jpg\" \/><em>Loading the etcher with a DOE blank<\/em><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>SeNaTe \u2013 Seven Nanometer Technology &#8211; project launch. Ultra-accurate Diffractive Optical Elements (DOE) for a surface inspection of EUV mirrors are developed and new concepts for mask architecture are explored. The ECSEL project is accompanied by a parallel-running BMBF project.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/DSC5427.jpg\" \/>\n<em>Finalizing MicroTEC S\u00fcdwest Spitzencluster<\/em><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>On October 26, the central results of the 5-year MicroTEC S\u00fcdwest Spitzencluster funded by the BMBF were presented. The IMS was significantly involved here via the production platform PRONTO.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n\n<hr \/><\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t<div class=\"elementor-accordion-item\">\n\t\t\t\t\t<div id=\"elementor-tab-title-1106\" class=\"elementor-tab-title\" data-tab=\"6\" role=\"button\" aria-controls=\"elementor-tab-content-1106\" aria-expanded=\"false\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-accordion-icon elementor-accordion-icon-left\" aria-hidden=\"true\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-accordion-icon-closed\"><i class=\"far fa-caret-square-down\"><\/i><\/span>\n\t\t\t\t\t\t\t\t<span class=\"elementor-accordion-icon-opened\"><i class=\"fas fa-caret-up\"><\/i><\/span>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t\t\t\t<a class=\"elementor-accordion-title\" tabindex=\"0\">2012-2013<\/a>\n\t\t\t\t\t<\/div>\n\t\t\t\t\t<div id=\"elementor-tab-content-1106\" class=\"elementor-tab-content elementor-clearfix\" data-tab=\"6\" role=\"region\" aria-labelledby=\"elementor-tab-title-1106\"><h3>2012<\/h3>\n<table width=\"100%\" border=\"0\">\n<tbody>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/CATRENE-_Innovation_Award_2012.jpg\" \/>\n<em>CATRENE Innovation Award<\/em><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>The EXEPT BMBF sponsored joint project that researches new technologies for the chip production was awarded the Innovation Award 2012 as most innovative project during the European Nanoelectronics Forum M\u00fcnchen.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2021\/01\/News_Newsseite_GMM-WS_12.jpg\" \/><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>The third Microsystem Packaging Workshop (PackMEMS 2012) was held at the Institut f\u00fcr Mikroelektronik Stuttgart.\nThe event focused on important trends in packaging technologies.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/HiDRaLoN-award.jpg\" \/>\n<em>Demonstration Award<\/em><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>Equally successful wrap of the BMBF joint venture HiDRaLoN.\nThe project was awarded the Demonstration Award during the European Nanoelectronics Forum 2012.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2021\/01\/News_Newsseite_Thementag_Licht_12.jpg\" \/><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>Thementag &#8220;Intelligentes Licht&#8221; at the IMS.\nKey players from the scientific and industrial world shared information and discussed the future solid-state light sources: LED and OLED.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2021\/01\/News_Newsseite_Litho_WS_12.jpg\" \/><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>This year\u00b4s successful &#8220;Beams and More&#8221; workshop at the IMS commemorated its 10th anniversary.\nThe &#8220;Beams and More&#8221; workshop has established itself as a constant since it was launched in 2003.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n\n<hr style=\"height: 12px; border: 0; box-shadow: inset 0 12px 12px -12px rgba(0,0,0,0.5);\" \/>\n\n<center><\/center>\n<h3>2013<\/h3>\n<table width=\"100%\" border=\"0\">\n<tbody>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/KoSiF_Logo.jpg\" \/>\n<em>KoSiF &#8220;complex systems in foil&#8221;<\/em><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>The BMBF-sponsored KoSiF project has been launched &#8211; industry and science teaming up on bendable and autonomous sensor systems<em>.<\/em><\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2021\/01\/News_Newsseite_IEEE_Spectrum_13.jpg\" \/><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>The IEEE Spectrum has published a feature article titled \u201cMake Way for Flexible Silicon Chips\u201d on the IMS Chipfilm\u2122 technology in its March issue.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/20130422_Einweihung_IMG_9849.jpg\" \/>\n<em>Opening ceremony of the clean room expansion<\/em><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>Opening ceremony of the clean room expansion at the Institut f\u00fcr Mikroelektronik Stuttgart\nBaden-W\u00fcrttemberg\u00b4s Minister of Finance and Economy, Dr. Nils Schmid, and Stuttgart\u00b4s mayor, Fritz Kuhn, to inaugurate the new clean room.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/20130620_Wellenleiter_IMG_0071-72.jpg\" \/>\n<em>Photonic integration<\/em><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>Together with the Institute of Electrical and Optical Communications Engineering (INT) of the Universit\u00e4t Stuttgart the IMS reached a world record in energy-efficient photonic integration in silicon.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/IEEE_EDS_PhD_FellowshipAward_2013.jpg\" \/>\n<em>IEEE EDS PhD Fellowship Award 2013<\/em><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>Tarke Zaki has been awarded the IEEE EDS PhD Fellowship Award 2013.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n\n<hr \/><\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t<div class=\"elementor-accordion-item\">\n\t\t\t\t\t<div id=\"elementor-tab-title-1107\" class=\"elementor-tab-title\" data-tab=\"7\" role=\"button\" aria-controls=\"elementor-tab-content-1107\" aria-expanded=\"false\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-accordion-icon elementor-accordion-icon-left\" aria-hidden=\"true\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-accordion-icon-closed\"><i class=\"far fa-caret-square-down\"><\/i><\/span>\n\t\t\t\t\t\t\t\t<span class=\"elementor-accordion-icon-opened\"><i class=\"fas fa-caret-up\"><\/i><\/span>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t\t\t\t<a class=\"elementor-accordion-title\" tabindex=\"0\">2009-2011<\/a>\n\t\t\t\t\t<\/div>\n\t\t\t\t\t<div id=\"elementor-tab-content-1107\" class=\"elementor-tab-content elementor-clearfix\" data-tab=\"7\" role=\"region\" aria-labelledby=\"elementor-tab-title-1107\">\n<h3>20009<\/h3>\n<table width=\"100%\" border=\"0\">\n<tbody>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/Folder-015.jpg\" \/>\n<em>Gaussian Shape Beam by NIL Techno<\/em><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>A new cooperation in the nanoimprint lithography field. The leading manufacturer for dies in nanoimprint lithography,NIL Technology, and IMS CHIPS announced the start of their cooperation in the nanoimprint template field during the NILCOM meeting.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/20090527_Jack_Raper_Award_IMG_4415_k.jpg\" \/>\n<em>Jack Raper Award <\/em><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>IMS is awarded the &#8220;Jack Raper Award&#8221; in San Francisco. The \u201cJack Raper Award for Outstanding Technology Directions Paper\u201d was awarded for the presentation &#8220;CMOS Imager Technologies for Biomedical Applications&#8221;.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/20090305_Hyperbraille_Display_IMG_4106-4120.jpg\" \/>\n<em>Hyperbraille Display <\/em><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>Within the \u201cHyperbraille\u201d project the IMS, METEC AG and several other industrial partners develop the 2D braille script display enabling the vision-impaired an interactive access to graphic user interfaces.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n\n<hr style=\"height: 12px; border: 0; box-shadow: inset 0 12px 12px -12px rgba(0,0,0,0.5);\" \/>\n\n<h3>2010<\/h3>\n<table width=\"100%\" border=\"0\">\n<tbody>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/MAGIC_REM_Ablenkeinheit.jpg\" \/>\n<em>REM image of an electron beam deflection unit for the \u201cCHARPAN\u201d project<\/em><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>As to nano structuring for future chip generations the IMS is significantly involved in the international \u201cCHARPAN\u201d, \u201cFANTASTIC\u201d and \u201cMAGIC\u201d projects.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2021\/01\/01_12_Landesforschungspreis_1-1.jpg\" \/><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>The Landesforschungspreis fu\u0308r Angewandte Forschung was awarded to Professor Dr.-Ing. Joachim Burghartz in a ceremonial act in Stuttgart.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2021\/01\/MicroTEC-Suedwest_final.jpg\" \/><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>IMS CHIPS is awarded Spitzencluster MicroTEC S\u00fcdwest<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/TerraSAR-X-Satellit.jpg\" \/>\n<em>TanDEM-X \u2013 radar satellite<\/em><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>Mounted on the TanDEM-X radar satellite another satellite is leaving the Baikonur space port into space equipped with special ASICs.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n\n<hr \/>\n\n<h3>2011<\/h3>\n<table width=\"100%\" border=\"0\">\n<tbody>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/12\/2011_1.jpg\" \/>\n<em>Cleanroom ground breaking ceremony <\/em><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>The ground-breaking ceremony for the\nclean room construction took place on the institute\u00b4s premises in\nStuttgart on February, 15th.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/12\/2011_2.jpg\" \/>\n<em>innBW Innovation Alliance Baden-W\u00fcrttemberg<\/em><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>The Institut f\u00fcr Mikroelektronik Stuttgart together\nwith 11 other research facilities in Baden-W\u00fcrttemberg\nforms the Innovationallianz Baden-W\u00fcrttemberg.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/12\/2011_3.jpg\" \/><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>The non-profit association of sponsors\nF\u00f6rderverein des Instituts f\u00fcr Mikroelektronik Stuttgart\nfounded in 1983 has been restructured into Forschungsverein and expanded\nits range of services.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/12\/2011_4.jpg\" \/>\n<em>First PRONTO workshop<\/em><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>More than 80 participants from industry and research\ngathered for the PRONTO workshop in Stuttgart.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/12\/2011_5.jpg\" \/>\n<em>GMM-Preis 2011<\/em><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>GMM prize 2011 awarded to the\nIMS for the IEDM paper &#8220;Ultra-Thin\nIChip Technology for System-in-Foil-Applications&#8221;.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n&nbsp;<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t<div class=\"elementor-accordion-item\">\n\t\t\t\t\t<div id=\"elementor-tab-title-1108\" class=\"elementor-tab-title\" data-tab=\"8\" role=\"button\" aria-controls=\"elementor-tab-content-1108\" aria-expanded=\"false\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-accordion-icon elementor-accordion-icon-left\" aria-hidden=\"true\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-accordion-icon-closed\"><i class=\"far fa-caret-square-down\"><\/i><\/span>\n\t\t\t\t\t\t\t\t<span class=\"elementor-accordion-icon-opened\"><i class=\"fas fa-caret-up\"><\/i><\/span>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t\t\t\t<a class=\"elementor-accordion-title\" tabindex=\"0\">2007-2008<\/a>\n\t\t\t\t\t<\/div>\n\t\t\t\t\t<div id=\"elementor-tab-content-1108\" class=\"elementor-tab-content elementor-clearfix\" data-tab=\"8\" role=\"region\" aria-labelledby=\"elementor-tab-title-1108\"><h3>2007<\/h3><table width=\"100%\" border=\"0\"><tbody><tr><td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/G-Funktionsaufbau-SafetyEYE-Text-Logo.jpg\" \/><br \/><em>SafetyEYE\u00ae camera system<\/em><\/td><td width=\"70%\" align=\"left\"><ul><li>The IMS delivers HDRC\u00ae image sensors specially developed together with DaimerlChrysler for the Pilz SafetyEYE\u00ae camera system.<\/li><\/ul><\/td><\/tr><tr><td width=\"30%\" align=\"left\"><\/td><td width=\"70%\" align=\"left\"><ul><li>The IMS developed and manufactures Retina chip is the first chip in the world tested on blind patients giving them simple seeing impressions.<\/li><\/ul><\/td><\/tr><tr><td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/Templat_Dual_Damascene_60nm.jpg\" \/><br \/><em>REM image of a template with 60 nm pillars for the \u201cFANTASTIC\u201d project<\/em><\/td><td width=\"70%\" align=\"left\"><ul><li>IMS develops die for the nanoimprint technology and establishes partnership to the MEDEA \u201cFANTASTIC\u201d project.<\/li><\/ul><\/td><\/tr><tr><td width=\"30%\" align=\"left\"><\/td><td width=\"70%\" align=\"left\"><ul><li>GATE FOREST\u00ae will be enlarged for Structured ASICs using a 0.5 \u00b5m process<\/li><\/ul><\/td><\/tr><tr><td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/Chipfilm_Prozess_B_Finger_IMG_0479_k.jpg\" \/><br \/><em>Ultra-thin microchip: 20 \u00b5m thickness<\/em><\/td><td width=\"70%\" align=\"left\"><ul><li>IMS and Bosch enter into a cooperation agreement for the development and application of technologies for ultra-thin microchips.<\/li><\/ul><\/td><\/tr><tr><td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2021\/01\/HDRC_Q-PyroCam_klein.jpg\" \/><\/td><td width=\"70%\" align=\"left\"><ul><li>IMS presents a camera measuring temperature using quotient pyrometry.<\/li><\/ul><\/td><\/tr><\/tbody><\/table><hr style=\"height: 12px; border: 0; box-shadow: inset 0 12px 12px -12px rgba(0,0,0,0.5);\" \/><center><\/center><h3>2008<\/h3><table width=\"100%\" border=\"0\"><tbody><tr><td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/VIP_Intro_07_CLC.jpg\" \/><br \/><em>Webseite VIP<\/em><\/td><td width=\"70%\" align=\"left\"><ul><li>In cooperation with the Fraunhofer Institutes IAO und IAT and several small and medium-size companies the IMS develops the innovation guideline \u201cVIP \u2013 Von der Idee zum Produkt\u201d.<\/li><\/ul><\/td><\/tr><tr><td width=\"30%\" align=\"left\"><em><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/TerraSAR-X-Satellit.jpg\" \/><br \/><em> Radar satellite TerraSAR-X<\/em><\/em><\/td><td width=\"70%\" align=\"left\"><ul><li>The TerraSAR-X satellite made by the satellite manufacturer Astrium takes off into space successfully.<br \/>On board there are numerous space-qualified IMS ASICs.<\/li><\/ul><\/td><\/tr><tr><td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/IdeenPark_ThyssenKrupp_Bild_MG8458.jpg\" \/><br \/><em> IdeenPark 2008 in Stuttgart<\/em><\/td><td width=\"70%\" align=\"left\"><ul><li>The \u201cIdeenPark\u201d attracts more than 300,000 enthusiastic visitors.<br \/>The IMS is represented with lectures and a well-frequented booth in the SchlauLoPolis area.<\/li><\/ul><\/td><\/tr><tr><td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/25_Jahre_IMS_IMG_3049_k.jpg\" \/><br \/><em>Festive ceremony at Haus der Wirtschaft in Stuttgart <\/em><\/td><td width=\"70%\" align=\"left\"><ul><li>The Institut f\u00fcr Mikroelektronik Stuttgart commemorates its 25th anniversary.<\/li><\/ul><\/td><\/tr><tr><td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/20090217_RFID_Chipfilm_IMG_4018.jpg\" \/><br \/><em>Ultra-thin RFID chip on foil substrate<\/em><\/td><td width=\"70%\" align=\"left\"><ul><li>In order to research a new generation of high-dynamic, high-resolution and low-noise image sensors the comprehensive project cooperative HiDRaLoN (High Dynamic Range Low Noise CMOS Imagers) has been established within the European research project CATRENE.<\/li><\/ul><\/td><\/tr><tr><td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2021\/01\/hidralon_Logo.gif\" \/><\/td><td width=\"70%\" align=\"left\"><ul><li>In order to research a new generation of high-dynamic, high-resolution and low-noise image sensors the comprehensive project cooperative HiDRaLoN (High Dynamic Range Low Noise CMOS Imagers) has been established within the European research project CATRENE.<\/li><\/ul><\/td><\/tr><\/tbody><\/table><hr \/><\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t<div class=\"elementor-accordion-item\">\n\t\t\t\t\t<div id=\"elementor-tab-title-1109\" class=\"elementor-tab-title\" data-tab=\"9\" role=\"button\" aria-controls=\"elementor-tab-content-1109\" aria-expanded=\"false\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-accordion-icon elementor-accordion-icon-left\" aria-hidden=\"true\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-accordion-icon-closed\"><i class=\"far fa-caret-square-down\"><\/i><\/span>\n\t\t\t\t\t\t\t\t<span class=\"elementor-accordion-icon-opened\"><i class=\"fas fa-caret-up\"><\/i><\/span>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t\t\t\t<a class=\"elementor-accordion-title\" tabindex=\"0\">2004-2006<\/a>\n\t\t\t\t\t<\/div>\n\t\t\t\t\t<div id=\"elementor-tab-content-1109\" class=\"elementor-tab-content elementor-clearfix\" data-tab=\"9\" role=\"region\" aria-labelledby=\"elementor-tab-title-1109\"><h3>2004<\/h3>\n<table width=\"100%\" border=\"0\">\n<tbody>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/Cantilever_Array.jpg\" \/>\n<em>Cantilever Array <\/em><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>Wafers with MEMS structures are successfully manufactured at the IMS.\nThe young CavendishKinetics company partners with researchers at the IMS to develop silicon nano relais for future non-volatile storage units.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<tr>\n<td width=\"30%\" align=\"left\"><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>Within the \u201cXTUMASK\u201d and \u201cSecond Level Imaging\u201d projects technologies for the manufacture of masks with future technology notes are developed and equipment and materials are evaluated.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n\n<hr style=\"height: 12px; border: 0; box-shadow: inset 0 12px 12px -12px rgba(0,0,0,0.5);\" \/>\n\n<h3>2005<\/h3>\n<table width=\"100%\" border=\"0\">\n<tbody>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/EUV-Maske_optimiert.jpg\" \/>\n<em>EUV full field masks<\/em><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>IMS manufacture of the first EUV full field masks with minimal structures around 100\u00a0nm for ASML.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/Mikrohandhabung_Prototyp_Detail_IMG_0661.jpg\" \/><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>Together with the Lange Feinwerktechnik and Staiger companies the IMS develops extremely compact pneumatic valve unit with integrated control electronics.\nWork pieces within the sub-millimeter size can thus be handled with a clock cycle of below 20\u00a0ms \u2013 an important precondition for the rational manufacture of tiny precision components.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/Burghartz_Joachim.jpg\" \/>\n<em>Joachim Burghartz <\/em><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>As of October 1st, 2005, Prof. Dr. Joachim Burghartz is Chairman of the Board of the IMS and Full Professor at University of Stuttgart.\nHe succeeds Professor Dr. Bernd H\u00f6fflinger who has retired.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/IVP_Endoskop4_1545_Mappe.jpg\" \/>\n<em>Image sensor chip IVP<\/em><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>Manufacture of miniaturized image sensor chip IVP for use in swallowable video pill and integrated into an endoscope.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<tr>\n<td width=\"30%\" align=\"left\"><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>After finishing animal testing the sub-retinal implant using an IMS chip is implanted into humans for the first time.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n\n<hr \/>\n\n<h3>2006<\/h3>\n<table width=\"100%\" border=\"0\">\n<tbody>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/Charpan_Wafer_IMG_1220.jpg\" \/><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>As part of the EU project CHARPAN the IMS participates in the development of a multi-ionbeam pattern generator.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/Chipfilm_Prozess_B_Finger.jpg\" \/>\n<em>Chipfilm<\/em><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>The IMS demonstrates a new process to fabricate extremely thin chips in cooperation with the Institut f\u00fcr Physikalische Elektronik (IPE) of Universit\u00e4t Stuttgart and presents this during the renowned International Electron Devices Meeting (IEDM) in San Francisco.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<tr>\n<td width=\"30%\" align=\"left\"><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>The IMS paper is awarded Best Paper Award during the Photomask Japan 2006 conference.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<\/tbody>\n<\/table><\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t<div class=\"elementor-accordion-item\">\n\t\t\t\t\t<div id=\"elementor-tab-title-11010\" class=\"elementor-tab-title\" data-tab=\"10\" role=\"button\" aria-controls=\"elementor-tab-content-11010\" aria-expanded=\"false\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-accordion-icon elementor-accordion-icon-left\" aria-hidden=\"true\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-accordion-icon-closed\"><i class=\"far fa-caret-square-down\"><\/i><\/span>\n\t\t\t\t\t\t\t\t<span class=\"elementor-accordion-icon-opened\"><i class=\"fas fa-caret-up\"><\/i><\/span>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t\t\t\t<a class=\"elementor-accordion-title\" tabindex=\"0\">2001-2003<\/a>\n\t\t\t\t\t<\/div>\n\t\t\t\t\t<div id=\"elementor-tab-content-11010\" class=\"elementor-tab-content elementor-clearfix\" data-tab=\"10\" role=\"region\" aria-labelledby=\"elementor-tab-title-11010\"><h3>2001<\/h3>\n<table width=\"100%\" border=\"0\">\n<tbody>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/IC_LAB_Platine_USB_Front_CRW_32813284.jpg\" \/>\n<em>IC_Lab experimental board<\/em><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>IC_Lab \u2013 the experimental board to design complex digital electronics.\nPractical exercises from the FeLS and IC lab can easily be realized on the experimental board.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/Klitzing_Portrait.jpg\" \/>\n<em>Klaus von Klitzing <\/em><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>The practical lab course \u201cSch\u00fclerinnen und Sch\u00fcler machen Chips\u201d commemorates its 10th anniversary.\nNobel prize winner Klaus von Klitzing of the neighboring Max-Planck-Institut f\u00fcr Festk\u00f6rperphysik in Stuttgart inspires young listeners during the ceremony.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/Vistec_SB352HR_IMG_1898_NL.jpg\" \/>\n<em>ZBA350<\/em><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>Installation of the ZBA350 Leica e-beam direct writer at the IMS.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<tr>\n<td width=\"30%\" align=\"left\"><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>Mixed-signal ASIC manufactured for the new high-resolution and high-dynamic absolute-value transducer generation \u201cDignalizer\u201d made by Baumer Electric AG.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n\n<hr style=\"height: 12px; border: 0; box-shadow: inset 0 12px 12px -12px rgba(0,0,0,0.5);\" \/>\n\n<h3>2002<\/h3>\n<table width=\"100%\" border=\"0\">\n<tbody>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/Sternsensor_Kamera.jpg\" \/>\n<em>APS star sensor camera<\/em><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>Star sensors determine the position of satellites and space probes by using patterns of star constellations.\nThe IMS develops a radiation-resistant image sensor for long-term emissions in cooperation with the Institut f\u00fcr Physikalische Elektronik (IPE) of Universit\u00e4t Stuttgart.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<tr>\n<td width=\"30%\" align=\"left\"><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>Within the \u201cTranSi\u201d project, the IMS jointly develops transferrable thin Si layers und tests their application during the production of CMOS circuits with the Institut f\u00fcr Physikalische Elektronik (IPE) of University of Stuttgart.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<tr>\n<td width=\"30%\" align=\"left\"><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>Installation of a modern line of masks at the IMS.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<tr>\n<td width=\"30%\" align=\"left\"><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>ASIC no. 1,000,000,000 is manufactured at the IMS.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<tr>\n<td width=\"30%\" align=\"left\"><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>Founding of IMS VISION GmbH as Joint Venture with OMRON<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2021\/01\/Lange_CMOS_Zeile.jpg\" \/>\n<em>10000 pixel \u2013 line sensor<\/em><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>HDRC\u00ae line sensor\nThe IMS develops a high-resolution image sensor with a 10 cm image line for space applications.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n\n<hr \/>\n\n<h3>2003<\/h3>\n<table width=\"100%\" border=\"0\">\n<tbody>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/News_Newsseite_ABBILD.jpg\" \/><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>Within the framework of the ABBILD project the IMS participates in the development of selected areas of mask technology.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/Photomask_Awards_2003.jpg\" \/>\n<em>Photomask Best Paper Award<\/em><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>During the Photomask Conference in Monterey, USA, the IMS is awarded the BACUS Poster Award for the presentation of the \u201cphase shifting masks within the 65 nm technology node\u201d.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<tr>\n<td width=\"30%\" align=\"left\"><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>The IMS mainly develops and manufactures numerous optical components for the Zeiss SMT AG company for the test engineering area.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<tr>\n<td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2021\/01\/Hipscan_System1.jpg\" \/>\n<em>HIPSCAN System<\/em><\/td>\n<td width=\"70%\" align=\"left\">\n<ul>\n \t<li>The IMS is partner to the \u201cHIPSCAN\u201d EU project predominately concentrating on high-speed scanning of paper documents. A cryto ASIC is developed at the IMS enabling the realtime encryption at extremely high data rates.<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<\/tbody>\n<\/table><\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t<div class=\"elementor-accordion-item\">\n\t\t\t\t\t<div id=\"elementor-tab-title-11011\" class=\"elementor-tab-title\" data-tab=\"11\" role=\"button\" aria-controls=\"elementor-tab-content-11011\" aria-expanded=\"false\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-accordion-icon elementor-accordion-icon-left\" aria-hidden=\"true\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-accordion-icon-closed\"><i class=\"far fa-caret-square-down\"><\/i><\/span>\n\t\t\t\t\t\t\t\t<span class=\"elementor-accordion-icon-opened\"><i class=\"fas fa-caret-up\"><\/i><\/span>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t\t\t\t<a class=\"elementor-accordion-title\" tabindex=\"0\">1998-2000<\/a>\n\t\t\t\t\t<\/div>\n\t\t\t\t\t<div id=\"elementor-tab-content-11011\" class=\"elementor-tab-content elementor-clearfix\" data-tab=\"11\" role=\"region\" aria-labelledby=\"elementor-tab-title-11011\"><h3>1998<\/h3>\n<table width=\"100%\" border=\"0\">\n  <tbody>\n    <tr>\n      <td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/MORE_phone.jpg\" \/><br \/>\n        <em>MORE-Phone <\/em><\/td>\n      <td width=\"70%\" align=\"left\"><ul>\n        <li>            Under guidance by the IMS the EU project  &ldquo;Mobile Rescue Telephone&rdquo; develops the first mobile phone worldwide with an  integrated GPS positioning module.<br>\n          The central core of the phone is an IMS  GATE FOREST\u00ae ASIC.        <\/li>\n      <\/ul><\/td>\n    <\/tr>\n    <tr>\n      <td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/andock.jpg\" \/><br \/>\n        <em> Aircraft docking system<\/em><\/td>\n      <td width=\"70%\" align=\"left\"><ul>\n        <li>\n          <p>The weatherproof HDRC\u00ae camera aircraft  docking system by GEVITEC and Honeywell Airport Systems is installed at the  gates of international airports, such as airports in Barcelona, Billund,  Brussels, Dresden, Hanover, Leipzig, Madrid, Beijing, Canton, Seoul and Tel  Aviv.<br>\n            The video-based guided docking system  guides the pilot through a display mounted at the airport facility when  approaching the gate and enables an exact parking position in order to dock on  the gangway.<\/p>\n        <\/li>\n      <\/ul><\/td>\n    <\/tr>\n    <tr>\n      <td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/Ausschnitt_Titel_Siop.jpg\" \/><br \/>\n        <em>SIOP SIOP neuro processor chip<\/em><\/td>\n      <td width=\"70%\" align=\"left\"><ul>\n        <li>Based  on the SIOP neuro processor the SAND neuro processor was developed that is  integrated into the NNSIM neuronal network simulator, a powerful platform for  neuronal applications developed at the IMS. <br>\n        <\/li>\n      <\/ul><\/td>\n    <\/tr>\n  <\/tbody>\n<\/table>\n<hr \/>\n<center>\n<\/center>\n<h3>1999<\/h3>\n<table width=\"100%\" border=\"0\">\n  <tbody>\n    <tr>\n      <td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2021\/01\/Retina_Schema-2005.jpg\" \/><br \/>\n        <em> Retina implant <\/em><\/td>\n      <td width=\"70%\" align=\"left\"><ul>\n        <li>\n          <p>The IMS, the NMI in Reutlingen and the  Klinik f\u00fcr Augenheilkunde T\u00fcbingen jointly present the idea of a retina implant  during the Hanover Fair.<\/p>\n        <\/li>\n      <\/ul><\/td>\n    <\/tr>\n    <tr>\n      <td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/Stencilmaske_D_126.jpg\" \/><br \/>\n        <em>SOI membrane mask <\/em><\/td>\n      <td width=\"70%\" align=\"left\"><ul>\n        <li>\n          <p>The IMS is partner to the &ldquo;100&nbsp;nm mask  writer&rdquo; and supports the equipment development with the relevant process  development.<\/p>\n        <\/li>\n      <\/ul><\/td>\n    <\/tr>\n    <tr>\n      <td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2021\/01\/Marienkaefer_color_MK11.jpg\" \/><br \/>\n        <em>Recording using HDRC\u00ae camera<\/em><\/td>\n      <td width=\"70%\" align=\"left\"><ul>\n        <li>\n          <p>First color images recorded with HDRC\u00ae  cameras<\/p>\n<\/li>\n      <\/ul><\/td>\n    <\/tr>\n    <tr>\n      <td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/Screen_fuer_Poster.jpg\" \/><br \/>\n        <em> FeLS start screen <\/em><\/td>\n      <td width=\"70%\" align=\"left\"><ul>\n        <li>The  FeLS learning tool (FPGA design \u2013 a autodidactic learning tool) is developed. It teaches the theoretical fundamentals of digital technology and its  applications as well as the simulation of circuits all the way to the FPGA  download. <\/li>\n      <\/ul><\/td>\n    <\/tr>\n  <\/tbody>\n<\/table>\n<hr \/>\n<center>\n<\/center>\n<h3>2000<\/h3>\n<table width=\"100%\" border=\"0\">\n  <tbody>\n    <tr>\n      <td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/Low_Power_Awards_2000.jpg\" \/><br \/>\n        <em> Low-Power Design Award<\/em><\/td>\n      <td width=\"70%\" align=\"left\"><ul>\n        <li>\n          <p>The IMS is awarded the &ldquo;Low Power Design  Contest&rdquo; at the IEEE Computer Elements Workshop in Arizona.<\/p>\n        <\/li>\n      <\/ul><\/td>\n    <\/tr>\n    <tr>\n      <td width=\"30%\" align=\"left\"><\/td>\n      <td width=\"70%\" align=\"left\"><ul>\n        <li>\n          <p>Web-based &ldquo;TEAM 2000&rdquo; learning system for  engineers and circuit developers is introduced.<\/p>\n        <\/li>\n      <\/ul><\/td>\n    <\/tr>\n    <tr>\n      <td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2021\/01\/T-Gate_druck.jpg\" \/><br \/>\n        <em>T-Gate (REM image)<\/em><\/td>\n      <td width=\"70%\" align=\"left\"><ul>\n        <li>\n          <p>CMOS process HIPERLOGIC transistors  developed at the IMS with 100&nbsp;nm structures working at an operating  voltage of 0.5 V are presented.<\/p>\n        <\/li>\n      <\/ul><\/td>\n    <\/tr>\n    <tr>\n      <td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2021\/01\/Ringzeilen_Sensor_072.jpg\" \/><br \/>\n        <em> Circular line sensor<\/em><\/td>\n      <td width=\"70%\" align=\"left\"><ul>\n        <li>\n          <p>Manufacture of circular line sensors with  2048 pixels on its circumference.<\/p>\n        <\/li>\n      <\/ul><\/td>\n    <\/tr>\n    <tr>\n      <td width=\"30%\" align=\"left\"><\/td>\n      <td width=\"70%\" align=\"left\"><ul>\n        <li>\n          <p>Radification of a HDRC\u00ae licensing and  development agreement with SHARP.<\/p>\n        <\/li>\n      <\/ul><\/td>\n    <\/tr>\n  <\/tbody>\n<\/table>\n<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t<div class=\"elementor-accordion-item\">\n\t\t\t\t\t<div id=\"elementor-tab-title-11012\" class=\"elementor-tab-title\" data-tab=\"12\" role=\"button\" aria-controls=\"elementor-tab-content-11012\" aria-expanded=\"false\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-accordion-icon elementor-accordion-icon-left\" aria-hidden=\"true\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-accordion-icon-closed\"><i class=\"far fa-caret-square-down\"><\/i><\/span>\n\t\t\t\t\t\t\t\t<span class=\"elementor-accordion-icon-opened\"><i class=\"fas fa-caret-up\"><\/i><\/span>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t\t\t\t<a class=\"elementor-accordion-title\" tabindex=\"0\">1995-1997<\/a>\n\t\t\t\t\t<\/div>\n\t\t\t\t\t<div id=\"elementor-tab-content-11012\" class=\"elementor-tab-content elementor-clearfix\" data-tab=\"12\" role=\"region\" aria-labelledby=\"elementor-tab-title-11012\"><h3>1995<\/h3>\n<table width=\"100%\" border=\"0\">\n  <tbody>\n    <tr>\n      <td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/Ein-Chip-Controller_mText.jpg\" \/><br \/>\n        <em>Single chip controller <\/em><\/td>\n      <td width=\"70%\" align=\"left\"><ul>\n        <li>\n          <p>Within the &ldquo;Mikrocontroller-Baukasten&rdquo;  project the Intellectual Property (IP) library with functional modules for  ASICs, such as the field bus module, processing cores and A\/D converters are  created.<br>\n            Several small and medium-sized companies  have joint the ASIC Working Group at the IMS and use the IP Pool for their ASIC  developments.<\/p>\n        <\/li>\n      <\/ul><\/td>\n    <\/tr>\n    <tr>\n      <td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/CECC-Zertifikation-T1.jpg\" \/><br \/>\n        <em>CECC EN 100114 part 1 certification <\/em><\/td>\n      <td width=\"70%\" align=\"left\"><ul>\n        <li>\n          <p>The IMS is certified as chip manufacturer  in accordance with CECC EN 100114 part 1.<br>\n            The IMS is awarded the certificate, proving  the high quality standards in development and manufacture of ASICs made at the  IMS.<br>\n            CECC EN 100114 part 6 certification.<\/p>\n        <\/li>\n      <\/ul><\/td>\n    <\/tr>\n    <tr>\n      <td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/ASIC-Design-Award.jpg\" \/><br \/>\n        <em>EDA award <\/em><\/td>\n      <td width=\"70%\" align=\"left\"><ul>\n        <li>\n          <p>The tiniest 5 kW pulse converter in the  world:<br>\n            Novodrive ND 21.<br>\n            This remarkably tiny tool was made possible  by the ASIC-NOVOCHIP that was developed jointly by NOVOTRON and the IMS.<br>\n            Awarded the EDA Award for &ldquo;best  ASIC_Design&rdquo;.<\/p>\n        <\/li>\n      <\/ul><\/td>\n    <\/tr>\n    <tr>\n      <td width=\"30%\" align=\"left\"><\/td>\n      <td width=\"70%\" align=\"left\"><ul>\n        <li>\n          <p>The PROMETHEUS project, a European EUREKA  initiative is completed.<\/p>\n        <\/li>\n      <\/ul><\/td>\n    <\/tr>\n  <\/tbody>\n<\/table>\n<hr \/>\n<h3>1996<\/h3>\n<table width=\"100%\" border=\"0\">\n  <tbody>\n    <tr>\n      <td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/HEXRETFahrzeug.jpg\" \/><\/td>\n      <td width=\"70%\" align=\"left\"><ul>\n        <li>\n          <p>As part of the &ldquo;Electronic Eye&quot;  project DB and the IMS develop an image processing system based on serially transportable  analog image data with a neuronal link.<\/p>\n        <\/li>\n      <\/ul><\/td>\n    <\/tr>\n    <tr>\n      <td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/VISION96-1_Preis.jpg\" \/><br \/>\n        <em>VISION prize 1996 <\/em><\/td>\n      <td width=\"70%\" align=\"left\"><ul>\n        <li>\n          <p>1st prize awarded to the HDRC\u00ae image sensor  for the field of applied image processing during the VISION trade fair 1996.<\/p>\n        <\/li>\n      <\/ul><\/td>\n    <\/tr>\n    <tr>\n      <td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/EASIE_II_flyer.jpg\" \/><br \/>\n        <em>EASIE model trial<\/em><\/td>\n      <td width=\"70%\" align=\"left\"><ul>\n        <li>\n          <p>As pilot project the EASIE project is initiated  through a cooperation between the BIBB and the industrial trade learning  centers (ETZ, EAZ) and industry (BBT) by integrating modern microelectronics  into the vocational training of electrical trades.<\/p>\n        <\/li>\n      <\/ul><\/td>\n    <\/tr>\n    <tr>\n      <td width=\"30%\" align=\"left\"><\/td>\n      <td width=\"70%\" align=\"left\"><ul>\n        <li>\n          <p>Production of 0.8 \u00b5m GATE FOREST\u00ae ASICs<\/p>\n        <\/li>\n      <\/ul><\/td>\n    <\/tr>\n  <\/tbody>\n<\/table>\n<hr \/>\n<h3>1997<\/h3>\n<table width=\"100%\" border=\"0\">\n  <tbody>\n    <tr>\n      <td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/LOGLUX-Kamera_Noble.jpg\" \/><br \/>\n        <em>Loglux camera <\/em><\/td>\n      <td width=\"70%\" align=\"left\"><ul>\n        <li>\n          <p>Initiation of Loglux as first HDRC\u00ae serial  product.<\/p>\n        <\/li>\n      <\/ul><\/td>\n    <\/tr>\n    <tr>\n      <td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/EINF2.jpg\" \/><br \/>\n        <em>1. Photo diode array for subretinal implants<\/em><\/td>\n      <td width=\"70%\" align=\"left\"><ul>\n        <li>\n          <p>The IMS develops the first photo diode  arrays to be used for future sub-retinal implants of the vision impaired.<\/p>\n        <\/li>\n      <\/ul><\/td>\n    <\/tr>\n    <tr>\n      <td width=\"30%\" align=\"left\"><\/td>\n      <td width=\"70%\" align=\"left\"><ul>\n        <li>\n          <p>In cooperation with Bosch the IMS develops  a special camera for &ldquo;Robust Vehicle Vision&rdquo; to use in image processing systems  for vehicles.<br>\n            The 0.35 \u00b5m IBM technology HDRC-type image  sensor has 720&nbsp;x&nbsp;576 pixels with a 13.5 \u00b5m pixel distance, integrated  AD and DA converters and special circuits to support wafer tests.<\/p>\n        <\/li>\n      <\/ul><\/td>\n    <\/tr>\n    <tr>\n      <td width=\"30%\" align=\"left\"><\/td>\n      <td width=\"70%\" align=\"left\"><ul>\n        <li>\n          <p>Development of the Si membrane technology.<\/p>\n        <\/li>\n      <\/ul><\/td>\n    <\/tr>\n    <tr>\n      <td width=\"30%\" align=\"left\"><\/td>\n      <td width=\"70%\" align=\"left\"><ul>\n        <li><span jsaction=\"mouseup:BR6jm\" jsname=\"jqKxS\" lang=\"en\"><span jsaction=\"agoMJf:PFBcW;usxOmf:aWLT7;jhKsnd:P7O7bd,F8DmGf;Q4AGo:Gm7gYd,qAKMYb;uFUCPb:pvnm0e,pfE8Hb,PFBcW;f56efd:dJXsye;EnoYf:KNzws,ZJsZZ,JgVSJc;zdMJQc:cCQNKb,ZJsZZ,zchEXc;Ytrrj:JJDvdc;tNR8yc:GeFvjb;oFN6Ye:hij5Wb\" jscontroller=\"Zl5N8\" jsmodel=\"SsMkhd\" jsname=\"txFAF\" data-language-for-alternatives=\"en\" data-language-to-translate-into=\"de\" data-phrase-index=\"0\" jsdata=\"uqLsIf;_;$38\"><span jsaction=\"click:qtZ4nf,GFf3ac,tMZCfe; contextmenu:Nqw7Te,QP7LD; mouseout:Nqw7Te; mouseover:qtZ4nf,c2aHje\" jsname=\"W297wb\">A license and development contract for HDRC\u00ae sensors with VGA resolution is concluded with G-Link (USA, Taiwan).<\/span><\/span><\/span><\/li>\n      <\/ul><\/td>\n    <\/tr>\n  <\/tbody>\n<\/table>\n<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t<div class=\"elementor-accordion-item\">\n\t\t\t\t\t<div id=\"elementor-tab-title-11013\" class=\"elementor-tab-title\" data-tab=\"13\" role=\"button\" aria-controls=\"elementor-tab-content-11013\" aria-expanded=\"false\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-accordion-icon elementor-accordion-icon-left\" aria-hidden=\"true\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-accordion-icon-closed\"><i class=\"far fa-caret-square-down\"><\/i><\/span>\n\t\t\t\t\t\t\t\t<span class=\"elementor-accordion-icon-opened\"><i class=\"fas fa-caret-up\"><\/i><\/span>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t\t\t\t<a class=\"elementor-accordion-title\" tabindex=\"0\">1992-1994<\/a>\n\t\t\t\t\t<\/div>\n\t\t\t\t\t<div id=\"elementor-tab-content-11013\" class=\"elementor-tab-content elementor-clearfix\" data-tab=\"13\" role=\"region\" aria-labelledby=\"elementor-tab-title-11013\"><h3>1992<\/h3>\n<table width=\"100%\" border=\"0\">\n  <tbody>\n    <tr>\n      <td width=\"30%\" align=\"left\"><p><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/SMC_Gruppenfoto_1992_Flyer.jpg\" \/><\/p>\n        <p><em>SMC group picture <\/em><\/p><\/td>\n      <td width=\"70%\" align=\"left\"><ul>\n        <li>\n          <p>The first &ldquo;Sch\u00fclerinnen und Sch\u00fcler machen  Chips&rdquo; (SMC \u2013 practical course for students) is held at the IMS.<\/p>\n        <\/li>\n      <\/ul><\/td>\n    <\/tr>\n    <tr>\n      <td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/HDRC-Patent2.jpg\" \/><br \/>\n        <em>Basic patent HDRC\u00ae-Bildsensoren   <\/em><\/td>\n      <td width=\"70%\" align=\"left\"><ul>\n        <li>The  IMS patents the basic patent for highly-dynamic HDRC\u00ae image sensors.<\/li>\n      <\/ul><\/td>\n    <\/tr>\n  <\/tbody>\n<\/table>\n<hr \/>\n<h3>1993<\/h3>\n<table width=\"100%\" border=\"0\">\n  <tbody>\n    <tr>\n      <td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/3D_CMOS_NAND_Array-1.jpg\" \/><br \/>\n        <em>3D Chip <\/em><\/td>\n      <td width=\"70%\" align=\"left\"><ul>\n        <li>\n          <p>Comprehensive and successful research is  carried out at the IMS regarding the 3D integration of CMOS circuits.<br>\n            The results of chips with &ldquo;piled-up  transistors&rdquo; draw attention among the experts.<\/p>\n        <\/li>\n      <\/ul><\/td>\n    <\/tr>\n    <tr>\n      <td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/ISO-Zertifikat-eng.jpg\" \/><br \/>\n        <em> ISO 9001 certification<\/em><\/td>\n      <td width=\"70%\" align=\"left\"><ul>\n        <li>\n          <p>The IMS is being awarded the ISO 9001  certificate.<\/p><\/li>\n      <\/ul><\/td>\n    <\/tr>\n    <tr>\n      <td width=\"30%\" align=\"left\"><\/td>\n      <td width=\"70%\" align=\"left\"><ul>\n        <li>\n          <p>Within the framework of the PRO CHIP  project, the first image sensor with 64&nbsp;x&nbsp;64 pixels in accordance  with the patented IMS HDRC\u00ae principle is presented.<\/p>\n        <\/li>\n      <\/ul><\/td>\n    <\/tr>\n    <tr>\n      <td width=\"30%\" align=\"left\"><\/td>\n      <td width=\"70%\" align=\"left\"><ul>\n        <li>\n          <p>Joint evaluation of the ZBA31H e-beam  writer with Jenoptik at the IMS.<\/p>\n        <\/li>\n      <\/ul><\/td>\n    <\/tr>\n  <\/tbody>\n<\/table>\n<hr \/>\n<h3>1994<\/h3>\n<table width=\"100%\" border=\"0\">\n  <tbody>\n    <tr>\n      <td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/Bosch-UHF-Platine3.jpg\" \/><br \/>\n        <em>Bosch radio equipment with IMS HF transistors<\/em><\/td>\n      <td width=\"70%\" align=\"left\"><ul>\n        <li>\n          <p>Development and serial production of HF  power transistor stages in bipolar technology for Bosch radio equipment within  VHF and\/or UHF transmission of up to 480 MHz with 7 Watts power.<\/p>\n        <\/li>\n      <\/ul><\/td>\n    <\/tr>\n    <tr>\n      <td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/Arith-Chip_600.jpg\" \/><br \/>\n        <em> Vector Arithmetic Coprocessor<\/em><\/td>\n      <td width=\"70%\" align=\"left\"><ul>\n        <li>\n          <p>Together with researchers from the  Karlsruhe Research Center for Information Technology (FZI) a complex &ldquo;Vector  Arithmetics Coprocessor&rdquo; is developed and manufactured at the IMS.<\/p>\n        <\/li>\n      <\/ul><\/td>\n    <\/tr>\n    <tr>\n      <td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/SAND-board.jpg\" \/><br \/>\n        <em>SAND Board <\/em><\/td>\n      <td width=\"70%\" align=\"left\"><ul>\n        <li>\n          <p>The neuro processors department develops  SIOP, a digital neuro-processor enabling realtime neuronal applications, in  cooperation with GEMAC mbH.<\/p>\n        <\/li>\n      <\/ul><\/td>\n    <\/tr>\n  <\/tbody>\n<\/table>\n<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t<div class=\"elementor-accordion-item\">\n\t\t\t\t\t<div id=\"elementor-tab-title-11014\" class=\"elementor-tab-title\" data-tab=\"14\" role=\"button\" aria-controls=\"elementor-tab-content-11014\" aria-expanded=\"false\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-accordion-icon elementor-accordion-icon-left\" aria-hidden=\"true\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-accordion-icon-closed\"><i class=\"far fa-caret-square-down\"><\/i><\/span>\n\t\t\t\t\t\t\t\t<span class=\"elementor-accordion-icon-opened\"><i class=\"fas fa-caret-up\"><\/i><\/span>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t\t\t\t<a class=\"elementor-accordion-title\" tabindex=\"0\">1989-1991<\/a>\n\t\t\t\t\t<\/div>\n\t\t\t\t\t<div id=\"elementor-tab-content-11014\" class=\"elementor-tab-content elementor-clearfix\" data-tab=\"14\" role=\"region\" aria-labelledby=\"elementor-tab-title-11014\"><h3>1989<\/h3>\n<table width=\"100%\" border=\"0\">\n  <tbody>\n    <tr>\n      <td width=\"30%\" align=\"left\"><p><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/Erster_Gate_Forest_REM.jpg\" \/><\/p>\n        <p><em>2-\u00b5m-GATE FOREST <\/em><\/p><\/td>\n      <td width=\"70%\" align=\"left\"><ul>\n        <li>\n          <p>The IMS GATE FOREST\u00ae production is switched  over to the 2 \u00b5m process with double layer plating<\/p>\n        <\/li>\n      <\/ul><\/td>\n    <\/tr>\n    <tr>\n      <td width=\"30%\" align=\"left\"><\/td>\n      <td width=\"70%\" align=\"left\"><ul>\n        <li>\n          <p>The simulator for neuronal networks NNSIM  is developed.<\/p>\n        <\/li>\n      <\/ul><\/td>\n    <\/tr>\n    <tr>\n      <td width=\"30%\" align=\"left\"><\/td>\n      <td width=\"70%\" align=\"left\"><ul>\n        <li>\n          <p>Development of the QBP chips (Quadrupel  Broadband Port) for SEL-Alcatel on the IMS largest GATE FOREST\u00ae master.<\/p>\n        <\/li>\n      <\/ul><\/td>\n    <\/tr>\n  <\/tbody>\n<\/table>\n<hr \/>\n<center>\n<\/center>\n<h3>1990<\/h3>\n<table width=\"100%\" border=\"0\">\n  <tbody>\n    <tr>\n      <td width=\"30%\" align=\"left\"><p><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/1666920FAB9D405F.jpg\" \/><\/p>\n        <p><em>COMETT course participants <\/em><\/p><\/td>\n      <td width=\"70%\" align=\"left\"><ul>\n        <li>\n          <p>The IMS produces the educational COMETT  (Community Action Program for Education and Training for Technology in the  European Community) video seminars, the most important multilateral EU program  sponsoring the cooperation between universities and industry.<\/p>\n        <\/li>\n      <\/ul><\/td>\n    <\/tr>\n    <tr>\n      <td width=\"30%\" align=\"left\"><p><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2021\/01\/ptc_4_ly.jpg\" \/><\/p>\n        <p><em>Test structure layout<\/em><\/p><\/td>\n      <td width=\"70%\" align=\"left\"><ul>\n        <li>\n          <p>Within the framework of the JESSI Project  AC41 &ldquo;Technology Assessment&rdquo; testing structures, measurement and evaluation  processes for the then up-to-date Deep Submicron technologies were developed in  cooperation with Alcatel-SEL, Siemens, STMicroelectronics, Bosch among other  companies and standardized within the scope of CENELEC.<\/p>\n        <\/li>\n      <\/ul><\/td>\n    <\/tr>\n    <tr>\n      <td width=\"30%\" align=\"left\"><p><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2021\/01\/MCM_IMG_5521.jpg\" \/><\/p>\n        <p><em> MCM on Si carrier<\/em><\/p><\/td>\n      <td width=\"70%\" align=\"left\"><ul>\n        <li>IBM joins the IMS in the development  of a technology for MCMs on Si carriers. The carriers connect 9 VLSI chips into a high-power CPU replacing the  multilayer ceramics. <\/li>\n      <\/ul><\/td>\n    <\/tr>\n  <\/tbody>\n<\/table>\n<hr \/>\n<h3>1991<\/h3>\n<table width=\"100%\" border=\"0\">\n  <tbody>\n    <tr>\n      <td width=\"30%\" align=\"left\"><p><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/AMK_AC3B_Chip_mS.jpg\" \/><\/p>\n        <p><em>AMK ASIC &bdquo;AC3&ldquo; <\/em><\/p><\/td>\n      <td width=\"70%\" align=\"left\"><ul>\n        <li>\n          <p>The Arnold M\u00fcller Kirchheim (AMK) company  mandates the IMS with the improvement and advancement of an American chip  manufacturer\u00b4s ASIC.<br>\n            The &ldquo;AC3&rdquo; GATE FOREST\u00ae ASIC develops into a  AMK key component of the pioneering fully digital drive and control system  &ldquo;AMKASYN&rdquo; for electrical engines in industrial equipment.<br>\n            The &ldquo;AC3&rdquo; is still produced today.<\/p>\n        <\/li>\n      <\/ul><\/td>\n    <\/tr>\n    <tr>\n      <td width=\"30%\" align=\"left\"><p><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/Wafer_Bonding.jpg\" \/><\/p>\n        <p><em>Wafer bonding<\/em><\/p><\/td>\n      <td width=\"70%\" align=\"left\"><ul>\n        <li>\n          <p>The IMS develops the wafer bonding process  and uses it successfully.<br>\n            Besides fundamental research regarding  bonding and characterization Silicon-on-Insulator (SOI) wafers were  manufactured for automotive applications.<br>\n            A power component developed with this  technology was integrated into IMS-made SOI wafers together with CMOS circuits.<\/p>\n        <\/li>\n      <\/ul><\/td>\n    <\/tr>\n    <tr>\n      <td width=\"30%\" align=\"left\"><p><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/Wafer_personalisiert.jpg\" \/><\/p>\n        <p><em>6 inch wafer  <\/em><\/p><\/td>\n      <td width=\"70%\" align=\"left\"><ul>\n        <li>The  IMS technology is switched from 4 inch into 6 inch wafers, GATE FOREST\u00ae is  produced using a 1.2 \u00b5m process.<br>\n        <\/li>\n      <\/ul><\/td>\n    <\/tr>\n  <\/tbody>\n<\/table>\n<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t<div class=\"elementor-accordion-item\">\n\t\t\t\t\t<div id=\"elementor-tab-title-11015\" class=\"elementor-tab-title\" data-tab=\"15\" role=\"button\" aria-controls=\"elementor-tab-content-11015\" aria-expanded=\"false\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-accordion-icon elementor-accordion-icon-left\" aria-hidden=\"true\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-accordion-icon-closed\"><i class=\"far fa-caret-square-down\"><\/i><\/span>\n\t\t\t\t\t\t\t\t<span class=\"elementor-accordion-icon-opened\"><i class=\"fas fa-caret-up\"><\/i><\/span>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t\t\t\t<a class=\"elementor-accordion-title\" tabindex=\"0\">1986-1988<\/a>\n\t\t\t\t\t<\/div>\n\t\t\t\t\t<div id=\"elementor-tab-content-11015\" class=\"elementor-tab-content elementor-clearfix\" data-tab=\"15\" role=\"region\" aria-labelledby=\"elementor-tab-title-11015\"><h3>1986<\/h3>\n<table width=\"100%\" border=\"0\">\n  <tbody>\n    <tr>\n      <td width=\"30%\" align=\"left\"><p><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/IMS_Einweihungfeier.jpg\" \/><\/p>\n        <p><em>Inauguration ceremony<\/em><\/p><\/td>\n      <td width=\"70%\" align=\"left\"><ul>\n        <li>\n          <p>Completion of clean room and operational  startup of semiconductor production line at the IMS.<br>\n            In a ceremony the Baden-W\u00fcrttemberg prime  minister at the time, Lothar Sp\u00e4th, formerly inaugurated the institute.<\/p>\n        <\/li>\n      <\/ul><\/td>\n    <\/tr>\n    <tr>\n      <td width=\"30%\" align=\"left\"><p><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/IMS_Technologie.jpg\" \/><\/p>\n        <p><em> Clean room<\/em><\/p><\/td>\n      <td width=\"70%\" align=\"left\"><ul>\n        <li>Die ACMOS-Technologie  von Siemens wird am IMS eingef\u00fchrt.<br>\n        <\/li>\n      <\/ul><\/td>\n    <\/tr>\n  <\/tbody>\n<\/table>\n<hr \/>\n<h3>1987<\/h3>\n<table width=\"100%\" border=\"0\">\n  <tbody>\n    <tr>\n      <td width=\"30%\" align=\"left\"><p><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/Hohnerchip_komplett_A_10F5.jpg\" \/><\/p>\n        <p><em>Hohner chip<\/em><\/p><\/td>\n      <td width=\"70%\" align=\"left\"><ul>\n        <li>\n          <p>            The Trossingen-based Hohner company  mandates Intermetall in Freiburg with the volume production of the &ldquo;Hohner  chips&rdquo; developed by the IMS.<\/p>\n        <\/li>\n      <\/ul><\/td>\n    <\/tr>\n    <tr>\n      <td width=\"30%\" align=\"left\"><\/td>\n      <td width=\"70%\" align=\"left\"><ul>\n        <li>\n          <p>The first CMOS microchips are manufactured  using a 3 \u00b5m process.<\/p>\n        <\/li>\n      <\/ul><\/td>\n    <\/tr>\n    <tr>\n      <td width=\"30%\" align=\"left\"><\/td>\n      <td width=\"70%\" align=\"left\"><ul>\n        <li>\n          <p>The IMS Association of Sponsors donates 1  million German marks to the IMS that is then used to set up a quality and  reliability laboratory.<\/p>\n        <\/li>\n      <\/ul><\/td>\n    <\/tr>\n  <\/tbody>\n<\/table>\n<hr \/>\n<h3>1988<\/h3>\n<table width=\"100%\" border=\"0\">\n  <tbody>\n    <tr>\n      <td width=\"30%\" align=\"left\"><p><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/E-Beam.jpg\" \/><\/p>\n        <p><em>HL700 e-beam writer <\/em><\/p><\/td>\n      <td width=\"70%\" align=\"left\"><ul>\n        <li>\n          <p>Operational startup of the HL700 electron  beam direct writer.<\/p>\n        <\/li>\n      <\/ul><\/td>\n    <\/tr>\n    <tr>\n      <td width=\"30%\" align=\"left\"><p><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/Bizerba_Power_GateForest.jpg\" \/><\/p>\n        <p><em>Control chip for fluorescent displays<\/em><\/p><\/td>\n      <td width=\"70%\" align=\"left\"><ul>\n        <li>\n          <p>The IMS implements the so-called &ldquo;SME  program&rdquo;.<br>\n            Among others an integrated display driver  chip to control fluorescent displays of weighing scales developed by the  Bizerba company in Balingen is designed.<\/p>\n        <\/li>\n      <\/ul><\/td>\n    <\/tr>\n    <tr>\n      <td width=\"30%\" align=\"left\"><p><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/FH-CHIP.jpg\" \/><\/p>\n        <p><em>&bdquo;Multi-Projekt-Chip&ldquo; <\/em><\/p><\/td>\n      <td width=\"70%\" align=\"left\"><ul>\n        <li>\n          <p>The Heilbronn University holds the first  Workshop of the Multi-Projekt-Chip (MPC)-Gruppe.<br>\n            It enables cost-efficient access to the  manufacture of microchips for universities.<br>\n            The topic of the opening discussion of the  workshop is the foundry service at the IMS open to all MPC members.<br>\n            In the years to follow the IMS continues to  develop numerous chips for the MPC group.<\/p>\n        <\/li>\n      <\/ul><\/td>\n    <\/tr>\n  <\/tbody>\n<\/table>\n<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t<div class=\"elementor-accordion-item\">\n\t\t\t\t\t<div id=\"elementor-tab-title-11016\" class=\"elementor-tab-title\" data-tab=\"16\" role=\"button\" aria-controls=\"elementor-tab-content-11016\" aria-expanded=\"false\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-accordion-icon elementor-accordion-icon-left\" aria-hidden=\"true\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-accordion-icon-closed\"><i class=\"far fa-caret-square-down\"><\/i><\/span>\n\t\t\t\t\t\t\t\t<span class=\"elementor-accordion-icon-opened\"><i class=\"fas fa-caret-up\"><\/i><\/span>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t\t\t\t<a class=\"elementor-accordion-title\" tabindex=\"0\">1983-1985<\/a>\n\t\t\t\t\t<\/div>\n\t\t\t\t\t<div id=\"elementor-tab-content-11016\" class=\"elementor-tab-content elementor-clearfix\" data-tab=\"16\" role=\"region\" aria-labelledby=\"elementor-tab-title-11016\"><h3>1983<\/h3>\n<table width=\"100%\" border=\"0\">\n  <tbody>\n    <tr>\n      <td width=\"30%\" align=\"left\"><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2021\/01\/Lueder_Ernst_01.jpg\" alt=\"Prof. Ernst L\u00fcder \" \/><\/td>\n      <td width=\"70%\" align=\"left\"><ul>\n        <li>\n          <p>Entry into the Stuttgart foundation  registry as &ldquo;Institut f\u00fcr Mikroelektronik Stuttgart&rdquo; on July 18th, 1983.<br>\n            Prof. Ernst L\u00fcder becomes founding director  of the institute.<\/p>\n        <\/li>\n      <\/ul><\/td>\n    <\/tr>\n    <tr>\n      <td width=\"30%\" align=\"left\"><\/td>\n      <td width=\"70%\" align=\"left\"><ul>\n        <li>\n          <p>The non-profit Verein der F\u00f6rderer f\u00fcr  Mikroelektronik in Stuttgart e.V. (IMS Association of Sponsors) is founded.<\/p>\n        <\/li>\n      <\/ul><\/td>\n    <\/tr>\n  <\/tbody>\n<\/table>\n<hr \/>\n<center>\n<\/center>\n<h3>1984<\/h3>\n<table width=\"100%\" border=\"0\">\n  <tbody>\n    <tr>\n      <td width=\"30%\" align=\"left\"><p><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/IMS_Gebaeude_92.jpg\" alt=\"IMS CHIPS Geb\u00e4ude 1992\" \/><\/p>\n        <p><em>IMS facility <\/em><\/p><\/td>\n      <td width=\"70%\" align=\"left\"><ul>\n        <li>At the newly established IMS plans  for a clean room with a modern semiconductor production line, computer-based  design tools and a testing lab for microchips are in full swing.<\/li>\n      <\/ul><\/td>\n    <\/tr>\n  <\/tbody>\n<\/table>\n<hr \/>\n<center>\n<\/center>\n<h3>1985<\/h3>\n<table width=\"100%\" border=\"0\">\n  <tbody>\n    <tr>\n      <td width=\"30%\" align=\"left\"><p><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/Hoefflinger_102-0216_IMG.jpg\" alt=\"Prof. Dr. Bernd H\u00f6fflinger\" \/><\/p>\n        <p><em>Prof. Dr. Bernd H\u00f6fflinger<\/em><\/p><\/td>\n      <td width=\"70%\" align=\"left\"><ul>\n        <li>In record time between spring and  fall the clean room buil\u00adding is erected and put into operation. There are 700  square meters available in the clean room and twice as much space for clean  room technology, labs, offices and the shop for work on microchips.<\/li>\n      <\/ul><\/td>\n    <\/tr>\n    <tr>\n      <td width=\"30%\" align=\"left\"><p><img decoding=\"async\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/10\/Prometheus.jpg\" alt=\"Projekt PROMETHEUS\" \/><\/p><\/td>\n      <td width=\"70%\" align=\"left\"><ul>\n        <li>Within the scope of the European initiative EUREKA the PROMETHEUS  project is born. It consists of a cooperation between the IMS, Bosch,  Daimler-Benz, Siemens and VW and outlines the basics for modern safety features  in vehicles: ve\u00adhicle interval radar, surface recognition, track assistance.<\/li>\n      <\/ul><\/td>\n    <\/tr>\n    <tr>\n      <td width=\"30%\" align=\"left\"><\/td>\n      <td width=\"70%\" align=\"left\"><ul>\n        <li><em>Acquisition of an electron beam writer has been applied for.<\/em><\/li>\n      <\/ul><\/td>\n    <\/tr>\n  <\/tbody>\n<\/table>\n<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<\/div>\n\t\t","protected":false},"excerpt":{"rendered":"<p>About us Institut f\u00fcr Mikroelektronik Stuttgart Civil law foundation Member of the Innovationsallianz Baden-W\u00fcrttemberg Executive Director of the Institute: Prof. Dr. Niels Quack Foundation: 1983 by the state of Baden-W\u00fcrttemberg Number of employees: +100 Operating budget: 18,3 million euros Institute profile Management Research Association History 2022-2023 2022 Nano-HySiF project IMS [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"page-templates\/template-pagebuilder-full-width.php","meta":{"footnotes":""},"class_list":["post-1322","page","type-page","status-publish","hentry"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v28.7 - 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