{"id":11651,"date":"2024-08-26T11:14:37","date_gmt":"2024-08-26T09:14:37","guid":{"rendered":"https:\/\/www.ims-chips.com\/?p=11651"},"modified":"2024-08-26T12:07:58","modified_gmt":"2024-08-26T10:07:58","slug":"hyperstripes","status":"publish","type":"post","link":"https:\/\/www.ims-chips.com\/?p=11651","title":{"rendered":"HyPerStripes"},"content":{"rendered":"\t\t
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HyPerStripes<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t
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New packaging and connection technology for reliable bendable electronics<\/strong><\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t

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1.4\u00a0mm\u00a0x\u00a04.35\u00a0mm selection ASIC, thinned to 30\u00a0\u00b5m<\/em><\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t

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Selection asic integrated in polymer foil<\/em><\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t

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The HyPerStripes project, which was launched in spring 2022 targeting the development of new packaging and connection technologies for bendable electronics, quite impressed the European reviewers with its interim results in April of this year.\nThe work on the six application demonstrators, which are mainly designed and developed for the medical sector, was presented.\nThese range from the use of large-area sensor mats for the continuous recording of vital parameters to the replacement of rigid cabling systems with flexible polymer films. The latter is of crucial importance, as breaks and interruptions can occur during the installation of the connection cables and therefore the reliable functioning of the entire sensor unit or system cannot be guaranteed. \nIn the German consortium of the nationally funded project (funding code: 16ME0469), IMS CHIPS is responsible for chip chip integration and contacting on flexible polymer substrates for the application demonstrator of the cardiac catheter specialist Osypka.<\/p>\n

The application demonstrator consists of two individual components. One is a sensor patch to record electrical signals in the tissue, which is equipped with an integrated readout ASIC. This is used to evaluate and digitize the small, sensitive signals directly on site. The second main component is a long and thin polymer strip, which is intended to replace the rigid connecting cables. Both components are made of a polymer, thermoplastic polyurethane, which not only offers flexibility but also stretchability as a material property. Fraunhofer EMFT is developing the roll-to-roll technology for the bendable cable systems, and the sensor patch is being produced at W\u00fcrth Elektronik using the sheet-2-sheet process. The electrical connection of the two components is made possible by galvanically grown nanowires on the contact surfaces and subsequent joining processes, which are provided by the NanoWired GmbH. This metallic lawn of hair-thin metal rods ensures the electrical and mechanical stability of the entire application demonstrator, similar to a Velcro fastener. <\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t

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Contact: Ulrike Passlack \u2022 phone +49 711 21855-488 \u2022 passlack@ims-chips.de
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The second kick-off meeting that took place at IMS CHIPS in April marks the start of the European joint project HyPerStripes – \u201cNew packaging technology for reliable bendable electronics\u201d entering its final year. 16 partners from three countries are collaborating to develop solutions for flexible connections and two-dimensional hybrid film systems.<\/p>\n","protected":false},"author":1,"featured_media":11652,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[31],"tags":[],"class_list":["post-11651","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-newsletter-2024"],"yoast_head":"\nHyPerStripes - Institut f\u00fcr Mikroelektronik Stuttgart<\/title>\n<meta name=\"description\" content=\"New packaging and connection technology for reliable bendable electronics\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.ims-chips.com\/?p=11651\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"HyPerStripes - Institut f\u00fcr Mikroelektronik Stuttgart\" \/>\n<meta property=\"og:description\" content=\"New packaging and connection technology for reliable bendable electronics\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.ims-chips.com\/?p=11651\" \/>\n<meta property=\"og:site_name\" content=\"Institut f\u00fcr Mikroelektronik Stuttgart\" \/>\n<meta property=\"article:published_time\" content=\"2024-08-26T09:14:37+00:00\" \/>\n<meta property=\"article:modified_time\" content=\"2024-08-26T10:07:58+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/www.ims-chips.com\/wp-content\/uploads\/2024\/08\/HyPerStripes_Review_Treffen_04_2024.jpg\" \/>\n\t<meta property=\"og:image:width\" content=\"667\" \/>\n\t<meta property=\"og:image:height\" content=\"568\" \/>\n\t<meta property=\"og:image:type\" content=\"image\/jpeg\" \/>\n<meta name=\"author\" content=\"meier\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"meier\" \/>\n\t<meta name=\"twitter:label2\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data2\" content=\"2 minutes\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\\\/\\\/www.ims-chips.com\\\/?p=11651#article\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.ims-chips.com\\\/?p=11651\"},\"author\":{\"name\":\"meier\",\"@id\":\"https:\\\/\\\/www.ims-chips.com\\\/#\\\/schema\\\/person\\\/9839fb63530e7563aa83867413b8c6e7\"},\"headline\":\"HyPerStripes\",\"datePublished\":\"2024-08-26T09:14:37+00:00\",\"dateModified\":\"2024-08-26T10:07:58+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\\\/\\\/www.ims-chips.com\\\/?p=11651\"},\"wordCount\":346,\"publisher\":{\"@id\":\"https:\\\/\\\/www.ims-chips.com\\\/#organization\"},\"image\":{\"@id\":\"https:\\\/\\\/www.ims-chips.com\\\/?p=11651#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/www.ims-chips.com\\\/wp-content\\\/uploads\\\/2024\\\/08\\\/HyPerStripes_Review_Treffen_04_2024.jpg\",\"articleSection\":[\"Newsletter 2024\"],\"inLanguage\":\"en-US\"},{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/www.ims-chips.com\\\/?p=11651\",\"url\":\"https:\\\/\\\/www.ims-chips.com\\\/?p=11651\",\"name\":\"HyPerStripes - Institut f\u00fcr Mikroelektronik Stuttgart\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.ims-chips.com\\\/#website\"},\"primaryImageOfPage\":{\"@id\":\"https:\\\/\\\/www.ims-chips.com\\\/?p=11651#primaryimage\"},\"image\":{\"@id\":\"https:\\\/\\\/www.ims-chips.com\\\/?p=11651#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/www.ims-chips.com\\\/wp-content\\\/uploads\\\/2024\\\/08\\\/HyPerStripes_Review_Treffen_04_2024.jpg\",\"datePublished\":\"2024-08-26T09:14:37+00:00\",\"dateModified\":\"2024-08-26T10:07:58+00:00\",\"description\":\"New packaging and connection technology for reliable bendable electronics\",\"breadcrumb\":{\"@id\":\"https:\\\/\\\/www.ims-chips.com\\\/?p=11651#breadcrumb\"},\"inLanguage\":\"en-US\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\\\/\\\/www.ims-chips.com\\\/?p=11651\"]}]},{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\\\/\\\/www.ims-chips.com\\\/?p=11651#primaryimage\",\"url\":\"https:\\\/\\\/www.ims-chips.com\\\/wp-content\\\/uploads\\\/2024\\\/08\\\/HyPerStripes_Review_Treffen_04_2024.jpg\",\"contentUrl\":\"https:\\\/\\\/www.ims-chips.com\\\/wp-content\\\/uploads\\\/2024\\\/08\\\/HyPerStripes_Review_Treffen_04_2024.jpg\",\"width\":667,\"height\":568,\"caption\":\"HyPerStripes\"},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\\\/\\\/www.ims-chips.com\\\/?p=11651#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Startseite\",\"item\":\"https:\\\/\\\/www.ims-chips.com\\\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"HyPerStripes\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\\\/\\\/www.ims-chips.com\\\/#website\",\"url\":\"https:\\\/\\\/www.ims-chips.com\\\/\",\"name\":\"Institut f\u00fcr Mikroelektronik Stuttgart\",\"description\":\"Your Certified Silicon Designer Factory.\",\"publisher\":{\"@id\":\"https:\\\/\\\/www.ims-chips.com\\\/#organization\"},\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\\\/\\\/www.ims-chips.com\\\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"en-US\"},{\"@type\":\"Organization\",\"@id\":\"https:\\\/\\\/www.ims-chips.com\\\/#organization\",\"name\":\"Institut f\u00fcr Mikroelektronik Stuttgart\",\"url\":\"https:\\\/\\\/www.ims-chips.com\\\/\",\"logo\":{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\\\/\\\/www.ims-chips.com\\\/#\\\/schema\\\/logo\\\/image\\\/\",\"url\":\"https:\\\/\\\/www.ims-chips.com\\\/wp-content\\\/uploads\\\/2020\\\/09\\\/logo_ims.png\",\"contentUrl\":\"https:\\\/\\\/www.ims-chips.com\\\/wp-content\\\/uploads\\\/2020\\\/09\\\/logo_ims.png\",\"width\":262,\"height\":65,\"caption\":\"Institut f\u00fcr Mikroelektronik Stuttgart\"},\"image\":{\"@id\":\"https:\\\/\\\/www.ims-chips.com\\\/#\\\/schema\\\/logo\\\/image\\\/\"}},{\"@type\":\"Person\",\"@id\":\"https:\\\/\\\/www.ims-chips.com\\\/#\\\/schema\\\/person\\\/9839fb63530e7563aa83867413b8c6e7\",\"name\":\"meier\",\"sameAs\":[\"https:\\\/\\\/www.ims-chips.de\"]}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"HyPerStripes - Institut f\u00fcr Mikroelektronik Stuttgart","description":"New packaging and connection technology for reliable bendable electronics","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/www.ims-chips.com\/?p=11651","og_locale":"en_US","og_type":"article","og_title":"HyPerStripes - Institut f\u00fcr Mikroelektronik Stuttgart","og_description":"New packaging and connection technology for reliable bendable electronics","og_url":"https:\/\/www.ims-chips.com\/?p=11651","og_site_name":"Institut f\u00fcr Mikroelektronik Stuttgart","article_published_time":"2024-08-26T09:14:37+00:00","article_modified_time":"2024-08-26T10:07:58+00:00","og_image":[{"width":667,"height":568,"url":"https:\/\/www.ims-chips.com\/wp-content\/uploads\/2024\/08\/HyPerStripes_Review_Treffen_04_2024.jpg","type":"image\/jpeg"}],"author":"meier","twitter_card":"summary_large_image","twitter_misc":{"Written by":"meier","Est. reading time":"2 minutes"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"Article","@id":"https:\/\/www.ims-chips.com\/?p=11651#article","isPartOf":{"@id":"https:\/\/www.ims-chips.com\/?p=11651"},"author":{"name":"meier","@id":"https:\/\/www.ims-chips.com\/#\/schema\/person\/9839fb63530e7563aa83867413b8c6e7"},"headline":"HyPerStripes","datePublished":"2024-08-26T09:14:37+00:00","dateModified":"2024-08-26T10:07:58+00:00","mainEntityOfPage":{"@id":"https:\/\/www.ims-chips.com\/?p=11651"},"wordCount":346,"publisher":{"@id":"https:\/\/www.ims-chips.com\/#organization"},"image":{"@id":"https:\/\/www.ims-chips.com\/?p=11651#primaryimage"},"thumbnailUrl":"https:\/\/www.ims-chips.com\/wp-content\/uploads\/2024\/08\/HyPerStripes_Review_Treffen_04_2024.jpg","articleSection":["Newsletter 2024"],"inLanguage":"en-US"},{"@type":"WebPage","@id":"https:\/\/www.ims-chips.com\/?p=11651","url":"https:\/\/www.ims-chips.com\/?p=11651","name":"HyPerStripes - Institut f\u00fcr Mikroelektronik Stuttgart","isPartOf":{"@id":"https:\/\/www.ims-chips.com\/#website"},"primaryImageOfPage":{"@id":"https:\/\/www.ims-chips.com\/?p=11651#primaryimage"},"image":{"@id":"https:\/\/www.ims-chips.com\/?p=11651#primaryimage"},"thumbnailUrl":"https:\/\/www.ims-chips.com\/wp-content\/uploads\/2024\/08\/HyPerStripes_Review_Treffen_04_2024.jpg","datePublished":"2024-08-26T09:14:37+00:00","dateModified":"2024-08-26T10:07:58+00:00","description":"New packaging and connection technology for reliable bendable electronics","breadcrumb":{"@id":"https:\/\/www.ims-chips.com\/?p=11651#breadcrumb"},"inLanguage":"en-US","potentialAction":[{"@type":"ReadAction","target":["https:\/\/www.ims-chips.com\/?p=11651"]}]},{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/www.ims-chips.com\/?p=11651#primaryimage","url":"https:\/\/www.ims-chips.com\/wp-content\/uploads\/2024\/08\/HyPerStripes_Review_Treffen_04_2024.jpg","contentUrl":"https:\/\/www.ims-chips.com\/wp-content\/uploads\/2024\/08\/HyPerStripes_Review_Treffen_04_2024.jpg","width":667,"height":568,"caption":"HyPerStripes"},{"@type":"BreadcrumbList","@id":"https:\/\/www.ims-chips.com\/?p=11651#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Startseite","item":"https:\/\/www.ims-chips.com\/"},{"@type":"ListItem","position":2,"name":"HyPerStripes"}]},{"@type":"WebSite","@id":"https:\/\/www.ims-chips.com\/#website","url":"https:\/\/www.ims-chips.com\/","name":"Institut f\u00fcr Mikroelektronik Stuttgart","description":"Your Certified Silicon Designer Factory.","publisher":{"@id":"https:\/\/www.ims-chips.com\/#organization"},"potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/www.ims-chips.com\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"en-US"},{"@type":"Organization","@id":"https:\/\/www.ims-chips.com\/#organization","name":"Institut f\u00fcr Mikroelektronik Stuttgart","url":"https:\/\/www.ims-chips.com\/","logo":{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/www.ims-chips.com\/#\/schema\/logo\/image\/","url":"https:\/\/www.ims-chips.com\/wp-content\/uploads\/2020\/09\/logo_ims.png","contentUrl":"https:\/\/www.ims-chips.com\/wp-content\/uploads\/2020\/09\/logo_ims.png","width":262,"height":65,"caption":"Institut f\u00fcr Mikroelektronik Stuttgart"},"image":{"@id":"https:\/\/www.ims-chips.com\/#\/schema\/logo\/image\/"}},{"@type":"Person","@id":"https:\/\/www.ims-chips.com\/#\/schema\/person\/9839fb63530e7563aa83867413b8c6e7","name":"meier","sameAs":["https:\/\/www.ims-chips.de"]}]}},"_links":{"self":[{"href":"https:\/\/www.ims-chips.com\/index.php?rest_route=\/wp\/v2\/posts\/11651","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.ims-chips.com\/index.php?rest_route=\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.ims-chips.com\/index.php?rest_route=\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.ims-chips.com\/index.php?rest_route=\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.ims-chips.com\/index.php?rest_route=%2Fwp%2Fv2%2Fcomments&post=11651"}],"version-history":[{"count":16,"href":"https:\/\/www.ims-chips.com\/index.php?rest_route=\/wp\/v2\/posts\/11651\/revisions"}],"predecessor-version":[{"id":11670,"href":"https:\/\/www.ims-chips.com\/index.php?rest_route=\/wp\/v2\/posts\/11651\/revisions\/11670"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.ims-chips.com\/index.php?rest_route=\/wp\/v2\/media\/11652"}],"wp:attachment":[{"href":"https:\/\/www.ims-chips.com\/index.php?rest_route=%2Fwp%2Fv2%2Fmedia&parent=11651"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.ims-chips.com\/index.php?rest_route=%2Fwp%2Fv2%2Fcategories&post=11651"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.ims-chips.com\/index.php?rest_route=%2Fwp%2Fv2%2Ftags&post=11651"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}