{"id":12075,"date":"2025-04-14T13:41:19","date_gmt":"2025-04-14T11:41:19","guid":{"rendered":"https:\/\/www.ims-chips.com\/?p=12075"},"modified":"2025-06-13T14:41:10","modified_gmt":"2025-06-13T12:41:10","slug":"hyperstripes-new-assembly-and-interconnection-technology-for-reliable-bendable-electronics","status":"publish","type":"post","link":"https:\/\/www.ims-chips.com\/?p=12075","title":{"rendered":"HyPerStripes &#8211; a successful final project review"},"content":{"rendered":"\t\t<div data-elementor-type=\"wp-post\" data-elementor-id=\"12075\" class=\"elementor elementor-12075\">\n\t\t\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-29c1b9c elementor-section-boxed elementor-section-height-default elementor-section-height-default exad-glass-effect-no exad-sticky-section-no\" data-id=\"29c1b9c\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-c5c451b exad-glass-effect-no exad-sticky-section-no\" data-id=\"c5c451b\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-9b49336 exad-sticky-section-no exad-glass-effect-no elementor-widget elementor-widget-heading\" data-id=\"9b49336\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\">HyPerStripes - a successful final project review <\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-2850014 elementor-section-boxed elementor-section-height-default elementor-section-height-default exad-glass-effect-no exad-sticky-section-no\" data-id=\"2850014\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-2d0f3b3 exad-glass-effect-no exad-sticky-section-no\" data-id=\"2d0f3b3\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-b680bef exad-sticky-section-no exad-glass-effect-no elementor-widget elementor-widget-image\" data-id=\"b680bef\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"image.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<img fetchpriority=\"high\" decoding=\"async\" width=\"750\" height=\"638\" src=\"https:\/\/www.ims-chips.com\/wp-content\/uploads\/2025\/04\/250325_HyPerStripe-Consortium.jpg\" class=\"attachment-large size-large wp-image-12076\" alt=\"The 16 partners of the EU project HyPerStripes\" srcset=\"https:\/\/www.ims-chips.com\/wp-content\/uploads\/2025\/04\/250325_HyPerStripe-Consortium.jpg 1000w, https:\/\/www.ims-chips.com\/wp-content\/uploads\/2025\/04\/250325_HyPerStripe-Consortium-300x255.jpg 300w, https:\/\/www.ims-chips.com\/wp-content\/uploads\/2025\/04\/250325_HyPerStripe-Consortium-768x654.jpg 768w\" sizes=\"(max-width: 750px) 100vw, 750px\" \/>\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-0757cb0 elementor-section-boxed elementor-section-height-default elementor-section-height-default exad-glass-effect-no exad-sticky-section-no\" data-id=\"0757cb0\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-50 elementor-top-column elementor-element elementor-element-cf87691 exad-glass-effect-no exad-sticky-section-no\" data-id=\"cf87691\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-ac0412f exad-sticky-section-no exad-glass-effect-no elementor-widget elementor-widget-text-editor\" data-id=\"ac0412f\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>Duration of the project: <strong>01\/04\/2022 &#8211; 31\/03\/2025<\/strong><br \/>National funding: <br \/><strong>BMBF (16ME0469)<\/strong><br \/>Project Manager: <br \/><strong>Ulrike Passlack<\/strong><br \/>Contact:<br \/><a href=\"mailto:passlack@ims-chips.de\">Ulrike Passlack<\/a><\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t<div class=\"elementor-column elementor-col-50 elementor-top-column elementor-element elementor-element-91975fa exad-glass-effect-no exad-sticky-section-no\" data-id=\"91975fa\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-36b2f68 exad-sticky-section-no exad-glass-effect-no elementor-widget elementor-widget-text-editor\" data-id=\"36b2f68\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>The 16 partners of the EU project <strong>HyPerStripes<\/strong> (new assembly and interconnection technology for reliable bendable electronics) met at the end of March at OSYPKA AG in Rheinfelden, Germany, for the final project evaluation.<\/p><p>The technological advances were summarized in presentations by each partner, and the final use case demonstrators were shown in live. In addition to the technological aspects, the sustainability of the new manufacturing processes was also assessed.<\/p><p>The European reviewers and the representatives of the national funding organizations were impressed by the results achieved and the excellent cooperation within the consortium. Together, they developed and compared technologies for intelligent, flexible and large-scale electronic systems for five application demonstrators.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<\/div>\n\t\t","protected":false},"excerpt":{"rendered":"<p>The 16 partners of the EU project HyPerStripes met at the end of March at OSYPKA AG in Rheinfelden, Germany, for the final project evaluation.<\/p>\n","protected":false},"author":1,"featured_media":12076,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[7],"tags":[],"class_list":["post-12075","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-archiv"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v28.5 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>HyPerStripes - a successful final project review - Institut f\u00fcr Mikroelektronik Stuttgart<\/title>\n<meta name=\"description\" content=\"HyPerStripes - a successful final project review\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.ims-chips.com\/?p=12075\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"HyPerStripes - a successful final project review - Institut f\u00fcr Mikroelektronik Stuttgart\" \/>\n<meta property=\"og:description\" content=\"HyPerStripes - a successful final project review\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.ims-chips.com\/?p=12075\" \/>\n<meta property=\"og:site_name\" content=\"Institut f\u00fcr Mikroelektronik Stuttgart\" \/>\n<meta property=\"article:published_time\" content=\"2025-04-14T11:41:19+00:00\" \/>\n<meta property=\"article:modified_time\" content=\"2025-06-13T12:41:10+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/www.ims-chips.com\/wp-content\/uploads\/2025\/04\/250325_HyPerStripe-Consortium.jpg\" \/>\n\t<meta property=\"og:image:width\" content=\"1000\" \/>\n\t<meta property=\"og:image:height\" content=\"851\" \/>\n\t<meta property=\"og:image:type\" content=\"image\/jpeg\" \/>\n<meta name=\"author\" content=\"meier\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"meier\" \/>\n\t<meta name=\"twitter:label2\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data2\" content=\"1 minute\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\\\/\\\/www.ims-chips.com\\\/?p=12075#article\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.ims-chips.com\\\/?p=12075\"},\"author\":{\"name\":\"meier\",\"@id\":\"https:\\\/\\\/www.ims-chips.com\\\/#\\\/schema\\\/person\\\/9839fb63530e7563aa83867413b8c6e7\"},\"headline\":\"HyPerStripes &#8211; 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