{"id":13021,"date":"2026-09-18T11:11:27","date_gmt":"2026-09-18T09:11:27","guid":{"rendered":"https:\/\/www.ims-chips.com\/?p=13021"},"modified":"2026-09-18T11:19:45","modified_gmt":"2026-09-18T09:19:45","slug":"german-taiwanese-exchange-in-microelectronics","status":"publish","type":"post","link":"https:\/\/www.ims-chips.com\/?p=13021","title":{"rendered":"German-Taiwanese Collaboration in Microelectronics: IMS CHIPS at the NSTC-BMFTR Annual Meeting 2026"},"content":{"rendered":"\t\t<div data-elementor-type=\"wp-post\" data-elementor-id=\"13021\" class=\"elementor elementor-13021\">\n\t\t\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-2ffacd8 elementor-section-stretched elementor-section-boxed elementor-section-height-default elementor-section-height-default exad-glass-effect-no exad-sticky-section-no\" data-id=\"2ffacd8\" data-element_type=\"section\" data-e-type=\"section\" data-settings=\"{&quot;stretch_section&quot;:&quot;section-stretched&quot;}\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-1439d00 exad-glass-effect-no exad-sticky-section-no\" data-id=\"1439d00\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-6f92c69 exad-sticky-section-no exad-glass-effect-no elementor-widget elementor-widget-heading\" data-id=\"6f92c69\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\">German-Taiwanese Collaboration in Microelectronics: IMS CHIPS at the NSTC-BMFTR Annual Meeting 2026<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-5dc67ee elementor-section-stretched elementor-section-boxed elementor-section-height-default elementor-section-height-default exad-glass-effect-no exad-sticky-section-no\" data-id=\"5dc67ee\" data-element_type=\"section\" data-e-type=\"section\" data-settings=\"{&quot;stretch_section&quot;:&quot;section-stretched&quot;}\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-50 elementor-top-column elementor-element elementor-element-ba79f88 exad-glass-effect-no exad-sticky-section-no\" data-id=\"ba79f88\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-a3994c9 exad-sticky-section-no exad-glass-effect-no elementor-widget elementor-widget-text-editor\" data-id=\"a3994c9\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>International research partnerships thrive on direct exchange \u2013 and on opportunities to look beyond the scope of an individual project. At the NSTC-BMFTR Annual Meeting 2026, partners from Germany and Taiwan came together in Munich and Erlangen to present current research projects, exchange expertise, and explore new perspectives for collaboration in microelectronics.<\/p><p>IMS CHIPS attended together with Mark Lee from National Tsing Hua University (NTHU) as part of our joint TEDI-SPEC project. The meeting provided an opportunity to connect with partners across the participating projects while gaining insights into Germany\u2019s research and semiconductor ecosystem. The program combined project presentations and networking with visits to leading research and industry organizations.<\/p><p>Among the stops was Infineon Technologies, where participants gained insights into current semiconductor developments and projects related to areas such as edge computing. The third day also included a visit to the Siemens Electronics Factory in Erlangen.<\/p><p>Meetings like this create valuable opportunities to connect expertise across borders, strengthen partnerships, and advance joint research and innovation.<\/p><p>Thank you to BMFTR, NSTC, and everyone involved for the excellent organization, valuable insights, and many opportunities for exchange.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t<div class=\"elementor-column elementor-col-50 elementor-top-column elementor-element elementor-element-48ffeb1 exad-glass-effect-no exad-sticky-section-no\" data-id=\"48ffeb1\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-d12fcfb exad-sticky-section-no exad-glass-effect-no elementor-widget elementor-widget-image\" data-id=\"d12fcfb\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"image.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<img fetchpriority=\"high\" decoding=\"async\" width=\"750\" height=\"483\" src=\"https:\/\/www.ims-chips.com\/wp-content\/uploads\/2026\/09\/NSTC-BMFTR_2-1024x660.jpg\" class=\"attachment-large size-large wp-image-13022\" alt=\"Dr. Michael Warber, Prof. Dr. Niels Quack, Mark Lee (National Tsing Hua University)\" srcset=\"https:\/\/www.ims-chips.com\/wp-content\/uploads\/2026\/09\/NSTC-BMFTR_2-1024x660.jpg 1024w, https:\/\/www.ims-chips.com\/wp-content\/uploads\/2026\/09\/NSTC-BMFTR_2-300x193.jpg 300w, https:\/\/www.ims-chips.com\/wp-content\/uploads\/2026\/09\/NSTC-BMFTR_2-768x495.jpg 768w, https:\/\/www.ims-chips.com\/wp-content\/uploads\/2026\/09\/NSTC-BMFTR_2.jpg 1500w\" sizes=\"(max-width: 750px) 100vw, 750px\" \/>\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-a7e4b06 exad-sticky-section-no exad-glass-effect-no elementor-widget elementor-widget-text-editor\" data-id=\"a7e4b06\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>Dr. Michael Warber and Prof. Dr. Niels Quack with Mark Lee from the National Tsing Hua University (NTHU)<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<\/div>\n\t\t","protected":false},"excerpt":{"rendered":"<p>German-Taiwanese Collaboration in Microelectronics: IMS CHIPS at the NSTC-BMFTR Annual Meeting 2026 International research partnerships thrive on direct exchange \u2013 and on opportunities to look beyond the scope of an individual project. At the NSTC-BMFTR Annual Meeting 2026, partners from Germany and Taiwan came together in Munich and Erlangen to [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":13022,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[1],"tags":[],"class_list":["post-13021","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v28.5 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>German-Taiwanese Collaboration in Microelectronics: IMS CHIPS at the NSTC-BMFTR Annual Meeting 2026 - Institut f\u00fcr Mikroelektronik Stuttgart<\/title>\n<meta name=\"description\" content=\"German-Taiwanese exchange in microelectronics.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.ims-chips.com\/?p=13021\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"German-Taiwanese Collaboration in Microelectronics: IMS CHIPS at the NSTC-BMFTR Annual Meeting 2026 - 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