{"id":2116,"date":"2020-12-07T10:31:03","date_gmt":"2020-12-07T09:31:03","guid":{"rendered":"https:\/\/start.ims-chips.de\/?p=2116"},"modified":"2025-07-10T10:34:45","modified_gmt":"2025-07-10T08:34:45","slug":"id2ppac-2","status":"publish","type":"post","link":"https:\/\/www.ims-chips.com\/?p=2116","title":{"rendered":"ID2PPAC"},"content":{"rendered":"\t\t
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IMS CHIPS as alliance partner for the production of next generation integrated circuits<\/h3>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t
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Project time line: June 01st, 2021 thru May, 31st, 2024
Funded by the EU program
ECSEL Innovation Action
Funding code: 101007254\u00a0<\/span><\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t

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In order to meet the growing demand for more computing power, especially in networked devices, the technologies to manufacture high-performance chips in the 2-nm process must be developed today. The prerequisites for mass production should be in place by 2025. IMS CHIPS supports the work to establish the 2-nm node within the ECSEL project ID2PPAC.<\/span><\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t

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The ECSEL joint project ID2PPAC, funded by the European Union and the German Federal Ministry of Education and Research (BMBF) with nearly 48 million euros, will consolidate and integrate the technology solutions for the 2-nm node identified in previous work. The goal is to demonstrate that the Performance Power Area and Cost (PPAC) requirements for this new generation of leading logic technology are within reach.
To continue the so-called Moore’s Law for the 2-nm node while meeting the PPAC requirements, the combination of further advances in EUV lithography & masks, 3D device structures, materials and metrology is required. The strength of the project is based on a common pilot line and the focused commitment of the partners involved, who have exceptional expertise in key interrelated areas.
The ID2PPAC project is expected to enable IC-Fabs to perform so-called EUV-based single-print high-volume manufacturing for the 2-nm node by 2025.
To meet the ever-increasing demand for more computing power, the semiconductor industry is continuously working on technological innovations to realize this progress as predicted by Moore’s Law and will continue to do so.
The project will also help build Europe’s technological capability in this area, which is critical for digitization, (edge) AI and to solve national, European and global societal challenges, as well as strengthen the consortium of leading European companies and research facilities active in this field.
Institut f\u00fcr Mikroelektronik Stuttgart (IMS CHIPS) will participate in the Lithography Equipment work package. A part of this work package is the development of high-precision diffractive optical elements (DOE) for surface inspection of EUV mirrors.<\/p>

Deutscher Zukunftspreis (German Future Prize) 2020 for EUV technology
In 2020, the “Deutscher Zukunftspreis – Germany\u00b4s Federal President’s Award for Technology and Innovation” was awarded by German President Frank-Walter Steinmeier to the team from Zeiss, TRUMPF and the Fraunhofer Institute for Applied Optics and Precision Engineering in Jena for their contributions to the research, development and industrialization of EUV lithography. This excellent award recognizes the technological leap in microelectronics that the researchers have accomplished together with the Dutch company ASML. This success shows that Germany and Europe can achieve technological sovereignty together. In order to measure the mirrors required, individually manufactured high-precision “Computer Generated Holograms” (CGH) are necessary, which are produced at Institut f\u00fcr Mikroelektronik Stuttgart (IMS CHIPS) using a unique technology.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t

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For further information on the project, please refer top
\n cordis.europa.eu\/<\/a>
\n www.elektronikforschung.de\/<\/a><\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t

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Contact: Julian Hartbaum<\/strong>
\nphone: +49 711 21855 471 \u00a0\u00a0\u00a0\u00a0\u00a0\u00a0 E-Mail hartbaum@ims-chips.de<\/a><\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t

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ID2PPAC – Integration of processes and modules for the 2-nm node <\/p>\n

IMS CHIPS as alliance partner for the production of next generation integrated circuits.<\/p>\n","protected":false},"author":1,"featured_media":9661,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[33],"tags":[],"class_list":["post-2116","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-projekte-archiv"],"yoast_head":"\nID2PPAC - Institut f\u00fcr Mikroelektronik Stuttgart<\/title>\n<meta name=\"description\" content=\"ID2PPAC - Integration of processes and modules for the 2-nm node. 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