{"id":461,"date":"2020-05-17T15:11:00","date_gmt":"2020-05-17T13:11:00","guid":{"rendered":"https:\/\/start.ims-chips.de\/?p=461"},"modified":"2021-04-20T15:09:09","modified_gmt":"2021-04-20T13:09:09","slug":"ieee-2020","status":"publish","type":"post","link":"https:\/\/www.ims-chips.com\/?p=461","title":{"rendered":"IEEE 2020"},"content":{"rendered":"\t\t<div data-elementor-type=\"wp-post\" data-elementor-id=\"461\" class=\"elementor elementor-461\">\n\t\t\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-9bc03a2 elementor-section-boxed elementor-section-height-default elementor-section-height-default exad-glass-effect-no exad-sticky-section-no\" data-id=\"9bc03a2\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-9772453 exad-glass-effect-no exad-sticky-section-no\" data-id=\"9772453\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-711474f exad-sticky-section-no exad-glass-effect-no elementor-widget elementor-widget-heading\" data-id=\"711474f\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\">IEEE 2020<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-41c9148 elementor-section-boxed elementor-section-height-default elementor-section-height-default exad-glass-effect-no exad-sticky-section-no\" data-id=\"41c9148\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-50 elementor-top-column elementor-element elementor-element-4e5ac51 exad-glass-effect-no exad-sticky-section-no\" data-id=\"4e5ac51\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-91c2fd4 exad-sticky-section-no exad-glass-effect-no elementor-widget elementor-widget-image\" data-id=\"91c2fd4\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"image.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<img fetchpriority=\"high\" decoding=\"async\" width=\"344\" height=\"211\" src=\"https:\/\/www.ims-chips.com\/wp-content\/uploads\/2020\/05\/News_Bild_IEEE_FLEPS_20.jpg\" class=\"attachment-large size-large wp-image-1592\" alt=\"IEEE International Conference on Flexible and Printable Sensors and Systems 2020, Manchester, UK\" srcset=\"https:\/\/www.ims-chips.com\/wp-content\/uploads\/2020\/05\/News_Bild_IEEE_FLEPS_20.jpg 344w, https:\/\/www.ims-chips.com\/wp-content\/uploads\/2020\/05\/News_Bild_IEEE_FLEPS_20-300x184.jpg 300w\" sizes=\"(max-width: 344px) 100vw, 344px\" \/>\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t<div class=\"elementor-column elementor-col-50 elementor-top-column elementor-element elementor-element-7a7c06e exad-glass-effect-no exad-sticky-section-no\" data-id=\"7a7c06e\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-0ab1f8e exad-sticky-section-no exad-glass-effect-no elementor-widget elementor-widget-text-editor\" data-id=\"0ab1f8e\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p><strong>IEEE International Conference on Flexible and Printable Sensors and Systems 2020, Manchester, UK<\/strong><\/p><p><span>The IMS is represented with a lecture at the\u00a0<\/span><strong>IEEE International Conference on Flexible and Printable Sensors and Systems<\/strong><span>\u00a0in Manchester.<\/span><br \/><br \/><span>Hybrid Systems on Foil, Heterogenous Integration &amp; Packaging Session<\/span><br \/><span>Sunday August 16, 2020 (09:00 &#8211; 17:00)<\/span><br \/><br \/><strong>\u201eChip-Film Patch Sensor System with Integrated Read-Out ASIC for Biomedical Applications\u201c<\/strong><span><\/span><br \/><span>Ulrike Passlack, Mourad Elsobky, Andreas Mueller, Cor Scherjon, Christine Harendt, Joachim Burghartz<\/span><\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-41ea2d95 elementor-section-boxed elementor-section-height-default elementor-section-height-default exad-glass-effect-no exad-sticky-section-no\" data-id=\"41ea2d95\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-1f1bcc82 exad-glass-effect-no exad-sticky-section-no\" data-id=\"1f1bcc82\" data-element_type=\"column\" data-e-type=\"column\" data-settings=\"{&quot;background_background&quot;:&quot;classic&quot;}\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-599859b5 exad-sticky-section-no exad-glass-effect-no elementor-widget elementor-widget-text-editor\" data-id=\"599859b5\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\tFor further information on the IEEE FLEPS Conference, please go the following website:<br> <a href=\"https:\/\/2020.ieee-fleps.org\/\">https:\/\/2020.ieee-fleps.org\/<\/a>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-c329762 elementor-section-boxed elementor-section-height-default elementor-section-height-default exad-glass-effect-no exad-sticky-section-no\" data-id=\"c329762\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-37eefd9 exad-glass-effect-no exad-sticky-section-no\" data-id=\"37eefd9\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-754eb30 exad-sticky-section-no exad-glass-effect-no elementor-widget elementor-widget-spacer\" data-id=\"754eb30\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"spacer.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<div class=\"elementor-spacer\">\n\t\t\t<div class=\"elementor-spacer-inner\"><\/div>\n\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<\/div>\n\t\t","protected":false},"excerpt":{"rendered":"<p>IEEE International Conference on Flexible and Printable Sensors and Systems 2020, Manchester, UK<\/p>\n","protected":false},"author":1,"featured_media":1592,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[7],"tags":[],"class_list":["post-461","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-archiv"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v28.7 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>IEEE 2020 - Institut f\u00fcr Mikroelektronik Stuttgart<\/title>\n<meta name=\"description\" content=\"IEEE International Conference on Flexible and Printable Sensors and Systems 2020, Manchester, UK\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.ims-chips.com\/?p=461\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"IEEE 2020 - Institut f\u00fcr Mikroelektronik Stuttgart\" \/>\n<meta property=\"og:description\" content=\"IEEE International Conference on Flexible and Printable Sensors and Systems 2020, Manchester, UK\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.ims-chips.com\/?p=461\" \/>\n<meta property=\"og:site_name\" content=\"Institut f\u00fcr Mikroelektronik Stuttgart\" \/>\n<meta property=\"article:published_time\" content=\"2020-05-17T13:11:00+00:00\" \/>\n<meta property=\"article:modified_time\" content=\"2021-04-20T13:09:09+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/www.ims-chips.com\/wp-content\/uploads\/2020\/05\/News_Bild_IEEE_FLEPS_20.jpg\" \/>\n\t<meta property=\"og:image:width\" content=\"344\" \/>\n\t<meta property=\"og:image:height\" content=\"211\" \/>\n\t<meta property=\"og:image:type\" content=\"image\/jpeg\" \/>\n<meta name=\"author\" content=\"meier\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"meier\" \/>\n\t<meta name=\"twitter:label2\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data2\" content=\"1 minute\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\\\/\\\/www.ims-chips.com\\\/?p=461#article\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.ims-chips.com\\\/?p=461\"},\"author\":{\"name\":\"meier\",\"@id\":\"https:\\\/\\\/www.ims-chips.com\\\/#\\\/schema\\\/person\\\/9839fb63530e7563aa83867413b8c6e7\"},\"headline\":\"IEEE 2020\",\"datePublished\":\"2020-05-17T13:11:00+00:00\",\"dateModified\":\"2021-04-20T13:09:09+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\\\/\\\/www.ims-chips.com\\\/?p=461\"},\"wordCount\":84,\"publisher\":{\"@id\":\"https:\\\/\\\/www.ims-chips.com\\\/#organization\"},\"image\":{\"@id\":\"https:\\\/\\\/www.ims-chips.com\\\/?p=461#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/www.ims-chips.com\\\/wp-content\\\/uploads\\\/2020\\\/05\\\/News_Bild_IEEE_FLEPS_20.jpg\",\"articleSection\":[\"Archiv\"],\"inLanguage\":\"en-US\"},{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/www.ims-chips.com\\\/?p=461\",\"url\":\"https:\\\/\\\/www.ims-chips.com\\\/?p=461\",\"name\":\"IEEE 2020 - Institut f\u00fcr Mikroelektronik Stuttgart\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.ims-chips.com\\\/#website\"},\"primaryImageOfPage\":{\"@id\":\"https:\\\/\\\/www.ims-chips.com\\\/?p=461#primaryimage\"},\"image\":{\"@id\":\"https:\\\/\\\/www.ims-chips.com\\\/?p=461#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/www.ims-chips.com\\\/wp-content\\\/uploads\\\/2020\\\/05\\\/News_Bild_IEEE_FLEPS_20.jpg\",\"datePublished\":\"2020-05-17T13:11:00+00:00\",\"dateModified\":\"2021-04-20T13:09:09+00:00\",\"description\":\"IEEE International Conference on Flexible and Printable Sensors and Systems 2020, Manchester, UK\",\"breadcrumb\":{\"@id\":\"https:\\\/\\\/www.ims-chips.com\\\/?p=461#breadcrumb\"},\"inLanguage\":\"en-US\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\\\/\\\/www.ims-chips.com\\\/?p=461\"]}]},{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\\\/\\\/www.ims-chips.com\\\/?p=461#primaryimage\",\"url\":\"https:\\\/\\\/www.ims-chips.com\\\/wp-content\\\/uploads\\\/2020\\\/05\\\/News_Bild_IEEE_FLEPS_20.jpg\",\"contentUrl\":\"https:\\\/\\\/www.ims-chips.com\\\/wp-content\\\/uploads\\\/2020\\\/05\\\/News_Bild_IEEE_FLEPS_20.jpg\",\"width\":344,\"height\":211,\"caption\":\"IEEE International Conference on Flexible and Printable Sensors and Systems 2020, Manchester, UK\"},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\\\/\\\/www.ims-chips.com\\\/?p=461#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Startseite\",\"item\":\"https:\\\/\\\/www.ims-chips.com\\\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"IEEE 2020\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\\\/\\\/www.ims-chips.com\\\/#website\",\"url\":\"https:\\\/\\\/www.ims-chips.com\\\/\",\"name\":\"Institut f\u00fcr Mikroelektronik Stuttgart\",\"description\":\"Your Certified Silicon Designer Factory.\",\"publisher\":{\"@id\":\"https:\\\/\\\/www.ims-chips.com\\\/#organization\"},\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\\\/\\\/www.ims-chips.com\\\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"en-US\"},{\"@type\":\"Organization\",\"@id\":\"https:\\\/\\\/www.ims-chips.com\\\/#organization\",\"name\":\"Institut f\u00fcr Mikroelektronik Stuttgart\",\"url\":\"https:\\\/\\\/www.ims-chips.com\\\/\",\"logo\":{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\\\/\\\/www.ims-chips.com\\\/#\\\/schema\\\/logo\\\/image\\\/\",\"url\":\"https:\\\/\\\/www.ims-chips.com\\\/wp-content\\\/uploads\\\/2020\\\/09\\\/logo_ims.png\",\"contentUrl\":\"https:\\\/\\\/www.ims-chips.com\\\/wp-content\\\/uploads\\\/2020\\\/09\\\/logo_ims.png\",\"width\":262,\"height\":65,\"caption\":\"Institut f\u00fcr Mikroelektronik Stuttgart\"},\"image\":{\"@id\":\"https:\\\/\\\/www.ims-chips.com\\\/#\\\/schema\\\/logo\\\/image\\\/\"}},{\"@type\":\"Person\",\"@id\":\"https:\\\/\\\/www.ims-chips.com\\\/#\\\/schema\\\/person\\\/9839fb63530e7563aa83867413b8c6e7\",\"name\":\"meier\",\"sameAs\":[\"https:\\\/\\\/www.ims-chips.de\"]}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"IEEE 2020 - Institut f\u00fcr Mikroelektronik Stuttgart","description":"IEEE International Conference on Flexible and Printable Sensors and Systems 2020, Manchester, UK","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/www.ims-chips.com\/?p=461","og_locale":"en_US","og_type":"article","og_title":"IEEE 2020 - Institut f\u00fcr Mikroelektronik Stuttgart","og_description":"IEEE International Conference on Flexible and Printable Sensors and Systems 2020, Manchester, UK","og_url":"https:\/\/www.ims-chips.com\/?p=461","og_site_name":"Institut f\u00fcr Mikroelektronik Stuttgart","article_published_time":"2020-05-17T13:11:00+00:00","article_modified_time":"2021-04-20T13:09:09+00:00","og_image":[{"width":344,"height":211,"url":"https:\/\/www.ims-chips.com\/wp-content\/uploads\/2020\/05\/News_Bild_IEEE_FLEPS_20.jpg","type":"image\/jpeg"}],"author":"meier","twitter_card":"summary_large_image","twitter_misc":{"Written by":"meier","Est. reading time":"1 minute"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"Article","@id":"https:\/\/www.ims-chips.com\/?p=461#article","isPartOf":{"@id":"https:\/\/www.ims-chips.com\/?p=461"},"author":{"name":"meier","@id":"https:\/\/www.ims-chips.com\/#\/schema\/person\/9839fb63530e7563aa83867413b8c6e7"},"headline":"IEEE 2020","datePublished":"2020-05-17T13:11:00+00:00","dateModified":"2021-04-20T13:09:09+00:00","mainEntityOfPage":{"@id":"https:\/\/www.ims-chips.com\/?p=461"},"wordCount":84,"publisher":{"@id":"https:\/\/www.ims-chips.com\/#organization"},"image":{"@id":"https:\/\/www.ims-chips.com\/?p=461#primaryimage"},"thumbnailUrl":"https:\/\/www.ims-chips.com\/wp-content\/uploads\/2020\/05\/News_Bild_IEEE_FLEPS_20.jpg","articleSection":["Archiv"],"inLanguage":"en-US"},{"@type":"WebPage","@id":"https:\/\/www.ims-chips.com\/?p=461","url":"https:\/\/www.ims-chips.com\/?p=461","name":"IEEE 2020 - Institut f\u00fcr Mikroelektronik Stuttgart","isPartOf":{"@id":"https:\/\/www.ims-chips.com\/#website"},"primaryImageOfPage":{"@id":"https:\/\/www.ims-chips.com\/?p=461#primaryimage"},"image":{"@id":"https:\/\/www.ims-chips.com\/?p=461#primaryimage"},"thumbnailUrl":"https:\/\/www.ims-chips.com\/wp-content\/uploads\/2020\/05\/News_Bild_IEEE_FLEPS_20.jpg","datePublished":"2020-05-17T13:11:00+00:00","dateModified":"2021-04-20T13:09:09+00:00","description":"IEEE International Conference on Flexible and Printable Sensors and Systems 2020, Manchester, UK","breadcrumb":{"@id":"https:\/\/www.ims-chips.com\/?p=461#breadcrumb"},"inLanguage":"en-US","potentialAction":[{"@type":"ReadAction","target":["https:\/\/www.ims-chips.com\/?p=461"]}]},{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/www.ims-chips.com\/?p=461#primaryimage","url":"https:\/\/www.ims-chips.com\/wp-content\/uploads\/2020\/05\/News_Bild_IEEE_FLEPS_20.jpg","contentUrl":"https:\/\/www.ims-chips.com\/wp-content\/uploads\/2020\/05\/News_Bild_IEEE_FLEPS_20.jpg","width":344,"height":211,"caption":"IEEE International Conference on Flexible and Printable Sensors and Systems 2020, Manchester, UK"},{"@type":"BreadcrumbList","@id":"https:\/\/www.ims-chips.com\/?p=461#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Startseite","item":"https:\/\/www.ims-chips.com\/"},{"@type":"ListItem","position":2,"name":"IEEE 2020"}]},{"@type":"WebSite","@id":"https:\/\/www.ims-chips.com\/#website","url":"https:\/\/www.ims-chips.com\/","name":"Institut f\u00fcr Mikroelektronik Stuttgart","description":"Your Certified Silicon Designer Factory.","publisher":{"@id":"https:\/\/www.ims-chips.com\/#organization"},"potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/www.ims-chips.com\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"en-US"},{"@type":"Organization","@id":"https:\/\/www.ims-chips.com\/#organization","name":"Institut f\u00fcr Mikroelektronik Stuttgart","url":"https:\/\/www.ims-chips.com\/","logo":{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/www.ims-chips.com\/#\/schema\/logo\/image\/","url":"https:\/\/www.ims-chips.com\/wp-content\/uploads\/2020\/09\/logo_ims.png","contentUrl":"https:\/\/www.ims-chips.com\/wp-content\/uploads\/2020\/09\/logo_ims.png","width":262,"height":65,"caption":"Institut f\u00fcr Mikroelektronik Stuttgart"},"image":{"@id":"https:\/\/www.ims-chips.com\/#\/schema\/logo\/image\/"}},{"@type":"Person","@id":"https:\/\/www.ims-chips.com\/#\/schema\/person\/9839fb63530e7563aa83867413b8c6e7","name":"meier","sameAs":["https:\/\/www.ims-chips.de"]}]}},"_links":{"self":[{"href":"https:\/\/www.ims-chips.com\/index.php?rest_route=\/wp\/v2\/posts\/461","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.ims-chips.com\/index.php?rest_route=\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.ims-chips.com\/index.php?rest_route=\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.ims-chips.com\/index.php?rest_route=\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.ims-chips.com\/index.php?rest_route=%2Fwp%2Fv2%2Fcomments&post=461"}],"version-history":[{"count":0,"href":"https:\/\/www.ims-chips.com\/index.php?rest_route=\/wp\/v2\/posts\/461\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.ims-chips.com\/index.php?rest_route=\/wp\/v2\/media\/1592"}],"wp:attachment":[{"href":"https:\/\/www.ims-chips.com\/index.php?rest_route=%2Fwp%2Fv2%2Fmedia&parent=461"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.ims-chips.com\/index.php?rest_route=%2Fwp%2Fv2%2Fcategories&post=461"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.ims-chips.com\/index.php?rest_route=%2Fwp%2Fv2%2Ftags&post=461"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}