{"id":9790,"date":"2022-04-28T09:01:49","date_gmt":"2022-04-28T07:01:49","guid":{"rendered":"https:\/\/www.ims-chips.com\/?p=9790"},"modified":"2022-04-28T09:13:31","modified_gmt":"2022-04-28T07:13:31","slug":"id2ppac-3","status":"publish","type":"post","link":"https:\/\/www.ims-chips.com\/?p=9790","title":{"rendered":"IMS CHIPS as alliance partner for the production of next generation integrated circuits"},"content":{"rendered":"\t\t<div data-elementor-type=\"wp-post\" data-elementor-id=\"9790\" class=\"elementor elementor-9790\">\n\t\t\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-b95f7b4 elementor-section-boxed elementor-section-height-default elementor-section-height-default exad-glass-effect-no exad-sticky-section-no\" data-id=\"b95f7b4\" data-element_type=\"section\" data-e-type=\"section\" data-settings=\"{&quot;background_background&quot;:&quot;classic&quot;}\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-6a450ae exad-glass-effect-no exad-sticky-section-no\" data-id=\"6a450ae\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-2965045 exad-sticky-section-no exad-glass-effect-no elementor-widget elementor-widget-heading\" data-id=\"2965045\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h6 class=\"elementor-heading-title elementor-size-default\">Newsletter 1\/2022<\/h6>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-ec89295 elementor-section-boxed elementor-section-height-default elementor-section-height-default exad-glass-effect-no exad-sticky-section-no\" data-id=\"ec89295\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-be7b58f exad-glass-effect-no exad-sticky-section-no\" data-id=\"be7b58f\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-cc1278c exad-sticky-section-no exad-glass-effect-no elementor-widget elementor-widget-heading\" data-id=\"cc1278c\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\">Technology development for the 2-nm node<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-7cf53d0 elementor-section-boxed elementor-section-height-default elementor-section-height-default exad-glass-effect-no exad-sticky-section-no\" data-id=\"7cf53d0\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-84dbef5 exad-glass-effect-no exad-sticky-section-no\" data-id=\"84dbef5\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-3dbecfc exad-sticky-section-no exad-glass-effect-no elementor-widget elementor-widget-text-editor\" data-id=\"3dbecfc\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p><strong>IMS CHIPS as a joint partner in the Ecsel project ID2PPAC<\/strong><\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-4a61be5 elementor-section-boxed elementor-section-height-default elementor-section-height-default exad-glass-effect-no exad-sticky-section-no\" data-id=\"4a61be5\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-7853281 exad-glass-effect-no exad-sticky-section-no\" data-id=\"7853281\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-a69c041 exad-sticky-section-no exad-glass-effect-no elementor-widget elementor-widget-image\" data-id=\"a69c041\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"image.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<img decoding=\"async\" width=\"260\" height=\"158\" src=\"https:\/\/www.ims-chips.com\/wp-content\/uploads\/2022\/04\/N_ID2PPAC.jpg\" class=\"attachment-large size-large wp-image-9792\" alt=\"IMS CHIPS as alliance partner for the production of next generation integrated circuits\" \/>\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-8177dde elementor-section-boxed elementor-section-height-default elementor-section-height-default exad-glass-effect-no exad-sticky-section-no\" data-id=\"8177dde\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-561822e exad-glass-effect-no exad-sticky-section-no\" data-id=\"561822e\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-769e222 exad-sticky-section-no exad-glass-effect-no elementor-widget elementor-widget-text-editor\" data-id=\"769e222\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>The ECSEL joint project ID2PPAC, funded\nby the European Union and the German\nFederal Ministry of Education and Research\n(BMBF) with nearly 48 million euros, will\nconsolidate and integrate the technology\nsolutions for the 2-nm node identified in\nprevious work. The goal is to demonstrate\nthat the Performance Power Area and Cost\n(PPAC) requirements for this new generation\nof leading logic technology are within\nreach.<\/p>\n<p>To continue the so-called Moore\u2018s Law for\n  the 2-nm node while meeting the PPAC\n  requirements, a combination of further\n  advances in EUV lithography &#038; masks, 3D\n  device structures, materials and metrology\n  is required. The strength of the project\n  is based on a common pilot line and\n  the focused commitment of the partners\n  involved, who have exceptional expertise\n  in key interrelated areas.  <\/p>\n<p>The ID2PPAC project is expected to enable\n  IC-Fabs to perform so-called EUV-based\n  single-print high-volume manufacturing for\n  the 2-nm node by 2025.  <\/p>\n<p>To meet the ever-increasing demand for\n  more computing power, the semiconductor\n  industry is continuously working on technological\n  innovations to realize this progress\n  as predicted by Moore\u2018s Law and will\n  continue to do so.  <\/p>\n<p>The project will also help build Europe\u2018s\n  technological capability in this area, which\n  is critical for digitization, (edge) AI and to\n  solve national, European and global societal\n  challenges, as well as strengthen the\n  consortium of leading European companies\n  and research facilities active in this field.  <\/p>\n<p>Institut f\u00fcr Mikroelektronik Stuttgart (IMS\n  CHIPS) will participate in the Lithography\n  Equipment work package. A part of this\n  work package is the development of\n  high-precision diffractive optical elements\n  (DOE) for surface inspection of EUV mirrors.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-88f703b elementor-section-boxed elementor-section-height-default elementor-section-height-default exad-glass-effect-no exad-sticky-section-no\" data-id=\"88f703b\" data-element_type=\"section\" data-e-type=\"section\" data-settings=\"{&quot;background_background&quot;:&quot;classic&quot;}\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-8cb78b9 exad-glass-effect-no exad-sticky-section-no\" data-id=\"8cb78b9\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-23090d6 exad-sticky-section-no exad-glass-effect-no elementor-widget elementor-widget-text-editor\" data-id=\"23090d6\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\tContact:<br>\n<strong>Dr. Julian Hartbaum<\/strong><br>\nPhone: +49 711 21855\u00a0 471<br>\nE-Mail <a href=\"mailto:hartbaum@ims-chips.de\">hartbaum@ims-chips.de<\/a>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-9f34c74 elementor-section-boxed elementor-section-height-default elementor-section-height-default exad-glass-effect-no exad-sticky-section-no\" data-id=\"9f34c74\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-c9ceaec exad-glass-effect-no exad-sticky-section-no\" data-id=\"c9ceaec\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-4445289 exad-sticky-section-no exad-glass-effect-no elementor-widget elementor-widget-spacer\" data-id=\"4445289\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"spacer.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<div class=\"elementor-spacer\">\n\t\t\t<div class=\"elementor-spacer-inner\"><\/div>\n\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<\/div>\n\t\t","protected":false},"excerpt":{"rendered":"<p>In order to meet the growing demand for more computing power, especially in networked devices, the technologies to manufacture<br \/>\nhigh-performance chips in the<br \/>\n2-nm process must be developed today.<br \/>\nThe prerequisites for mass production should be in place by 2025. IMS CHIPS supports the work to establish the 2-nm node within the ECSEL project ID2PPAC.<\/p>\n","protected":false},"author":1,"featured_media":9792,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[14],"tags":[],"class_list":["post-9790","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-newsletter-1-2022"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v28.5 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>IMS CHIPS as alliance partner for the production of next generation integrated circuits - Institut f\u00fcr Mikroelektronik Stuttgart<\/title>\n<meta name=\"description\" content=\"IMS CHIPS as alliance partnerfor the production ofnext generation integratedcircuits\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.ims-chips.com\/?p=9790\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"IMS CHIPS as alliance partner for the production of next generation integrated circuits - 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