{"id":9808,"date":"2022-04-28T09:21:56","date_gmt":"2022-04-28T07:21:56","guid":{"rendered":"https:\/\/www.ims-chips.com\/?p=9808"},"modified":"2022-04-28T09:44:18","modified_gmt":"2022-04-28T07:44:18","slug":"nano-hysif","status":"publish","type":"post","link":"https:\/\/www.ims-chips.com\/?p=9808","title":{"rendered":"Nano-HySiF \u2013 Nano contacts for flexible electronics"},"content":{"rendered":"\t\t
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Newsletter 1\/2022<\/h6>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t
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New contacting technology for flexible systems<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t
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Nano contacts for reliable integration of ultra-thin silicon chips in flexible films<\/strong><\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t

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\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\"Nano-HySiF\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t
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Flexible electronic systems are increasingly\nconquering market segments, particularly\nin the fields of medical technology and life\nstyle products, while creating a wide range\nof new products. The development is driven\nby medical applications, such as catheters,\nwhich, when equipped with sensor\nfunctions, show significant improvements\nin work processes and thus in operational\nsafety and patient protection. This is\nonly possible by integrating high-performance\nsilicon components (sensors, ASICs\nand microprocessors) into the flexible film,\nbecause the required functionality cannot\nbe achieved with thin-film components\nalone. At IMS, these hybrid systems-infilm\n(HySiF) with embedded thinned silicon\nchips have been researched for years.\nUsing the patented Chip-Film Patch (CFP)\ntechnology, we have been manufacturing\nflexible multi-chip modules with embedded\nASICs and micro controllers in combination\nwith printed sensors and other thin-film\ncomponents. The wafer-based and CMOScompatible\nCFP technology facilitates chip\ninterconnections with pad sizes < 10 \u03bcm and small pad spacings using adaptive\nlayout processes with laser direct writing.\nThe key factor here is reliable contacting\nof the various components (sensors, ICs)\ninto the flexible system. The CFP process\nis similar to semiconductor processes with\nsputtering and etching processes as well as\nlithographic structuring. The Nano-HySiF\nproject explores a different approach\nusing nano contacts. Cooperating with the\nHessen-based company NanoWired, the\nIMS has been working on the integration\nof ultra-thin silicon chips into flexible foil\nsystems since 2021. The hair-thin metal\nrods can be up to a few micrometers long,\ndepending on the application and contact\nsize. The contact diameters that can\nbe produced with a nano-wiring structure\nrange from 3 \u03bcm to several millimeters. The\nmaterials of these nano-wiring structures\nare usually made of copper, but can also\nbe made of gold, silver, nickel or platinum.\nOnce the nano-wiring structures have been\ncreated on the substrates, the user has\nvarious bonding methods at his disposal,\nfor which NanoWired has introduced\nthe process designations “Velcro-Welding,\nVelcro-Sintering, Velcro-Glueing”. If there\nare nano contacts on both workpieces to\ncontact, the joining process can take place\nat room temperature. Similar to Velcro, the\nnano structures form mechanical and thus\nalso electrical connections. With modified\njoining parameters (temperature and pressure),\nsystems can also be joined that have\nnano structures on only one side of the\ncontact. For chip structures on rigid systems,\nelectrical resistances of < 1 \u03bcOhm\/mm\u00b2 and thermal conductivities of 350 W\/mK\nwith strengths of up to 60 MPa were\nachieved. The contacting of thinned and\nthus bendable silicon chips naturally poses\na special challenge to the packaging technology,\nbut offers a variety of advantages\nfor hybrid integration. For example, facedown\nmounting of chips on the prepared\nfoil simplifies the process considerably,\nand time-consuming via etching processes\non the embedded chips are no longer\nnecessary. With the already proven small\ncontact sizes and pitches < 10 \u03bcm and low\ntemperature requirements, the nano-wired\ntechnology also enables the direct assembly\nof small chiplets with minimal structure\nsizes onto foil systems. When producing\nmedical catheters, minimal dimensions and\nthe size of these chiplets are also crucial.\nThe current project is therefore using a foil\nwith bending sensors for a catheter application\nto evaluate the technology. Initially,\nhowever, the partners will be working with\nthinned silicon chips that have a variety of\ndifferent contacts and test structures. Fig.\n2 shows such contact pads on these chips<\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t

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Fig. 2 Scanning electron microscope image of nanostructures\u00a0<\/em>on a thinned silicon chip<\/em><\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t

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\n\t\t\t\t\t\t\t\t\tthinned back to 30 \u03bcm after singulation. In \nFig. 3, the infrared transmitted-light image\nshows the connections joined to the foil\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t
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Fig. 3 Infrared image of a joined hybrid foil system with\u00a0<\/em>nano contacts.<\/em><\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t

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\n\t\t\t\t\t\t\t\t\tFoliensysteme werden die Prozessparameter\nsowie minimal erreichbare Strukturgr\u00f6\u00dfen\nund vor allem die Zuverl\u00e4ssigkeit der\nKontakte bei mechanischen und thermischen\nBelastungen ermittelt. Zum Projektabschluss\nam Jahresende wird dann ein Prozess zur\nHerstellung hybrider elektronischer Systeme\nmit Nanokontakten verf\u00fcgbar sein.\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t
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\n\t\t\t\t\t\t\t\t\tContact:
\nDr. Christine Harendt<\/strong>
\nPhone: +49 711 21855\u00a0 403
\nE-Mail harendt@ims-chips.de<\/a>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t
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Nano contacts are used to apply ultra-thin chips to flexible films like
\nVelcro. In cooperation with our partner NanoWired, the technology is being researched and tested for applications in flexible electronic systems for medical technology.<\/p>\n","protected":false},"author":1,"featured_media":9810,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[14],"tags":[],"class_list":["post-9808","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-newsletter-1-2022"],"yoast_head":"\nNano-HySiF \u2013 Nano contacts for flexible electronics - Institut f\u00fcr Mikroelektronik Stuttgart<\/title>\n<meta name=\"description\" content=\"Nano-HySiF \u2013Nano contacts for flexibleelectronics\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.ims-chips.com\/?p=9808\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Nano-HySiF \u2013 Nano contacts for flexible electronics - 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