IMS CHIPS is represented at the 10th IEEE Electronics System-Integration Technology Conference (IEEE ESTC 2024) with a poster and at the Heidelberg Instruments workshop with a presentation.
Development and Characterization of a Chip-Film Patch Interposer Integrating an Ultrathin Electrophysiology Chip Michael Kübler, Alexander Frank, Ulrike Passlack, Christine Harendt, Joachim N. Burghartz
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