German-Taiwanese Collaboration in Microelectronics: IMS CHIPS at the NSTC-BMFTR Annual Meeting 2026

International research partnerships thrive on direct exchange – and on opportunities to look beyond the scope of an individual project. At the NSTC-BMFTR Annual Meeting 2026, partners from Germany and Taiwan came together in Munich and Erlangen to present current research projects, exchange expertise, and explore new perspectives for collaboration in microelectronics.

IMS CHIPS attended together with Mark Lee from National Tsing Hua University (NTHU) as part of our joint TEDI-SPEC project. The meeting provided an opportunity to connect with partners across the participating projects while gaining insights into Germany’s research and semiconductor ecosystem. The program combined project presentations and networking with visits to leading research and industry organizations.

Among the stops was Infineon Technologies, where participants gained insights into current semiconductor developments and projects related to areas such as edge computing. The third day also included a visit to the Siemens Electronics Factory in Erlangen.

Meetings like this create valuable opportunities to connect expertise across borders, strengthen partnerships, and advance joint research and innovation.

Thank you to BMFTR, NSTC, and everyone involved for the excellent organization, valuable insights, and many opportunities for exchange.